公开(公告)号：EP4545927A1

公开(公告)日：2025-04-30

申请号：EP24206565.4

申请日：2024-10-15

Applicant: STMicroelectronics International N.V.

Inventor： DANIELE, Filippo ,  DUQI, Enri ,  BALDO, Lorenzo

IPC: G01L9/00 ,  G01L13/02 ,  G01L19/06

Abstract: A pressure sensor (1) has a body (5) having a first chamber (12) and a second chamber (13) hermetically separated from the first chamber; a first detection structure (18) which is arranged in the first chamber (12), has a first deformable element (25) and a first buried cavity (24) within the first detection structure, wherein the first deformable element is configured to undergo a deformation as a function of a pressure difference between the first chamber and the first buried cavity. The sensor also has a second detection structure (19) which is arranged in the second chamber (13), has a second deformable element (32) and a second buried cavity (30) within the second detection structure, wherein the second deformable element is configured to undergo a deformation as a function of a pressure difference between the second chamber and the second buried cavity. The sensor also has a first channel (40) that extends into the body (5) and is configured to fluidically couple the first buried cavity (24) with the second chamber (13); and a second channel (41) that extends into the body (5) and is configured to fluidically couple the second buried cavity (30) to the first chamber (12).

公开(公告)号：EP4005972A1

公开(公告)日：2022-06-01

申请号：EP21211139.7

申请日：2021-11-29

Applicant: STMicroelectronics S.r.l. ,  STMicroelectronics International N.V.

Inventor： DUQI, Enri ,  BALDO, Lorenzo ,  FERRARI, Paolo ,  VIGNA, Benedetto ,  VILLA, Flavio Francesco ,  CASTOLDI, Laura Maria ,  GELMI, Ilaria

IPC: B81C1/00 ,  H04R1/08

Abstract: A semiconductor device includes: a substrate (2); a transduction microstructure (3) integrated in the substrate (2); a cap (5) joined to the substrate (2) and having a first face (5a) adjacent to the substrate (2) and a second, outer, face (5b); and a channel (15) extending through the cap (5) from the second face (5b) to the first face (5a) and communicating with the transduction microstructure (3). A protective membrane (17) made of porous polycrystalline silicon permeable to aeriform substances is set across the channel (15).