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公开(公告)号：WO2012054095A1
公开(公告)日：2012-04-26
申请号：PCT/US2011/024919
申请日：2011-02-15
Applicant: SPECTRASENSORS, INC. , FEITISCH, Alfred , KELLER, Lutz , LIU, Xiang , SCHREMPEL, Mathias , HELBLEY, Keith, Benjamin
Inventor： FEITISCH, Alfred , KELLER, Lutz , LIU, Xiang , SCHREMPEL, Mathias , HELBLEY, Keith, Benjamin
CPC classification number: G01J3/28 , G01J3/42 , G01N21/031 , G01N21/274 , G01N21/31 , G01N21/3504 , G01N21/3518 , G01N21/39 , G01N2021/399
Abstract: A valid state of an analytical system that includes a light source (102) and a detector (106) can be verified by determining that deviation of first light intensity data quantifying a first intensity of light received at the detector from the light source after the light has passed at least once through each of a reference gas in a validation cell (114) and a zero gas from a stored data set does not exceed a pre-defined threshold deviation. The stored data set can represent at least one previous measurement collected during a previous instrument validation process performed on the analytical system. The reference gas can include a known amount of an analyte. A concentration of the analyte in a sample gas in a measurement cell (112) can be determined by correcting second light intensity data quantifying a second intensity of the light received at the detector after the light passes at least once through each of the reference gas in the validation cell and a sample gas containing an unknown concentration of the analyte compound. Related systems, methods, and articles of manufacture are also described.
Abstract translation: 包括光源（102）和检测器（106）的分析系统的有效状态可以通过确定量化光检测器上接收的第一光强与光源之后的光的第一光强度数据的偏差来验证 已经通过至少一次通过验证单元（114）中的参考气体，并且来自存储的数据集的零气体不超过预定义的阈值偏差。 存储的数据集可以表示在分析系统上执行的先前的仪器验证过程期间收集的至少一个以前的测量。 参考气体可以包括已知量的分析物。 测量单元（112）中的样本气体中的分析物的浓度可以通过校正第二光强度数据来确定，该第二光强数据定量在光通过至少一次通过每个参考气体之后在检测器处接收的光的第二强度 验证单元和含有未知浓度的分析物的样品气体。 还描述了相关系统，方法和制品。
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公开(公告)号：WO2014066526A1
公开(公告)日：2014-05-01
申请号：PCT/US2013/066423
申请日：2013-10-23
Applicant: SPECTRASENSORS, INC.
Inventor： FEITISCH, Alfred , NEUBAUER, Gabi , SCHREMPEL, Mathias
CPC classification number: H01L24/83 , B23K20/023 , B23K20/24 , B23K2201/42 , H01L33/62 , H01L2224/73265 , H01L2224/83201 , H01L2224/8385 , H01L2924/12042 , H01S5/02212 , H01S5/02256 , H01S5/0226 , H01S5/02264 , H01S5/02476 , H01S5/0425
Abstract: A first contact surface (310) of a semiconductor laser chip (302) can be formed to a first target surface roughness and a second contact surface (312) of a carrier mounting (304) can be formed to a second target surface roughness. A first bond preparation layer (306) comprising a first metal can optionally be applied to the formed first contact surface, and a second bond preparation layer (308) comprising a second metal can optionally be applied to the formed second contact surface. Both preparation layers may be made of gold and diffusion bonding results from a heating of device under pressure. The first contact surface can be contacted with the second contact surface, and a solderless securing process can secure the semiconductor laser chip to the carrier mounting. Related systems, methods, articles of manufacture, and the like are also described.
