公开(公告)号：WO2013064978A1

公开(公告)日：2013-05-10

申请号：PCT/IB2012/056021

申请日：2012-10-30

Applicant: STMICROELECTRONICS S.R.L.

Inventor： CAMPEDELLI, Roberto ,  PEZZUTO, Raffaella ,  LOSA, Stefano ,  MANTOVANI, Marco ,  AZPEITIA URQUIA, Mikel

IPC: B81B7/00 ,  B81B3/00

CPC classification number: B81B7/0006 ,  B81B3/0086 ,  B81B7/007 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2207/07 ,  B81B2207/097 ,  B81C1/00476 ,  H01L29/84

Abstract: A MEMS device (17) formed by a body (2); a cavity (25), extending above the body; mobile and fixed structures (18, 19) extending above the cavity and physically connected to the body via anchoring regions (16); and electrical-connection regions (10a, 10b, 10c), extending between the body (2) and the anchoring regions (16) and electrically connected to the mobile and fixed structures. The electrical-connection regions (10a, 10b, 10c) are formed by a conductive multilayer including a first semiconductor material layer (5), a composite layer (6) of a binary compound of the semiconductor material and of a transition metal, and a second semiconductor material layer (7).

Abstract translation: 由主体（2）形成的MEMS装置（17）; 在所述主体上方延伸的空腔（25）; 移动和固定结构（18,19），其延伸到空腔上方并经由锚定区域（16）物理连接到身体。 以及在主体（2）和锚固区域（16）之间延伸并且电连接到移动和固定结构的电连接区域（10a，10b，10c）。 电连接区域（10a，10b，10c）由包括第一半导体材料层（5），半导体材料的二元化合物和过渡金属的复合层（6）的导电性多层构成，以及 第二半导体材料层（7）。

公开(公告)号：WO2013061313A1

公开(公告)日：2013-05-02

申请号：PCT/IB2012/055982

申请日：2012-10-29

Applicant: STMICROELECTRONICS S.R.L.

Inventor： LOSA, Stefano ,  PEZZUTO, Raffaella ,  CAMPEDELLI, Roberto ,  AZPEITIA URQUIA, Mikel ,  PERLETTI, Matteo ,  ESPOSITO, Luigi

IPC: B81C1/00

CPC classification number: H01L21/02178 ,  B81B7/0032 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81C1/00595 ,  B81C1/00801 ,  B81C2201/014 ,  B81C2201/053 ,  H01L21/0228

Abstract: A method for manufacturing a protective layer (25) for protecting an intermediate structural layer (22) against etching with hydrofluoric acid (HP), the intermediate structural layer (22) being made of a material that can be etched or damaged by hydrofluoric acid, the method comprising the steps of: forming a first layer of aluminium oxide, by atomic layer deposition, on the intermediate structural layer (22); performing a thermal crystallization process on the first layer of aluminium oxide, forming a first intermediate protective layer (25a),- forming a second layer of aluminium oxide, by atomic layer deposition, above the first intermediate protective layer; and performing a thermal crystallisation process on the second layer of aluminium oxide, forming a second intermediate protective layer (25b) and thereby completing the formation of the protective layer (25). The method for forming the protective layer (25) can be used, for example, during the manufacturing steps of an inertial sensor such as a gyroscope or an accelerometer.

Abstract translation: 一种用于制造用于保护中间结构层（22）以防止用氢氟酸（HP）蚀刻的保护层（25）的方法，所述中间结构层（22）由可被氢氟酸蚀刻或损坏的材料制成， 该方法包括以下步骤：通过原子层沉积在中间结构层（22）上形成第一氧化铝层; 在第一氧化铝层上进行热结晶处理，形成第一中间保护层（25a）， - 通过原子层沉积形成第二层氧化铝，在第一中间保护层上方; 以及对所述第二氧化铝层进行热结晶处理，形成第二中间保护层（25b），从而完成所述保护层（25）的形成。 形成保护层（25）的方法可以用于例如陀螺仪或加速度计等惯性传感器的制造步骤。

公开(公告)号：EP4322410A1

公开(公告)日：2024-02-14

申请号：EP23188080.8

申请日：2023-07-27

Applicant: STMicroelectronics S.r.l.

