Abstract:
The MOS-type power device (1) has a drain terminal (4), a source terminal (3), and a gate terminal (2), and comprises a protection circuit (11) having a first conduction terminal connected to the gate terminal (2), via a diffused resistor (5), and a second conduction terminal connected to the source terminal (3). The protection circuit (11) has a resistance variable between a first value and a second value according to the operating condition of the power device (1). A first embodiment of the protection circuit (11) comprises an ON-OFF switch (12) made by means of a horizontal MOS transistor which has a control terminal connected to the drain terminal (4) of the power device (1). A second embodiment of the protection circuit (11) envisages the replacement of the ON-OFF switch (12) with a gradual-intervention switch (23) made by means of a P-channel JFET transistor having a control terminal connected to the gate terminal (2) of the power device (1).
Abstract:
Semiconductor device for high voltages comprising at least one power component (21) and at least one edge termination (100). Said edge termination (100) comprises a voltage divider including a plurality of capacitors (C7, C8, C9, C10, C11, C12) in series, which are formed by couples of said capacitors (C7, C8, C9, C10, C11, C12) formed by metal layers (71; 72) of a first level and polysilicon layers (11) of a second level interposed from a dielectric layer (8) underlying said metal layers (71; 72). The metal layers (71; 72) are alternated to said polysilicon layers (11) but extend in part over a zone of said dielectric layer (8) superimposed on said polysilicon layers (11). The edge termination (100) is connected between non-driveable terminals of said power component (21).
Abstract:
Semiconductor device for high voltages comprising at least one power component (21), e.g. a power MOSFET, and at least one edge termination (100). Said edge termination (100) comprises a voltage divider including a plurality of diode-connected MOS transistors (31;32;33;34) in series, said edge termination (100) being connected between current-carrying, main terminals of said power component (21).
Abstract:
A MOS-technology power device integrated structure comprises a plurality of elementary functional units formed in a semiconductor material layer (3) of a first conductivity type. The elementary functional units comprise body stripes (9;90) of a second conductivity type extending substantially parallely to each other and source regions (14;140) of the first conductivity type. A conductive gate layer (17;170) is insulatively disposed over the semiconductor material layer (3) between the body stripes (9;90). A mesh (4;40) of the second conductivity type is formed in the semiconductor material layer (3) and comprises an annular frame region (5;50) surrounding the plurality of body stripes (9;90) and at least one first elongated stripe (7;60) extending within the annular frame region (5;50) in a direction substantially orthogonal to the body stripes (9;90) and merged with the annular frame region (5;50), the body stripes (9;90) being divided by the first elongated stripe (7;60) in two respective groups and being merged with the mesh (4;40). A conductive gate finger (25;250) connected to said conductive gate layer (17;170) insulatively extends over the first elongated stripe (7;60). Source metal plates (20;200) are provided covering each group of parallel body stripes and contacting each body stripe of the group. The conductive gate finger (25;250) is covered and contacted by a respective metal gate finger (27;270).