公开(公告)号：EP1315407A2

公开(公告)日：2003-05-28

申请号：EP02258032.8

申请日：2002-11-21

Applicant: Shipley Co. L.L.C.

Inventor： Allen, Craig S. ,  Rzeznik, Maria Anna ,  Cairns, S. Matthew

IPC: H05K1/16 ,  H05K3/18 ,  H01G4/005

CPC classification number: H05K1/162 ,  H01G4/06 ,  H01L21/2885 ,  H01L28/56 ,  H01L28/60 ,  H05K3/181 ,  H05K2201/0195 ,  H05K2201/0236 ,  H05K2201/09309

Abstract: Multilayer dielectric structures particularly suitable for use in capacitors and having a plating dopant in an amount sufficient to promote plating of a conductive layer are provided, together with methods of forming such structures. Such dielectric structures show increased adhesion of subsequently applied conductive layers.

Abstract translation: 提供特别适用于电容器并具有足以促进导电层镀覆的电镀掺杂剂的多层电介质结构，以及形成这种结构的方法。 这种电介质结构显示随后施加的导电层的附着力增加。

公开(公告)号：EP1315407A3

公开(公告)日：2005-05-25

申请号：EP02258032.8

申请日：2002-11-21

Applicant: Shipley Co. L.L.C.

Inventor： Allen, Craig S. ,  Rzeznik, Maria Anna ,  Cairns, S. Matthew

IPC: H05K1/16 ,  H05K3/18 ,  H01G4/005

CPC classification number: H05K1/162 ,  H01G4/06 ,  H01L21/2885 ,  H01L28/56 ,  H01L28/60 ,  H05K3/181 ,  H05K2201/0195 ,  H05K2201/0236 ,  H05K2201/09309

Abstract: Multilayer dielectric structures particularly suitable for use in capacitors and having a plating dopant in an amount sufficient to promote plating of a conductive layer are provided, together with methods of forming such structures. Such dielectric structures show increased adhesion of subsequently applied conductive layers.

公开(公告)号：EP1316976A1

公开(公告)日：2003-06-04

申请号：EP02258033.6

申请日：2002-11-21

Applicant: Shipley Co. L.L.C.

Inventor： Allen, Craig S. ,  Rzeznik, Maria Anna ,  Jacques, David L.

IPC: H01G4/06 ,  H01G4/30 ,  H05K1/18

CPC classification number: H01G4/06 ,  H05K1/162 ,  H05K3/181 ,  H05K3/381 ,  H05K2201/0116 ,  H05K2201/0195 ,  H05K2201/0212 ,  H05K2201/0236 ,  H05K2201/0355 ,  H05K2203/0773

Abstract: Dielectric structures (20,25) particularly suitable for use in capacitors and having a textured surface (30) are provided, together with methods of forming these structures. Such dielectric structures show increased adhesion of subsequently applied conductive layers.

Abstract translation: 提供介电结构（20.25）特别适合于在电容器的使用和具有纹理化表面（30），与形成结构论文的方法一起。 搜索介电结构显示增加的随后施加的导电层的密合性。