Abstract translation: 半导体激光芯片（302）的第一接触表面（310）可以形成为第一目标表面粗糙度，并且载体安装件（304）的第二接触表面（312）可以形成为第二目标表面粗糙度。 包括第一金属的第一粘合制备层（306）可以任选地施加到形成的第一接触表面，并且包括第二金属的第二接合制备层（308）可以可选地施加到形成的第二接触表面。 两个制备层可以由金制成，并且在压力下由装置的加热产生扩散接合。 第一接触表面可以与第二接触表面接触，并且无焊接固定工艺可以将半导体激光器芯片固定到载体安装。 还描述了相关系统，方法，制品等。
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公开(公告)号：WO2012125752A1
公开(公告)日：2012-09-20
申请号：PCT/US2012/029111
申请日：2012-03-14
Applicant: SPECTRASENSORS, INC. , NEUBAUER, Gabi , FEITISCH, Alfred , SCHREMPEL, Mathias
Inventor： NEUBAUER, Gabi , FEITISCH, Alfred , SCHREMPEL, Mathias
CPC classification number: H01S5/02272 , G01N21/39 , G01N21/718 , G01N2021/399 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/83 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/32225 , H01L2224/32245 , H01L2224/32501 , H01L2224/48091 , H01L2224/4823 , H01L2224/73265 , H01L2224/83065 , H01L2224/83075 , H01L2224/83801 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01025 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01058 , H01L2924/01061 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/10329 , H01L2924/12042 , H01L2924/15747 , H01L2924/19107 , H01S5/02212 , H01S5/0425 , H01L2924/01007 , H01L2924/01001 , H01L2924/00 , H01L2924/01026 , H01L2924/01028 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: A first contact surface ( 310 ) of a semiconductor laser chip ( 302 ) can be formed to a target surface roughness selected to have a maximum peak to valley height that is substantially smaller than a barrier layer thickness of a metallic barrier layer to be applied to the first contact surface ( 310 ). A metallic barrier layer having the barrier layer thickness can be applied to the first contact surface, and the semiconductor laser chip ( 302 ) can be soldered to a carrier mounting along the first contact surface ( 310 ) using a solder composition ( 306 ) by heating the soldering composition to less than a threshold temperature at which dissolution of the metallic barrier layer into the soldering composition occurs. Related systems, methods, articles of manufacture, and the like are also described.
Abstract translation: 半导体激光器芯片（302）的第一接触表面（310）可以形成为目标表面粗糙度，该目标表面粗糙度被选择为具有最大峰谷高度，该最大峰谷高度基本上小于要应用于金属阻挡层的阻挡层厚度 第一接触表面（310）。 可以将具有阻挡层厚度的金属阻挡层施加到第一接触表面，并且可以使用焊料组合物（306）通过加热将半导体激光器芯片（302）焊接到沿着第一接触表面（310）安装的载体 该焊接组合物低于金属阻挡层溶入焊接组合物的阈值温度。 还描述了相关系统，方法，制品等。
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4.发明申请RECONSTRUCTION OF FREQUENCY REGISTRATION DEVIATIONS FOR QUANTITATIVE SPECTROSCOPY 审中-公开定量光谱的频率配准偏差的重构
公开(公告)号：WO2017024046A2
公开(公告)日：2017-02-09
申请号：PCT/US2016/045375
申请日：2016-08-03
Applicant: SPECTRASENSORS, INC.
Inventor： FEITISCH, Alfred , LIU, Xiang , LUDLUM, Kevin , SCHREMPEL, Mathias
CPC classification number: G01J3/0286 , G01J3/10 , G01J3/28 , G01J3/42 , G01J3/433 , G01J2003/4332 , G01J2003/4334 , G01N21/274 , G01N21/3504
Abstract: Frequency registration deviations occurring during a scan of a frequency or wavelength range by a spectroscopic analysis system can be corrected using passive and/or active approaches. A passive approach can include determining and applying mathematical conversions to a recorded field spectrum. An active approach can include modifying one or more operating parameters of the spectroscopic analysis system to reduce frequency registration deviation.
