公开(公告)号：EP2538761B1

公开(公告)日：2014-01-29

申请号：EP12169046.5

申请日：2012-05-23

Applicant: STMicroelectronics S.r.l.

Inventor： Lo Presti, Matteo ,  Abbate, Nunzio ,  Minotti, Agatino ,  Di Guardo, Mario

IPC: H05K1/14 ,  H05K3/32 ,  H05K3/30 ,  H05K1/18 ,  H01L23/538 ,  H01L25/03 ,  H05K5/02 ,  H01L23/498 ,  H01L23/373 ,  H05K7/14

CPC classification number: H05K3/325 ,  H01L23/3735 ,  H01L23/49811 ,  H01L25/162 ,  H01L2224/48091 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H05K1/145 ,  H05K3/308 ,  H05K7/1432 ,  Y10T29/49002 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The invention relates to an Intelligent Power Module (101; 201) of the comprising at least a power circuit board (102; 202) comprising a plurality of power devices (103; 203) and being fixed on a base plate (109; 209) of a case body (110; 210) able to be closed with a lid (111; 211) to form a protective case (100; 200) of the Intelligent Power Module (101; 201), and a control circuit board (105; 205, 305) being suitable to drive the power devices (103; 203) of the power circuit board (102; 202). The control circuit board (105; 205, 305) is suitably associate to the lid (111, 211) in such a way that the control circuit board (105; 205, 305) is comprised within the case body (110; 210) when the lid (111; 211) close it, the control circuit board (105; 205, 305) associated with the lid (111; 211) thus realising an intelligent lid of the Intelligent Power Module (101; 201).

公开(公告)号：EP1603157B1

公开(公告)日：2008-01-09

申请号：EP04425399.5

申请日：2004-05-31

Applicant: STMicroelectronics S.r.l.

Inventor： Ferrara, Maurizio Maria ,  Magri', Angelo ,  Minotti, Agatino

IPC: H01L23/31

CPC classification number: H01L24/84 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/0603 ,  H01L2224/16245 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/40091 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/48247 ,  H01L2224/73221 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/12032 ,  H01L2924/13055 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

公开(公告)号：EP2538761A1

公开(公告)日：2012-12-26

申请号：EP12169046.5

申请日：2012-05-23

Applicant: STMicroelectronics S.r.l.

Inventor： Lo Presti, Matteo ,  Abbate, Nunzio ,  Minotti, Agatino ,  Di Guardo, Mario

IPC: H05K1/14 ,  H05K3/32 ,  H05K3/30 ,  H05K1/18 ,  H01L23/538 ,  H01L25/03 ,  H05K5/02

CPC classification number: H05K3/325 ,  H01L23/3735 ,  H01L23/49811 ,  H01L25/162 ,  H01L2224/48091 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H05K1/145 ,  H05K3/308 ,  H05K7/1432 ,  Y10T29/49002 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The invention relates to an Intelligent Power Module (101; 201) of the comprising at least a power circuit board (102; 202) comprising a plurality of power devices (103; 203) and being fixed on a base plate (109; 209) of a case body (110; 210) able to be closed with a lid (111; 211) to form a protective case (100; 200) of the Intelligent Power Module (101; 201), and a control circuit board (105; 205, 305) being suitable to drive the power devices (103; 203) of the power circuit board (102; 202). The control circuit board (105; 205, 305) is suitably associate to the lid (111, 211) in such a way that the control circuit board (105; 205, 305) is comprised within the case body (110; 210) when the lid (111; 211) close it, the control circuit board (105; 205, 305) associated with the lid (111; 211) thus realising an intelligent lid of the Intelligent Power Module (101; 201).

Abstract translation: 本发明涉及一种智能功率模块（101; 201），其包括至少一个包括多个功率器件（103; 203）并且被固定在基板（109; 209）上的电源电路板（102; 202） 能够用盖子（111; 211）关闭以形成智能功率模块（101; 201）的保护壳体（100; 200）的壳体（110; 210）和控制电路板（105; 205,305）适于驱动电力电路板（102; 202）的功率器件（103; 203）。 控制电路板（105; 205,305）适当地与盖（111,211）相关联，使得控制电路板（105; 205,305）包括在壳体（110; 210）内，当 盖（111; 211）关闭，与盖（111; 211）相关联的控制电路板（105; 205,305）从而实现智能功率模块（101; 201）的智能盖。

公开(公告)号：EP1641035A1

公开(公告)日：2006-03-29

申请号：EP04425716.0

申请日：2004-09-27

Applicant: STMicroelectronics S.r.l.

Inventor： Minotti, Agatino

IPC: H01L21/60

CPC classification number: H01L24/40 ,  H01L21/50 ,  H01L23/10 ,  H01L23/492 ,  H01L23/49827 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/16 ,  H01L2224/32245 ,  H01L2224/40225 ,  H01L2224/73153 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/16315 ,  H01L2924/166 ,  H01L2924/181 ,  H05K1/0203 ,  H05K2201/10659 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401 ,  H01L2224/37099

Abstract: The present invention relates to a mounting method, on printed circuit boards, electronic components integrated on semiconductor dies wherein an insulating and protecting layer is provided between die and board with passage openings of electric contacts which allow the welding of contact pads of the die with ends of the printed circuit board.

Abstract translation: 本发明涉及一种安装方法，在印刷电路板上，集成在半导体绝缘和保护层的本worin电子元件在与基板之间设置有电接触，其允许与端部的管芯的接触焊盘的焊接的通道开口 的印刷电路板。

公开(公告)号：EP1603157A1

公开(公告)日：2005-12-07

申请号：EP04425399.5

申请日：2004-05-31

Applicant: STMicroelectronics S.r.l.

Inventor： Ferrara, Maurizio Maria ,  Magri', Angelo ,  Minotti, Agatino

IPC: H01L23/31

CPC classification number: H01L24/84 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/0603 ,  H01L2224/16245 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/40091 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/48247 ,  H01L2224/73221 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/12032 ,  H01L2924/13055 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A vertical conduction power electronic device package (1) and corresponding assembly method comprising at least a metal frame (2) suitable to house at least a plate or first semiconductor die (16,35) having at least a first (17) and a second conduction terminal (18) on respective opposed sides of the first die (16,35). The first conduction terminal (17) being in contact with said metal frame (2) and comprising at least an intermediate frame (23,24) arranged in contact with said second conduction terminal (18).

Abstract translation: 一种垂直传导电力电子器件封装（1）和相应的组装方法，包括至少一个适合于容纳至少具有至少第一（17）和第二（17））的板或第一半导体管芯（16,35）的金属框架（2） 在第一管芯（16,35）的相对的相对侧上的导电端子（18）。 所述第一导电端子（17）与所述金属框架（2）接触，并且至少包括与所述第二导电端子（18）接触布置的中间框架（23,24）。