Abstract:
A semiconductor memory comprises a plurality of memory cells (MC), for example Flash memory cells, arranged in a plurality of lines (LBL), and a plurality of memory cell access signal lines (MBL), each one associated with at least one respective line of memory cells, for accessing the memory cells of the at least one respective line of memory cells; each signal line has a capacitance (CMBL) intrinsically associated therewith. A plurality of volatile memory cells is provided, each having a capacitive storage element. Each volatile memory cell is associated with a respective signal line, and the respective capacitive storage element formed by the capacitance intrinsically associated with the respective signal lines. In particular, the parasitic capacitances associated with bit lines of a matrix of memory cells can be exploited as capacitive storage elements.
Abstract:
A method of programming an electrically programmable memory comprises applying at least one first programming pulse to a group of memory cells ( MC1-MCk ) of the memory, accessing the memory cells of the group to ascertain a programming state thereof, and applying at least one second programming pulse to those memory cells in the group whose programming state is not ascertained to correspond to a desired programming state. A voltage applied to a control electrode of the memory cells is varied between the at least one first programming pulse and the at least one second programming pulse according to a forecasted change in biasing conditions of the memory cells in the group between said at least one first and at least one second programming pulses. Undesired over-programming of the memory cells is thus avoided.
Abstract:
A sensing circuit for sensing semiconductor memory cells ( MC,m ), comprising: at least one first circuit branch ( 120a ) adapted to be operatively coupled to a respective memory cell to be sensed, so as to be run through by a current ( I,m ) corresponding to a memory cell state; a feedback-controlled circuit element ( N41a ) in the first circuit branch, for controlling a memory cell access voltage; a current-to-voltage conversion circuit ( N41a ) in the first branch, adapted to convert said current into a correspondent converted voltage signal, indicative of the memory cell state, and at least one comparator ( 125 ) for comparing the converted voltage signal with a comparison voltage, for discriminating among at least two different states of the memory cell. The converted voltage signal corresponds to a control signal of the feedback-controlled circuit element.
Abstract:
A semiconductor memory comprises a plurality of memory cells (MC), for example Flash memory cells, arranged in a plurality of lines (LBL), and a plurality of memory cell access signal lines (MBL), each one associated with at least one respective line of memory cells, for accessing the memory cells of the at least one respective line of memory cells; each signal line has a capacitance (CMBL) intrinsically associated therewith. A plurality of volatile memory cells is provided, each having a capacitive storage element. Each volatile memory cell is associated with a respective signal line, and the respective capacitive storage element formed by the capacitance intrinsically associated with the respective signal lines. In particular, the parasitic capacitances associated with bit lines of a matrix of memory cells can be exploited as capacitive storage elements.
Abstract:
A method of programming an electrically programmable memory comprises applying at least one first programming pulse to a group of memory cells ( MC1-MCk ) of the memory, accessing the memory cells of the group to ascertain a programming state thereof, and applying at least one second programming pulse to those memory cells in the group whose programming state is not ascertained to correspond to a desired programming state. A voltage applied to a control electrode of the memory cells is varied between the at least one first programming pulse and the at least one second programming pulse according to a forecasted change in biasing conditions of the memory cells in the group between said at least one first and at least one second programming pulses. Undesired over-programming of the memory cells is thus avoided.
Abstract:
A trimming structure for trimming functional parameters of an Integrated Circuit - IC - (100) comprising a first (115a) and at least one second functional blocks (115b,...,115n) with which a first (Vrg,a) and at least one second IC functional parameters (Vrg,b,...,Vrg,n) are respectively associated. The trimming structure comprises respective trimmable circuit structures (205a,210a,...,205n,210n) included in the first and at least one second functional blocks, and trimming configuration storage means (110) for storing trimming configurations for the trimmable circuit structures. The trimming configuration storage means are such that a change in the trimming configuration for the trimmable circuit structure of the first functional block causes a corresponding change in the trimming configuration for the trimmable circuit structure of the at least one second functional block. In addition, the trimmable circuit structures are such that a change in the at least one second IC functional parameter in response to the corresponding change in the trimming configuration for the trimmable structure of the at least one second functional block is proportional to the change in the first IC functional parameter consequent to the change in the trimming configuration for the trimmable circuit structure of the first functional block.