公开(公告)号：EP3343266A1

公开(公告)日：2018-07-04

申请号：EP17172107.9

申请日：2017-05-20

Applicant: STMicroelectronics S.r.l.

Inventor： COSTANTINI, Sonia ,  CARMINATI, Marta ,  GATTI, Daniela Angela Luisa ,  CASTOLDI, Laura Maria ,  CARMINATI, Roberto

IPC: G02B26/08 ,  B81B7/00

CPC classification number: G02B26/0833 ,  B81B3/0083 ,  B81B2201/032 ,  B81B2201/042 ,  B81B2203/0307 ,  B81B2203/058 ,  B81C1/00714 ,  B81C2203/032 ,  G02B26/105

Abstract: The micro-electro-mechanical device (20) is formed in a first wafer (40) overlying and bonded to a second wafer (70). A fixed part (91), a movable part (92), and elastic elements, elastically coupling the movable part and the fixed part, are formed in the first wafer. The movable part carries actuation elements (60) configured to control a relative movement, such as a rotation, of the movable part with respect to the fixed part. The second wafer is bonded to the first wafer through projections (66) of the first wafer, formed by selectively removing part of a semiconductor layer (43). The composite wafer formed by the first and second wafers is cut to form a plurality of MEMS devices.

公开(公告)号：EP3839603A1

公开(公告)日：2021-06-23

申请号：EP20215784.8

申请日：2020-12-18

Applicant: STMicroelectronics S.r.l.

Inventor： SEGHIZZI, Luca ,  BONI, Nicolò ,  OGGIONI, Laura ,  CARMINATI, Roberto ,  CARMINATI, Marta

IPC: G02B26/08 ,  B81B3/00 ,  B81C1/00

Abstract: For manufacturing an optical microelectromechanical device (70), a first wafer (90) of semiconductor material having a first surface (100A) and a second surface (100B) is machined to form a suspended mirror structure (86), a fixed structure (74) surrounding the suspended mirror structure (86), elastic supporting elements (84A-84D) which extend between the fixed structure and the suspended mirror structure, and an actuation structure (83), coupled to the suspended mirror structure. A work wafer (10') is machined separately to form a second wafer (15) having a chamber (104) delimited by a bottom wall having a through opening (103). The second wafer is bonded to the first surface (100A) of the first wafer (90) in such a way that the chamber (104) overlies the actuation structure (83) and the through opening (103) is aligned to the suspended mirror structure (86). Furthermore, a third wafer (98) is bonded to the second surface (100B) of the first wafer to form a composite wafer device (112). The composite wafer device (112) is then diced to form an optical microelectromechanical device (70).

公开(公告)号：EP3392696A1

公开(公告)日：2018-10-24

申请号：EP18163484.1

申请日：2018-03-22

Applicant: STMicroelectronics S.r.l.

Inventor： CARMINATI, Roberto ,  COSTANTINI, Sonia ,  CARMINATI, Marta

IPC: G02B26/08 ,  G02B26/10

CPC classification number: G02B26/0833 ,  G02B26/08 ,  G02B26/0816 ,  G02B26/10 ,  G02B26/105

Abstract: Oscillating structure (10; 30) including first and second torsional elastic elements (12b, 12c) defining an axis of rotation (O), and a moving element (12a) interposed between the first and second torsional elastic elements (12b, 12c), the moving element being rotary about an axis of rotation (O) as a result of a twisting of the first and second torsional elastic elements. The moving element (12a), the first torsional elastic element (12b) and the second torsional elastic element (12c) lie in a first plane and are not in direct contact with one another. The moving element (12a), the first torsional elastic element (12b) and the second torsional elastic element (12c) are mechanically coupled together using the coupling structure (20; 32) and lie in a second plane different to the first plane.