公开(公告)号：US10004137B2

公开(公告)日：2018-06-19

申请号：US15408672

申请日：2017-01-18

Applicant: Silicon Motion, Inc.

Inventor： I-Hung Huang

IPC: H05K1/03 ,  H05K1/02 ,  G01R1/04 ,  G01R31/00 ,  H05K1/11

CPC classification number: H05K1/0271 ,  G01R1/0416 ,  G01R31/003 ,  G01R31/44 ,  H05K1/0298 ,  H05K1/111 ,  H05K1/115 ,  H05K1/18 ,  H05K3/28 ,  H05K2201/07 ,  H05K2201/09909 ,  H05K2201/09972

Abstract: The present invention provides a printed circuit board assembly including a substrate having a plurality of conductive layers vertically sandwiched between a first cap-insulation layer and a second cap-insulation layer. The substrate has a first part, a second part and a third part. For protecting the conductive layers from moisture, each of the areas of the conductive layers corresponding to the second part is smaller than the area of the first cap-insulation layer corresponding to the second part for at least a first predetermined percentage, and each of the areas of the conductive layers corresponding to the second part is smaller than the area of the second cap-insulation layer corresponding to the second part for at least the first predetermined percentage.