METHOD FOR MANUFACTURING A PROTECTIVE LAYER AGAINST HF ETCHING, SEMICONDUCTOR DEVICE PROVIDED WITH THE PROTECTIVE LAYER AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE
    1.
    发明申请
    METHOD FOR MANUFACTURING A PROTECTIVE LAYER AGAINST HF ETCHING, SEMICONDUCTOR DEVICE PROVIDED WITH THE PROTECTIVE LAYER AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE 审中-公开
    用于制造抗蚀层的保护层的方法,用保护层提供的半导体器件及制造半导体器件的方法

    公开(公告)号:WO2013061313A1

    公开(公告)日:2013-05-02

    申请号:PCT/IB2012/055982

    申请日:2012-10-29

    Abstract: A method for manufacturing a protective layer (25) for protecting an intermediate structural layer (22) against etching with hydrofluoric acid (HP), the intermediate structural layer (22) being made of a material that can be etched or damaged by hydrofluoric acid, the method comprising the steps of: forming a first layer of aluminium oxide, by atomic layer deposition, on the intermediate structural layer (22); performing a thermal crystallization process on the first layer of aluminium oxide, forming a first intermediate protective layer (25a),- forming a second layer of aluminium oxide, by atomic layer deposition, above the first intermediate protective layer; and performing a thermal crystallisation process on the second layer of aluminium oxide, forming a second intermediate protective layer (25b) and thereby completing the formation of the protective layer (25). The method for forming the protective layer (25) can be used, for example, during the manufacturing steps of an inertial sensor such as a gyroscope or an accelerometer.

    Abstract translation: 一种用于制造用于保护中间结构层(22)以防止用氢氟酸(HP)蚀刻的保护层(25)的方法,所述中间结构层(22)由可被氢氟酸蚀刻或损坏的材料制成, 该方法包括以下步骤:通过原子层沉积在中间结构层(22)上形成第一氧化铝层; 在第一氧化铝层上进行热结晶处理,形成第一中间保护层(25a), - 通过原子层沉积形成第二层氧化铝,在第一中间保护层上方; 以及对所述第二氧化铝层进行热结晶处理,形成第二中间保护层(25b),从而完成所述保护层(25)的形成。 形成保护层(25)的方法可以用于例如陀螺仪或加速度计等惯性传感器的制造步骤。

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