Power device with protection against undesirable self-activation
    2.
    发明公开
    Power device with protection against undesirable self-activation 有权
    Leistungsvorrichtung mit Schutz gegenunerwünschteSelbstaktivierung

    公开(公告)号:EP1119104A1

    公开(公告)日:2001-07-25

    申请号:EP00830028.7

    申请日:2000-01-20

    CPC classification number: H03K17/0822 H03K17/08122

    Abstract: The MOS-type power device (1) has a drain terminal (4), a source terminal (3), and a gate terminal (2), and comprises a protection circuit (11) having a first conduction terminal connected to the gate terminal (2), via a diffused resistor (5), and a second conduction terminal connected to the source terminal (3). The protection circuit (11) has a resistance variable between a first value and a second value according to the operating condition of the power device (1). A first embodiment of the protection circuit (11) comprises an ON-OFF switch (12) made by means of a horizontal MOS transistor which has a control terminal connected to the drain terminal (4) of the power device (1). A second embodiment of the protection circuit (11) envisages the replacement of the ON-OFF switch (12) with a gradual-intervention switch (23) made by means of a P-channel JFET transistor having a control terminal connected to the gate terminal (2) of the power device (1).

    Abstract translation: MOS型功率器件(1)具有漏极端子(4),源极端子(3)和栅极端子(2),并且包括保护电路(11),其具有连接到栅极端子 (2),经由扩散电阻(5)和连接到源极端子(3)的第二导电端子。 根据功率器件(1)的工作状态,保护电路(11)具有在第一值和第二值之间的电阻变化。 保护电路(11)的第一实施例包括通过水平MOS晶体管制成的导通断开关(12),其具有连接到功率器件(1)的漏极端子(4)的控制端子。 保护电路(11)的第二实施例设想用通过具有连接到栅极端子的控制端子的P沟道JFET晶体管制成的逐步干预开关(23)来替换导通开关(12) (1)的电源(2)。

    Edge termination of semiconductor devices for high voltages with capacitive voltage divider
    3.
    发明公开
    Edge termination of semiconductor devices for high voltages with capacitive voltage divider 有权
    兰德布鲁斯·冯·霍斯波恩斯·哈利伯特·巴伦

    公开(公告)号:EP1058315A1

    公开(公告)日:2000-12-06

    申请号:EP99830340.8

    申请日:1999-06-03

    CPC classification number: H01L29/404 H01L27/0629

    Abstract: Semiconductor device for high voltages comprising at least one power component (21) and at least one edge termination (100). Said edge termination (100) comprises a voltage divider including a plurality of capacitors (C7, C8, C9, C10, C11, C12) in series, which are formed by couples of said capacitors (C7, C8, C9, C10, C11, C12) formed by metal layers (71; 72) of a first level and polysilicon layers (11) of a second level interposed from a dielectric layer (8) underlying said metal layers (71; 72). The metal layers (71; 72) are alternated to said polysilicon layers (11) but extend in part over a zone of said dielectric layer (8) superimposed on said polysilicon layers (11). The edge termination (100) is connected between non-driveable terminals of said power component (21).

    Abstract translation: 用于高电压的半导体器件包括至少一个功率部件(21)和至少一个边缘终端(100)。 所述边缘终端(100)包括分压器,其包括串联的多个电容器(C7,C8,C9,C10,C11,C12),所述电容器由所述电容器(C7,C8,C9,C10,C11, 由第一级的金属层(71; 72)形成的第二层的第二层(11)和从第一层的介电层(8)介入的第二层的多晶硅层(11)形成。 金属层(71; 72)与所述多晶硅层(11)交替,但部分地跨越叠加在所述多晶硅层(11)上的所述介电层(8)的区域。 边缘终端(100)连接在所述功率部件(21)的不可驱动端子之间。

    Power semiconductor device having an edge termination structure comprising a voltage divider
    5.
    发明公开
    Power semiconductor device having an edge termination structure comprising a voltage divider 有权
    Leistungshalbleiteranordnung mit einer Randabschlussstruktur mit einem Spannungsteiler

    公开(公告)号:EP1058318A1

    公开(公告)日:2000-12-06

    申请号:EP99830339.0

    申请日:1999-06-03

    CPC classification number: H01L29/404 H01L27/088 H01L29/7811

    Abstract: Semiconductor device for high voltages comprising at least one power component (21), e.g. a power MOSFET, and at least one edge termination (100). Said edge termination (100) comprises a voltage divider including a plurality of diode-connected MOS transistors (31;32;33;34) in series, said edge termination (100) being connected between current-carrying, main terminals of said power component (21).

    Abstract translation: 用于高电压的半导体器件包括至少一个功率部件(21),例如, 功率MOSFET和至少一个边缘终端(100)。 所述边缘终端(100)包括一个分压器,包括串联的多个二极管连接的MOS晶体管(31; 32; 33; 34),所述边缘终端(100)连接在所述功率部件的载流主端子 (21)。

    MOS-technology power device integrated structure
    7.
    发明授权
    MOS-technology power device integrated structure 失效
    在集成结构MOS技术功率器件

    公开(公告)号:EP0782201B1

    公开(公告)日:2000-08-30

    申请号:EP95830542.7

    申请日:1995-12-28

    Abstract: A MOS-technology power device integrated structure comprises a plurality of elementary functional units formed in a semiconductor material layer (3) of a first conductivity type. The elementary functional units comprise body stripes (9;90) of a second conductivity type extending substantially parallely to each other and source regions (14;140) of the first conductivity type. A conductive gate layer (17;170) is insulatively disposed over the semiconductor material layer (3) between the body stripes (9;90). A mesh (4;40) of the second conductivity type is formed in the semiconductor material layer (3) and comprises an annular frame region (5;50) surrounding the plurality of body stripes (9;90) and at least one first elongated stripe (7;60) extending within the annular frame region (5;50) in a direction substantially orthogonal to the body stripes (9;90) and merged with the annular frame region (5;50), the body stripes (9;90) being divided by the first elongated stripe (7;60) in two respective groups and being merged with the mesh (4;40). A conductive gate finger (25;250) connected to said conductive gate layer (17;170) insulatively extends over the first elongated stripe (7;60). Source metal plates (20;200) are provided covering each group of parallel body stripes and contacting each body stripe of the group. The conductive gate finger (25;250) is covered and contacted by a respective metal gate finger (27;270).

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