Abstract translation: 通过光谱分析系统在频率或波长范围扫描期间发生的频率配准偏差可以使用被动和/或主动方法来校正。 被动的方法可以包括确定并将数学转换应用于记录的场谱。 主动方法可以包括修改光谱分析系统的一个或多个操作参数以减少频率配准偏差。
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公开(公告)号：WO2013025728A1
公开(公告)日：2013-02-21
申请号：PCT/US2012/050817
申请日：2012-08-14
Applicant: SPECTRASENSORS, INC. , SCHREMPEL, Mathias , FEITISCH, Alfred , NEUBAUER, Gabi
Inventor： SCHREMPEL, Mathias , FEITISCH, Alfred , NEUBAUER, Gabi
IPC: H01S5/022 , H01S5/042 , H01L23/485
CPC classification number: H01S5/02272 , H01L24/03 , H01L24/05 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/0383 , H01L2224/04026 , H01L2224/05573 , H01L2224/05624 , H01L2224/05663 , H01L2224/05664 , H01L2224/05666 , H01L2224/05669 , H01L2224/0567 , H01L2224/0568 , H01L2224/05681 , H01L2224/05684 , H01L2224/05686 , H01L2224/29109 , H01L2224/29111 , H01L2224/29139 , H01L2224/29144 , H01L2224/32245 , H01L2224/83801 , H01L2924/12042 , H01L2924/15747 , H01S5/02212 , H01S5/0425 , H01L2924/04941 , H01L2924/01022 , H01L2924/053 , H01L2924/049 , H01L2924/00014 , H01L2924/01032 , H01L2924/01014 , H01L2924/014 , H01L2924/0105 , H01L2924/01029 , H01L2924/01082 , H01L2924/00
Abstract: A first contact (310) surface of a semiconductor laser chip (302) is formed to a surface roughness selected to have a maximum peak to valley height that is substantially smaller than a diffusion barrier layer thickness. A diffusion barrier layer that includes a non-metallic, electrically-conducting compound and that has the barrier layer thickness is applied to the first contact surface, and the semiconductor laser chip is soldered to a carrier mounting (304) along the first contact surface using a solder composition (306) by heating the soldering composition to less than a threshold temperature at which dissolution of the barrier layer into the soldering composition occurs. Thereby the diffusion barrier remains contiguous. The non-metallic, electrically conducting compound may comprise at least one of titanium nitride, titanium oxy-nitride, tungsten nitride, cerium oxide and cerium gadolinium oxy-nitride
Abstract translation: 半导体激光芯片（302）的第一接触面（310）形成为选择为具有基本上小于扩散阻挡层厚度的最大峰谷高度的表面粗糙度。 包含非金属导电性化合物并且具有阻挡层厚度的扩散阻挡层被施加到第一接触表面，并且半导体激光器芯片沿着第一接触表面焊接到载体安装件（304），使用 焊料组合物（306）通过将焊料组合物加热到低于阻挡层溶入焊接组合物的阈值温度。 从而扩散屏障保持连续。 非金属导电化合物可以包括氮化钛，氮氧化钛，氮化钨，氧化铈和铈钆氧化氮化物中的至少一种
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Patent Agency Ranking
公开(公告)号：WO2014093665A1
公开(公告)日：2014-06-19
申请号：PCT/US2013/074749
申请日：2013-12-12
Applicant: SPECTRASENSORS, INC.
Inventor： KELLER, Lutz , FEITISCH, Alfred , SCOTT, Peter , SCHREMPEL, Mathias , ST.JOHN, Nathan
CPC classification number: G01N21/0303 , G01J3/42 , G01N21/031 , G01N21/09 , G01N21/3504
Abstract: A spectrometer cell can include a spacer, at least one end cap, and at least one mirror with a reflective surface. The end cap can be positioned proximate to a first contact end of the spacer such that the end cap and spacer at least partially enclose an internal volume of the spectrometer cell. The mirror can be secured in place by a mechanical attachment that may include attachment materials that are chemically inert to at least one reactive gas compound, be thermally stable above at least 120 °C, and be capable of holding an optical axis of the reflective surface in a fixed orientation relative to other components of the spectrometer cell and or a spectrometer device that comprises the spectrometer cell. The mirror can optionally be constructed of a material such as stainless steel, copper, aluminum, alumino-silicate, ceramic, or the like. Related methods, articles of manufacture, systems, etc. are described.
Abstract translation: 光谱仪单元可以包括间隔物，至少一个端盖和至少一个具有反射表面的反射镜。 端盖可以定位成靠近隔离件的第一接触端，使得端盖和间隔件至少部分地包围光谱仪单元的内部体积。 反射镜可以通过机械附件固定在适当位置，机械附件可以包括对至少一种反应性气体化合物具有化学惰性的附着材料，在至少120℃以上是热稳定的，并且能够保持反射表面的光轴 相对于光谱仪单元的其它部件为固定的取向，或包含光谱仪单元的光谱仪装置。 镜子可任选地由诸如不锈钢，铜，铝，铝硅酸盐，陶瓷等的材料构成。 描述了相关方法，制品，系统等。
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公开(公告)号：EP2932235A1
公开(公告)日：2015-10-21
申请号：EP13821235.2
申请日：2013-12-12
Applicant: SpectraSensors, Inc.