Inventor： VERCESI, Federico ,  GATTERE, Gabriele ,  ALLEGATO, Giorgio ,  AZPEITIA URQUIA, Mikel ,  DANEI, Alessandro

IPC: H03K17/975

Abstract: A microelectromechanical button device (5) is provided with a detection structure (14) having: a substrate (22) of semiconductor material with a front surface (22a) and a rear surface (22b); a buried electrode (28) arranged on the substrate; a mobile electrode (32), arranged in a structural layer (30) overlying the substrate and elastically suspended above the buried electrode at a separation distance so as to form a detection capacitor (Cd); and a cap (46) coupled over the structural layer and having a first main surface (46a) facing the structural layer and a second main surface (46b) that is designed to be mechanically coupled to a deformable portion (3) of a case (2) of an electronic apparatus (1) of a portable or wearable type. The cap has, on its first main surface, an actuation portion (48) arranged over the mobile electrode and configured to cause, in the presence of a pressure applied on the second main surface, a deflection of the mobile electrode and its approach to the buried electrode, with a consequent capacitive variation of the detection capacitor, which is indicative of an actuation of the microelectromechanical button device.

公开(公告)号：EP3316597A1

公开(公告)日：2018-05-02

申请号：EP17172103.8

申请日：2017-05-20

Applicant: STMicroelectronics S.r.l.

Inventor： DUQI, Enri ,  AZPEITIA URQUIA, Mikel ,  BALDO, Lorenzo

IPC: H04R19/00 ,  H04R19/04

CPC classification number: B81B3/0021 ,  B81B7/0077 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2207/012 ,  B81C1/00158 ,  B81C1/00269 ,  H04R19/005 ,  H04R19/04

Abstract: Method of manufacturing a transducer module (10), comprising the steps of: forming, on a substrate (1), a first MEMS transducer (20), in particular a gyroscope, and a second MEMS transducer (30), in particular an accelerometer, having a suspended membrane (4a); forming, on the substrate (1), a conductive layer (4) and defining the conductive layer (4) in order to provide, simultaneously, at least one conductive strip (4c; 4d) electrically coupled to the first MEMS transducer (20) and the membrane (4a) of the second MEMS transducer (30).

Abstract translation: 一种制造换能器模块（10）的方法，包括以下步骤：在衬底（1）上形成第一MEMS换能器（20），特别是陀螺仪和第二MEMS换能器（30），特别是加速度计 ，具有悬浮膜（4a）; 在衬底（1）上形成导电层（4）并限定导电层（4），以便同时提供电耦合到第一MEMS换能器（20）的至少一个导电条（4c; 4d） 和第二MEMS换能器（30）的膜（4a）。

公开(公告)号：EP4109509A3

公开(公告)日：2023-04-19

申请号：EP22179407.6

申请日：2022-06-16

Applicant: STMicroelectronics S.r.l.

Inventor： AZPEITIA URQUIA, Mikel ,  TENTORI, Lorenzo

IPC: H01L21/78 ,  B81C1/00

Abstract: The semiconductor device comprises a die including a sidewall (150; 228; 238, 240, 242, 244; 258) having a uniform surface (186; 230; 238, 240; 260, 262) and an irregular surface (188: 232; 242, 244; 264),. The irregular surface has a more irregular texture as compared to the uniform surface. The die is obtained by pre-forming a cavity in a substrate and forming a multilayer structure on the substrate. The multilayer structure includes an active area that is aligned with and overlies the cavity. At least one recess is formed extending into the multilayer structure to the cavity. Forming the recess forms a die structure suspended above the cavity and an extension extending from the die structure to a suspension structure surrounding the die structure. The die structure is released from the die suspension structure by breaking the extension.

公开(公告)号：EP4273091A1

公开(公告)日：2023-11-08

申请号：EP23167983.8

申请日：2023-04-14

Applicant: STMicroelectronics S.r.l.

Inventor： AZPEITIA URQUIA, Mikel ,  DUQI, Enri ,  NICOLI, Silvia ,  CAMPEDELLI, Roberto ,  VARISCO, Igor ,  TENTORI, Lorenzo

IPC: B81B3/00 ,  B81C1/00

Abstract: MEMS structure (1), comprising: a semiconductor body (30); a cavity (20) buried in the semiconductor body (30); a membrane (10) suspended on the cavity (20); and at least one antistiction bump (11) completely contained in the cavity (20) with the function of preventing the side of the membrane internal to the cavity from sticking to the opposite side, which delimits the cavity downwardly.

