公开(公告)号：WO2013030798A1

公开(公告)日：2013-03-07

申请号：PCT/IB2012/054497

申请日：2012-08-31

Applicant: STMicroelectronics S.r.l. ,  POLITECNICO DI MILANO ,  COMI, Claudia ,  CORIGLIANO, Alberto ,  ZERBINI, Sarah

Inventor： COMI, Claudia ,  CORIGLIANO, Alberto ,  ZERBINI, Sarah

IPC: G01P15/097

CPC classification number: G01P15/0975 ,  G01P15/097

Abstract: A detection, structure (1) for a z-axis resonant accelerometer (24) is provided with an inertial mass (2) anchored to a substrate (20) by means of elastic anchorage elements (6) so as to be suspended above the substrate (20) and perform an inertial movement of rotation about a first axis of rotation (A) belonging to a plane (xy) of main extension of the inertial mass (2), in response to an external acceleration (a-) acting along a vertical axis (z) transverse with respect to the plane (xy); and a first resonator element (10a) and a second resonator element (10b), which are mechanically coupled to the inertial mass (2) by respective elastic supporting elements (16), which enable a movement of rotation about a second axis of rotation (B) and a third axis of rotation (C), in a resonance condition. In particular, the second axis of rotation (B) and the third axis of rotation (C) are parallel to one another, and are moreover parallel to the first axis of rotation (A) of the inertial mass (2).

Abstract translation: 用于z轴共振加速度计（24）的检测结构（1）具有通过弹性锚定元件（6）锚定到基底（20）上的惯性质量块（2），以悬浮在基底上方 （20），并且响应于沿着惯性质量（2）的主延伸的平面（xy）的旋转的第一旋转轴线（A），沿着沿着惯性质量 垂直轴（z）相对于平面（xy）横向; 以及通过相应的弹性支撑元件（16）机械耦合到惯性块（2）的第一谐振器元件（10a）和第二谐振元件（10b），其使得能够围绕第二旋转轴线旋转 B）和第三旋转轴（C）。 特别地，第二旋转轴线（B）和第三旋转轴线（C）彼此平行，并且平行于惯性质量块（2）的第一旋转轴线（A）。

公开(公告)号：EP3882640A1

公开(公告)日：2021-09-22

申请号：EP21162249.3

申请日：2021-03-12

Applicant: STMicroelectronics S.r.l.

Inventor： RIZZINI, Francesco ,  GATTERE, Gabriele ,  ZERBINI, Sarah

IPC: G01P15/08 ,  G01P15/18 ,  B81B3/00 ,  G01C19/5733 ,  G01P15/125

Abstract: A MEMS inertial sensor including: a supporting structure; an inertial structure, which includes at least one inertial mass; an elastic structure, which is mechanically coupled to the inertial mass and to the supporting structure so as to enable a movement of the inertial mass in a direction parallel to a first direction, when the supporting structure is subjected to an acceleration parallel to the first direction; and a stopper structure, fixed with respect to the supporting structure and including at least one primary stopper element and one secondary stopper element . If the acceleration exceeds a first threshold value, the inertial mass abuts against the primary stopper element and subsequently rotates about an axis of rotation defined by the primary stopper element. If the acceleration exceeds a second threshold value, rotation of the inertial mass terminates when the inertial mass abuts against the secondary stopper element.

公开(公告)号：EP3225586B1

公开(公告)日：2019-05-08

申请号：EP16194692.6

申请日：2016-10-19

Applicant: STMicroelectronics S.r.l.

Inventor： BALDO, Lorenzo ,  ZERBINI, Sarah ,  DUQI, Enri

IPC: B81C1/00 ,  G01L9/00

公开(公告)号：EP3225586A1

公开(公告)日：2017-10-04

申请号：EP16194692.6

申请日：2016-10-19

Applicant: STMicroelectronics S.r.l.

Inventor： BALDO, Lorenzo ,  ZERBINI, Sarah ,  DUQI, Enri

IPC: B81C1/00

CPC classification number: G01L9/0052 ,  B81B3/0021 ,  B81B7/0006 ,  B81B2201/0264 ,  B81C1/00158 ,  B81C1/00182 ,  B81C2201/0116

Abstract: A process for manufacturing a MEMS pressure sensor (42) having a micromechanical structure (35) envisages: providing a wafer (1) having a substrate of semiconductor material and a top surface (2a); forming a buried cavity (10) entirely contained within the substrate (2) and separated from the top surface (2a) by a membrane (12) suspended above the buried cavity (10); forming a fluidic-communication access (22; 37) for fluidic communication of the membrane (12) with an external environment, set at a pressure the value of which has to be determined; forming, suspended above the membrane (12), a plate region (30) made of conductive material, separated from the membrane (12) by an empty space (24); and forming electrical-contact elements (30a, 30b) for electrical connection of the membrane (12) and of the plate region (30), which are designed to form the plates of a sensing capacitor (C), the value of capacitance of which is indicative of the value of pressure to be detected. A corresponding MEMS pressure sensor (42) having the micromechanical structure (35) is moreover described.

Abstract translation: 一种用于制造具有微机械结构（35）的MEMS压力传感器（42）的方法设想：提供具有半导体材料衬底和顶表面（2a）的晶片（1）; 形成完全包含在所述衬底（2）内并且通过悬挂在所述掩埋腔（10）上方的膜（12）与所述顶表面（2a）分离的掩埋腔（10）; 形成用于所述膜（12）与外部环境的流体连通的流体连通入口（22; 37），所述外部环境设定为必须确定其值的压力; 形成悬置在所述膜（12）上方的由导电材料制成的板区域（30），所述板区域通过空的空间（24）与所述膜（12）分开; 和形成用于电连接膜（12）和板区域（30）的电接触元件（30a，30b），所述电接触元件被设计为形成感测电容器（C）的板，其电容值 表示要检测的压力的值。 此外还描述了具有微机械结构（35）的相应的MEMS压力传感器（42）。