Inventor： KELLER, Lutz , FEITISCH, Alfred , SCOTT, Peter , SCHREMPEL, Mathias , ST.JOHN, Nathan
CPC classification number: G01N21/0303 , G01J3/42 , G01N21/031 , G01N21/09 , G01N21/3504
Abstract: A spectrometer cell can include a spacer, at least one end cap, and at least one mirror with a reflective surface. The end cap can be positioned proximate to a first contact end of the spacer such that the end cap and spacer at least partially enclose an internal volume of the spectrometer cell. The mirror can be secured in place by a mechanical attachment that may include attachment materials that are chemically inert to at least one reactive gas compound, be thermally stable above at least 120 °C, and be capable of holding an optical axis of the reflective surface in a fixed orientation relative to other components of the spectrometer cell and or a spectrometer device that comprises the spectrometer cell. The mirror can optionally be constructed of a material such as stainless steel, copper, aluminum, alumino-silicate, ceramic, or the like. Related methods, articles of manufacture, systems, etc. are described.
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公开(公告)号：EP3332230A2
公开(公告)日：2018-06-13
申请号：EP16753523.6
申请日：2016-08-03
Applicant: SpectraSensors, Inc.
Inventor： FEITISCH, Alfred , LIU, Xiang , LUDLUM, Kevin , SCHREMPEL, Mathias
CPC classification number: G01J3/0286 , G01J3/10 , G01J3/28 , G01J3/42 , G01J3/433 , G01J2003/4332 , G01J2003/4334 , G01N21/274 , G01N21/3504
Abstract: Frequency registration deviations occurring during a scan of a frequency or wavelength range by a spectroscopic analysis system can be corrected using passive and/or active approaches. A passive approach can include determining and applying mathematical conversions to a recorded field spectrum. An active approach can include modifying one or more operating parameters of the spectroscopic analysis system to reduce frequency registration deviation.
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9.发明公开SEMICONDUCTOR LASER MOUNTING WITH INTACT DIFFUSION BARRIER LAYER 审中-公开HT UNG UNG UNG HT HT HT HT HT HT HT HT HT HT HT HT HT HT HT HT
公开(公告)号：EP2745361A1
公开(公告)日：2014-06-25
申请号：EP12750958.6
申请日：2012-08-14
Applicant: SpectraSensors, Inc.
Inventor： SCHREMPEL, Mathias , FEITISCH, Alfred , NEUBAUER, Gabi
IPC: H01S5/022 , H01S5/042 , H01L23/485
CPC classification number: H01S5/02272 , H01L24/03 , H01L24/05 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/0383 , H01L2224/04026 , H01L2224/05573 , H01L2224/05624 , H01L2224/05663 , H01L2224/05664 , H01L2224/05666 , H01L2224/05669 , H01L2224/0567 , H01L2224/0568 , H01L2224/05681 , H01L2224/05684 , H01L2224/05686 , H01L2224/29109 , H01L2224/29111 , H01L2224/29139 , H01L2224/29144 , H01L2224/32245 , H01L2224/83801 , H01L2924/12042 , H01L2924/15747 , H01S5/02212 , H01S5/0425 , H01L2924/04941 , H01L2924/01022 , H01L2924/053 , H01L2924/049 , H01L2924/00014 , H01L2924/01032 , H01L2924/01014 , H01L2924/014 , H01L2924/0105 , H01L2924/01029 , H01L2924/01082 , H01L2924/00
Abstract: A first contact surface of a semiconductor laser chip can be formed to a target surface roughness selected to have a maximum peak to valley height that is substantially smaller than a barrier layer thickness. A barrier layer that includes a non-metallic, electrically-conducting compound and that has the barrier layer thickness can be applied to the first contact surface, and the semiconductor laser chip can be soldered to a carrier mounting along the first contact surface using a solder composition by heating the soldering composition to less than a threshold temperature at which dissolution of the barrier layer into the soldering composition occurs. Related systems, methods, articles of manufacture, and the like are also described.
Abstract translation: 可以将半导体激光器芯片的第一接触表面形成为选择为具有基本上小于阻挡层厚度的最大峰谷高度的目标表面粗糙度。 可以将包含非金属导电性化合物并且具有阻挡层厚度的阻挡层施加到第一接触表面，并且可以使用焊料将半导体激光器芯片焊接到沿着第一接触表面安装的载体上 通过将焊料组合物加热到低于阻挡层溶入焊料组合物的阈值温度的组合物。 还描述了相关系统，方法，制品等。
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公开(公告)号：EP2630469B1
公开(公告)日：2019-05-08
申请号：EP11711169.0
申请日：2011-02-15
Applicant: SpectraSensors, Inc.
Inventor： FEITISCH, Alfred , KELLER, Lutz , LIU, Xiang , SCHREMPEL, Mathias , HELBLEY, Keith, Benjamin
IPC: G01N21/35 , G01N21/61 , G01N21/3504 , G01N21/27 , G01N21/31
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