公开(公告)号：EP2958144A1

公开(公告)日：2015-12-23

申请号：EP15172272.5

申请日：2015-06-16

Applicant: STMicroelectronics S.r.l.

Inventor： Palumbo, Vincenzo ,  Ghidini, Gabriella ,  Carollo, Enzo ,  Toia, Fabrizio Fausto Renzo

IPC: H01L27/08 ,  H01L23/522 ,  H01F17/00 ,  H01F27/28 ,  H01L23/64

CPC classification number: H01F27/32 ,  H01F27/2804 ,  H01F27/323 ,  H01F41/063 ,  H01F2027/2809 ,  H01L23/5227 ,  H01L23/645 ,  H01L27/08 ,  H01L2924/0002 ,  Y10T29/49021 ,  H01L2924/00

Abstract: An integrated transformer (105; 205) integrated transformer comprises a primary winding (135) and a secondary winding (140), of metallic material and having a spiral planar arrangement comprising a corresponding plurality of coils (137; 142). A dielectric portion (145) of dielectric material is arranged between the primary winding and the secondary winding. A field plate winding (150) is electrically coupled with the primary winding. The field plate winding comprises at least one field plate coil (152a) having a lateral extension ( xa ) greater than a lateral extension (xb) of a primary outer coil (137a) of the primary winding with the at least one field plate coil superimposed, in plan view, to the primary outer coil of the primary winding. The field plate winding is configured to mutually separate equipotential surfaces of an operating electric field ( E1; E2 ) at a secondary winding facing edge (139) of the primary outer coil of the primary winding.

Abstract translation: 集成变压器（105; 205）集成变压器包括金属材料的初级绕组（135）和次级绕组（140），并具有包括相应的多个线圈（137,142）的螺旋平面布置。 电介质材料的电介质部分（145）布置在初级绕组和次级绕组之间。 场板绕组（150）与初级绕组电耦合。 场板绕组包括至少一个场板线圈（152a），其具有大于初级绕组的初级外线圈（137a）的横向延伸（xb）的横向延伸（xa），所述初级绕组的主外部线圈（137a）与所述至少一个场板线圈叠加 在平面图中，连接到初级绕组的初级外部线圈。 场板绕组构造成在初级绕组的初级外部线圈的次级绕组面对边缘（139）处相互分离的工作电场（E1; E2）的等电位表面。

公开(公告)号：EP1873822A1

公开(公告)日：2008-01-02

申请号：EP06116133.7

申请日：2006-06-27

Applicant: STMicroelectronics S.r.l.

Inventor： Montanini, Pietro ,  Toia, Fabrizio Fausto Renzo ,  Mottura, Marta

IPC: H01L21/762

CPC classification number: H01L21/84 ,  H01L21/743 ,  H01L21/76283 ,  H01L21/76898 ,  H01L27/1203 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An electronic device (100, 100', 760) is proposed. The device is integrated in a chip (705) including at least one stacked layer having a front surface (140, 708) and a rear surface (743) opposite the front surface, the device including: an insulating trench (120,120', 718) insulating an active region (125, 747) of the chip, the insulating trench having a section across each plane parallel to the front surface extending along a longitudinal line (207, 207'), and a front-rear contact (430,436, 440) electrically contacting the front surface to the rear surface in the active region, wherein the section of the insulating trench has a non-uniform width along the longitudinal line, and/or the device further includes at least one further insulating trench (170) within the active region.

Abstract translation: 一种电子装置（100，100”，760）的提议。 该装置被集成在一个芯片（705）包括具有前表面（140，708）的至少一个堆叠层和后表面（743）与前表面相对，该装置包括：一个绝缘槽（120,120”，718） 绝缘的芯片，具有横跨每一个部分中的绝缘沟槽，并平行于前表面沿纵向线（207“207）（430.436，440）延伸的前，后接触面的有源区（125，747） 电接触的前表面到后表面在有源区，worin绝缘沟槽的部分具有沿着所述纵向线的非均匀的宽度，和/或该设备进一步包括至少一个另外的内绝缘沟槽（170） 有源区。