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    PUCE DE CIRCUIT INTÉGRÉ PHOTONIQUE
    1.
    发明公开
    PUCE DE CIRCUIT INTÉGRÉ PHOTONIQUE 审中-公开

    公开(公告)号：EP3715925A1

    公开(公告)日：2020-09-30

    申请号：EP20163751.9

    申请日：2020-03-17

    Applicant: STMicroelectronics (Crolles 2) SAS ,  STMicroelectronics S.r.l.

    Inventor： BOEUF, Frederic ,  MAGGI, Luca

    IPC: G02B6/122 ,  G02B6/136 ,  G02B6/30 ,  G02B6/34 ,  H01L33/58 ,  H01L33/62 ,  G02B6/12 ,  G02B6/42

    Abstract: La présente description concerne une puce (1000) de circuit intégré photonique comprenant : une pluralité de coupleurs (18) à réseau de diffraction verticale définis dans une première couche semiconductrice (10) ou isolante surmontée d'une structure d'interconnexion (24) comprenant plusieurs niveaux de métal (M1, M2, M3, M4) noyés dans des deuxièmes couches isolantes (28A, 28B) ; et une cavité (200) s'étendant en profondeur à travers les deuxièmes couches isolantes (28A, 28B) jusqu'à un niveau intermédiaire entre les coupleurs (18) et le niveau de métal (M1) le plus proche des coupleurs (18), la cavité ayant des dimensions latérales telles que la cavité est adaptée à recevoir un bloc de maintien (302) d'un réseau de fibres optiques (304) destinées à être couplées optiquement avec les coupleurs (18).

    ASSEMBLY OF A SEMICONDUCTOR INTEGRATED DEVICE INCLUDING A MEMS ACOUSTIC TRANSDUCER
    2.
    发明申请
    ASSEMBLY OF A SEMICONDUCTOR INTEGRATED DEVICE INCLUDING A MEMS ACOUSTIC TRANSDUCER 审中-公开
    包含MEMS声学传感器的半导体集成器件的组装

    公开(公告)号：WO2013156539A1

    公开(公告)日：2013-10-24

    申请号：PCT/EP2013/058029

    申请日：2013-04-17

    Applicant: STMICROELECTRONICS S.R.L.

    Inventor： CONTI, Sebastiano ,  MAGGI, Luca

    IPC: H04R1/04 ,  H04R19/00 ,  H04R19/04

    CPC classification number: H04R1/04 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2924/15151 ,  H01L2924/16151 ,  H04R19/005 ,  H04R19/04 ,  H04R2201/003 ,  H01L2924/00014

    Abstract: In an assembly of a semiconductor integrated device (30), a package (32) has a base element (33) and a covering element (34) defining an internal space (35), an access opening (36) is provided through the covering element (34) for access to the internal space (35) from outside, and a MEMS acoustic transducer (20) is housed within the package (32) and includes a die (21) integrating a microelectromechanical sensing structure (1), defining a membrane (2) suspended over a cavity (6) and facing a rigid plate (3). The MEMS acoustic transducer (20) is set so that the die (21) is directly set between the access opening (36) and the internal space (35), defining an uninterrupted fluidic path including the access opening (36), the cavity (6), and the internal space (35). The semiconductor integrated device (30) includes a further MEMS sensor (44), with a die (45) integrating a respective microelectromechanical sensing structure (46) having a sensing element (64) set in fluid communication with the outside through the same fluidic path.

    Abstract translation: 在半导体集成装置（30）的组件中，封装（32）具有基部元件（33）和限定内部空间（35）的覆盖元件（34），通过覆盖物 元件（34），用于从外部进入内部空间（35），以及MEMS声学换能器（20）容纳在所述封装（32）内，并且包括集成微机电感测结构（1）的模具（21） 膜（2）悬挂在空腔（6）上并面向刚性板（3）。 MEMS声学换能器（20）被设置成使得模具（21）直接设置在进入开口（36）和内部空间（35）之间，限定了包括进入开口（36），空腔（36）的不间断流体路径 6）和内部空间（35）。 半导体集成器件（30）包括另外的MEMS传感器（44），其具有集成各自的微机电感测结构（46）的管芯（45），所述微机电感测结构（46）具有通过相同的流体路径与外部流体连通的传感元件（64） 。

    AN OPTO-MECHANICAL TRANSDUCER APPARATUS AND CORRESPONDING METHOD
    4.
    发明公开
    AN OPTO-MECHANICAL TRANSDUCER APPARATUS AND CORRESPONDING METHOD 审中-公开

    公开(公告)号：EP3919945A1

    公开(公告)日：2021-12-08

    申请号：EP21176460.0

    申请日：2021-05-28

    Applicant: STMicroelectronics S.r.l.

    Inventor： MAGGI, Luca ,  SHAW, Mark Andrew

    IPC: G02B3/00 ,  G02B7/00

    Abstract: An apparatus (10), comprising:
    an optically transparent substrate (18) having a first surface and a second surface opposed the first surface;
    a piezoelectric membrane (20) arranged at the first surface of the optically transparent substrate (18), the piezoelectric membrane (20) configured to oscillate as a result of light propagated through the optically transparent substrate (18) impinging onto the piezoelectric membrane (20), wherein at least one reflective facet (40) facing the optically transparent substrate (18) is provided at the piezoelectric membrane (20) ;
    an optical element (30) configured to receive a light beam at an input end and to guide the light beam towards an output end couplable to the second surface of the optically transparent substrate (18),
    The optical element (30) incorporates: a light focusing path (32) configured to focus (320) a light beam at a focal point (FP) at the piezoelectric membrane (20), and at least one light collimating path (34) configured to collimate the light beam onto the at least one reflective facet (40), wherein the optical element (30) is configured to guide light reflected (R, 31) from the at least one reflective facet (40) to the input end, wherein the light reflected (R, 31) to the input end is indicative of the position of the optical element (30) with respect to the focal point (FP).

    INTEGRATED ELECTRONIC MODULE INCLUDING TWO MICROMIRRORS, AND SYSTEM INCLUDING THE ELECTRONIC MODULE
    6.
    发明公开
    INTEGRATED ELECTRONIC MODULE INCLUDING TWO MICROMIRRORS, AND SYSTEM INCLUDING THE ELECTRONIC MODULE 审中-公开

    公开(公告)号：EP3974889A1

    公开(公告)日：2022-03-30

    申请号：EP21198930.6

    申请日：2021-09-24

    Applicant: STMicroelectronics S.r.l.

    Inventor： DEL SARTO, Marco ,  GRITTI, Alex ,  MAIERNA, Amedeo ,  MAGGI, Luca

    IPC: G02B26/08 ,  G02B26/10

    Abstract: An electronic module (30) comprising: a first die (35) of semiconductor material including a first reflector (10); a second die (36) of semiconductor material including a second reflector (20); and a frame (31) including a first supporting portion and a second supporting portion (32, 33) parallel to one another. The first and second dies (35, 36) are carried, respectively, by the first and second supporting portions (32, 33) and are respectively arranged so that the first reflector (10) faces the second supporting portion and the second reflector (20) faces the first supporting portion (32). An incoming light beam impinges upon the first reflector and is reflected on the second reflector so as to be supplied at output from the electronic module.

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