公开(公告)号：EP3076143A1

公开(公告)日：2016-10-05

申请号：EP15200458.6

申请日：2015-12-16

Applicant: STMicroelectronics S.r.l.

Inventor： VAIANA, Michele ,  CASELLA, Daniele ,  BRUNO, Giuseppe

IPC: G01K7/01 ,  G01K7/34

CPC classification number: G01K7/343 ,  G01K7/01 ,  G01K7/34

Abstract: A sensing element (25) is integrated in a semiconductor material chip (60) and has a sensing diode (3), of a junction type, configured to be reverse biased so that its junction capacitance is sensitive to the local temperature. A reading stage (28) is coupled to the sensing element for detecting variations of the junction capacitance of the sensing diode and outputting a reading acquisition signal proportional to the local temperature of the sensing diode. The sensing diode (3) has a cathode terminal (K) coupled to a biasing node (2) and an anode terminal (A) coupled to a first input (7) of the sensing stage (28). The biasing node (2) receives a voltage (DRH) positive with respect to the first input (7) of the sensing stage (28) for keeping the sensing diode reverse biased.

Abstract translation: 感测元件（25）集成在半导体材料芯片（60）中并且具有结型的感测二极管（3），其被配置为反向偏置，使得其结电容对于局部温度敏感。 读取级（28）耦合到感测元件，用于检测感测二极管的结电容的变化，并输出与感测二极管的局部温度成比例的读取采集信号。 感测二极管（3）具有耦合到偏置节点（2）的阴极端子（K）和耦合到感测级（28）的第一输入端（7）的阳极端子（A）。 偏置节点（2）接收相对于感测级（28）的第一输入端（7）为正的电压（DRH），用于保持感测二极管反向偏置。

公开(公告)号：EP4184137A3

公开(公告)日：2023-08-02

申请号：EP22201846.7

申请日：2022-10-17

Applicant: STMicroelectronics S.r.l.

Inventor： BRUNO, Giuseppe ,  LA MALFA, Antonella ,  ALESSI, Enrico Rosario ,  PASSANITI, Fabio

IPC: G01J5/00 ,  G01J5/02 ,  G01J5/04 ,  G01J5/70 ,  G01J5/80 ,  G01J5/0806 ,  G01J5/48

Abstract: A device (130) includes a sensor (200). The sensor includes a thermal infrared sensor or a sensor based on CMOS-SOI-MEMS technology, TMOS. The sensor is capable of performing at least two functions at the same time. The first is remote temperature measurement and the second is presence detection. The sensor passively collects infrared information and a microprocessor (210) coupled to the sensor (200) determines the temperature as well as presence.

公开(公告)号：EP3076143B1

公开(公告)日：2018-06-13

申请号：EP15200458.6

申请日：2015-12-16

Applicant: STMicroelectronics S.r.l.

Inventor： VAIANA, Michele ,  CASELLA, Daniele ,  BRUNO, Giuseppe

IPC: G01K7/01 ,  G01K7/34

CPC classification number: G01K7/343 ,  G01K7/01 ,  G01K7/34

Abstract: A sensing element (25) is integrated in a semiconductor material chip (60) and has a sensing diode (3), of a junction type, configured to be reverse biased so that its junction capacitance is sensitive to the local temperature. A reading stage (28) is coupled to the sensing element for detecting variations of the junction capacitance of the sensing diode and outputting a reading acquisition signal proportional to the local temperature of the sensing diode. The sensing diode (3) has a cathode terminal (K) coupled to a biasing node (2) and an anode terminal (A) coupled to a first input (7) of the sensing stage (28). The biasing node (2) receives a voltage (DRH) positive with respect to the first input (7) of the sensing stage (28) for keeping the sensing diode reverse biased.

公开(公告)号：EP3098195A1

公开(公告)日：2016-11-30

申请号：EP15200289.5

申请日：2015-12-15

Applicant: STMicroelectronics S.r.l.

Inventor： BRUNO, Giuseppe ,  CONTI, Sebastiano ,  CHIRICOSTA, Mario ,  VAIANA, Michele ,  IPPOLITO, Calogero Marco ,  MAIORE, Mario ,  CASELLA, Daniele

IPC: B81B7/00 ,  G01L19/00

CPC classification number: B81B7/007 ,  B81B7/02 ,  B81B2201/0264 ,  B81B2201/0292 ,  B81B2207/094 ,  G01L19/0092 ,  G01N27/223 ,  H01L23/3121 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A packaged sensor assembly includes: a packaging structure (2), having at least one opening (18); a humidity sensor (5) and a pressure sensor (10), which are housed inside the packaging structure (2) and communicate fluidically with the outside through the opening (18), and a control circuit (7), operatively coupled to the humidity sensor (5) and to the pressure sensor (10);
wherein the humidity sensor (5) and the control circuit (7) are integrated in a first chip (3), and the pressure sensor (10) is integrated in a second chip (8) distinct from the first chip (3) and bonded to the first chip (3).

Abstract translation: 包装传感器组件包括：具有至少一个开口（18）的包装结构（2）; 湿度传感器（5）和压力传感器（10），其容纳在所述包装结构（2）内并通过所述开口（18）与所述外部流体连通;以及控制电路（7），其可操作地耦合到所述湿度 传感器（5）和压力传感器（10）; 其中所述湿度传感器（5）和所述控制电路（7）集成在第一芯片（3）中，并且所述压力传感器（10）集成在与所述第一芯片（3）不同的第二芯片（8）中并且 到第一芯片（3）。

公开(公告)号：EP4184137A2

公开(公告)日：2023-05-24

申请号：EP22201846.7

申请日：2022-10-17

Applicant: STMicroelectronics S.r.l.

Inventor： BRUNO, Giuseppe ,  LA MALFA, Antonella ,  ALESSI, Enrico Rosario ,  PASSANITI, Fabio

IPC: G01J5/00 ,  G01J5/02 ,  G01J5/04 ,  G01J5/70 ,  G01J5/80 ,  G01J5/0806 ,  G01J5/48

Abstract: A device (130) includes a sensor (200). The sensor includes a thermal infrared sensor or a sensor based on CMOS-SOI-MEMS technology, TMOS. The sensor is capable of performing at least two functions at the same time. The first is remote temperature measurement and the second is presence detection. The sensor passively collects infrared information and a microprocessor (210) coupled to the sensor (200) determines the temperature as well as presence.

公开(公告)号：EP4006509A1

公开(公告)日：2022-06-01

申请号：EP21211154.6

申请日：2021-11-29

Applicant: STMicroelectronics S.r.l.

Inventor： BRUNO, Giuseppe ,  VAIANA, Michele ,  CASTAGNA, Maria Eloisa ,  RECCHIA, Angelo

IPC: G01J5/02 ,  G01J5/12 ,  G01J5/14 ,  G01J5/20 ,  H01L27/146

Abstract: A thermographic sensor (105) is proposed. The thermographic sensor (105) comprises one or more thermo-couples (305), each for providing a sensing voltage depending on a difference between a temperature of a hot joint (H) and a temperature of a cold joint (P-N) of the thermo-couple (305); the thermographic sensor (105) further comprises one or more sensing transistors (310), each driven according to the sensing voltages of one or more corresponding thermo-couples (305) for providing a sensing electrical signal depending on its temperature and on the corresponding sensing voltages. A thermographic device (100) comprising the thermographic sensor (105) and a corresponding signal processing circuit (110), and a system (700) comprising one or more thermographic devices (100) are also proposed.