公开(公告)号：EP4140942A1

公开(公告)日：2023-03-01

申请号：EP22190178.8

申请日：2022-08-12

Applicant: STMicroelectronics S.r.l.

Inventor： FERRARI, Paolo ,  VILLA, Flavio Francesco ,  CAMPEDELLI, Roberto ,  LAMAGNA, Luca ,  DUQI, Enri ,  AZPEITIA URQUIA, Mikel ,  NICOLI, Silvia ,  TURI, Maria Carolina

IPC: B81C1/00

Abstract: Method for manufacturing a micro-electro-mechanical device (30; 30'), comprising the steps of: forming, on a substrate (2), a first protection layer (5) of crystallized aluminum oxide, impermeable to HF; forming, on the first protection layer (5), a sacrificial layer (8, 8') of silicon oxide removable with HF; forming, on the sacrificial layer (8, 8'), a second protection layer (15) of crystallized aluminum oxide; exposing a sacrificial portion (8') of the sacrificial layer (8, 8'); forming, on the sacrificial portion (8'), a first membrane layer (20) of a porous material, permeable to HF; forming a cavity (22) by removing the sacrificial portion (8') through the first membrane layer (20); and sealing pores of the first membrane layer (20) by forming a second membrane layer (24) on the first membrane layer (20).

公开(公告)号：EP3872472A1

公开(公告)日：2021-09-01

申请号：EP21159179.7

申请日：2021-02-25

Applicant: STMicroelectronics S.r.l.

Inventor： AZPEITIA URQUIA, Mikel ,  ALLEGATO, Giorgio

IPC: G01L19/06

Abstract: A semiconductor device for ambient sensing including: a cap (18) traversed by a hole (25); and a main body (17) mechanically coupled to the cap (18) so as to delimit a cavity (20), which is interposed between the main body and the cap. The main body includes a semiconductor body (2) and a coupling structure (32; 132), which is interposed between the semiconductor body and the cap and laterally delimits a channel (35; CH1-CH8), which fluidically couples the cavity and the hole. The channel performs a mechanical filtering that is finer than the mechanical filtering performed by the hole.

公开(公告)号：EP4109509A2

公开(公告)日：2022-12-28

申请号：EP22179407.6

申请日：2022-06-16

Applicant: STMicroelectronics S.r.l.

Inventor： AZPEITIA URQUIA, Mikel ,  TENTORI, Lorenzo

IPC: H01L21/78 ,  B81C1/00

Abstract: The semiconductor device comprises a die including a sidewall (150; 228; 238, 240, 242, 244; 258) having a uniform surface (186; 230; 238, 240; 260, 262) and an irregular surface (188: 232; 242, 244; 264),. The irregular surface has a more irregular texture as compared to the uniform surface. The die is obtained by pre-forming a cavity in a substrate and forming a multilayer structure on the substrate. The multilayer structure includes an active area that is aligned with and overlies the cavity. At least one recess is formed extending into the multilayer structure to the cavity. Forming the recess forms a die structure suspended above the cavity and an extension extending from the die structure to a suspension structure surrounding the die structure. The die structure is released from the die suspension structure by breaking the extension.

公开(公告)号：EP3689816A1

公开(公告)日：2020-08-05

申请号：EP20153241.3

申请日：2020-01-22

Applicant: STMicroelectronics S.r.l.

Inventor： SEGHIZZI, Luca ,  MONTAGNA, Linda ,  VISALLI, Giuseppe ,  AZPEITIA URQUIA, Mikel

IPC: B81C1/00 ,  G02B26/08

Abstract: A method of manufacturing an integrated component (1), comprising the steps of: arranging a first wafer (100) of semiconductor material, having a surface (2a); arranging a second wafer (200) of semiconductor material, including a substrate (28) and a structural layer (32) on the substrate (28), the structural layer (32) integrating a detector device (26) for detecting electromagnetic radiation (R3); coupling the structural layer (32) of the second wafer (200) to the surface (2a) of the first wafer (100); and processing the substrate (28) of the second wafer (200) to form a stator (95), a rotor (94), and a mobile mass (93) of a micromirror (104), the stator (95) and the rotor (94) forming an assembly for capacitively driving the mobile mass (93).