公开(公告)号：EP3343266A1

公开(公告)日：2018-07-04

申请号：EP17172107.9

申请日：2017-05-20

Applicant: STMicroelectronics S.r.l.

Inventor： COSTANTINI, Sonia ,  CARMINATI, Marta ,  GATTI, Daniela Angela Luisa ,  CASTOLDI, Laura Maria ,  CARMINATI, Roberto

IPC: G02B26/08 ,  B81B7/00

CPC classification number: G02B26/0833 ,  B81B3/0083 ,  B81B2201/032 ,  B81B2201/042 ,  B81B2203/0307 ,  B81B2203/058 ,  B81C1/00714 ,  B81C2203/032 ,  G02B26/105

Abstract: The micro-electro-mechanical device (20) is formed in a first wafer (40) overlying and bonded to a second wafer (70). A fixed part (91), a movable part (92), and elastic elements, elastically coupling the movable part and the fixed part, are formed in the first wafer. The movable part carries actuation elements (60) configured to control a relative movement, such as a rotation, of the movable part with respect to the fixed part. The second wafer is bonded to the first wafer through projections (66) of the first wafer, formed by selectively removing part of a semiconductor layer (43). The composite wafer formed by the first and second wafers is cut to form a plurality of MEMS devices.

公开(公告)号：EP4005972A1

公开(公告)日：2022-06-01

申请号：EP21211139.7

申请日：2021-11-29

Applicant: STMicroelectronics S.r.l. ,  STMicroelectronics International N.V.

Inventor： DUQI, Enri ,  BALDO, Lorenzo ,  FERRARI, Paolo ,  VIGNA, Benedetto ,  VILLA, Flavio Francesco ,  CASTOLDI, Laura Maria ,  GELMI, Ilaria

IPC: B81C1/00 ,  H04R1/08

Abstract: A semiconductor device includes: a substrate (2); a transduction microstructure (3) integrated in the substrate (2); a cap (5) joined to the substrate (2) and having a first face (5a) adjacent to the substrate (2) and a second, outer, face (5b); and a channel (15) extending through the cap (5) from the second face (5b) to the first face (5a) and communicating with the transduction microstructure (3). A protective membrane (17) made of porous polycrystalline silicon permeable to aeriform substances is set across the channel (15).