公开(公告)号：EP4553449A1

公开(公告)日：2025-05-14

申请号：EP24207769.1

申请日：2024-10-21

Applicant: STMicroelectronics International N.V.

Inventor： GATTERE, Gabriele ,  RIANI, Manuel

IPC: G01C19/5733 ,  B81B3/00 ,  G01C19/5769

Abstract: A microelectromechanical device (1) includes: a supporting body (2), containing semiconductor material; a movable mass (3), constrained to the supporting body (2) with a relative degree of freedom with respect to a first motion direction (D1) perpendicular to the supporting body (2); and at least one stopping structure (5), configured to limit out-of-plane movements of the movable mass (3) along the first motion direction (D1). The stopping structure (5) includes: first elements (6), extending parallel to the first motion direction (D1) and anchoring the stopping structure (5) to the supporting body (2); and a second element (7), extending transversally to the first elements (6), surmounting and connecting the first elements (6).

公开(公告)号：EP4549372A1

公开(公告)日：2025-05-07

申请号：EP24209213.8

申请日：2024-10-28

Applicant: STMicroelectronics International N.V.

Inventor： CORSO, Lorenzo ,  VERCESI, Federico ,  GATTERE, Gabriele ,  GUERRA, Anna ,  VALZASINA, Carlo ,  ALLEGATO, Giorgio

IPC: B81B7/00

Abstract: MEMS device (50) having a substrate (52) of semiconductor material; a first structural layer (54) of semiconductor material, on the substrate (52); a second structural layer (55) of semiconductor material, on the first structural layer (54); an active portion (83), accommodating active structures (85, 86) formed in the first structural layer (54) and/or in the second structural layer (55); a connection portion (56), accommodating a plurality of connection structures (57) and arranged laterally to the active portion (85, 86); and a plurality of conductive regions (60), arranged on the substrate (52) and extending between the active portion (85, 86) and the connection portion (56). Each connection structure (57) is formed by a first connection portion (57A), in electrical contact with a respective conductive region (60A) and formed in the first structural layer (54), and by a second connection portion (57B), on the first connection portion (57A) and in electrical continuity therewith, the second connection portion (57) formed in the second structural layer (55). The first connection portion (57A) has a greater thickness than the second connection portion (57B).

公开(公告)号：EP4467987A1

公开(公告)日：2024-11-27

申请号：EP24176349.9

申请日：2024-05-16

Applicant: STMicroelectronics International N.V.

Inventor： GARBARINO, Marco ,  GATTERE, Gabriele

IPC: G01P15/125 ,  G01P15/13 ,  G01P15/08

Abstract: A microelectromechanical accelerometer includes: a microstructure (2), having sensing terminals (11a, 11b) and driving terminals (12a, 12b) distinct from the sensing terminals (11a, 11b), a supporting body (4) and a movable mass (5), coupled to the supporting body (4) so as to be able to oscillate according to a sensing axis (X) with respect to a rest position, and a control unit (3). The movable mass (5) includes: a sensing structure (7) and a driving structure (10), respectively coupled to the sensing terminals (11a, 11b) and to the driving terminals (12a, 12b) through capacitive couplings (C S1 , C S2 , C D1 , C D2 ) variable as a function of displacements of the movable mass (5) from the rest position. The control unit (3) is coupled to the microstructure (2) so as to form a force feedback loop configured to maintain the movable mass (5) in the rest position. The sensing structure (7) and the driving structure (10) are electrically insulated and rigidly coupled with each other.