公开(公告)号：EP0995344A1

公开(公告)日：2000-04-26

申请号：EP98932280.5

申请日：1998-07-08

Applicant: Surface Technology Systems Limited

Inventor： LEA, Leslie Michael ,  BHARDWAJ, Jyoti, Kiron ,  GUIBARRA, Edward

IPC: H05H1/46 ,  H01J37/32

CPC classification number: H01J37/32091 ,  H01J37/321 ,  H01J37/32504 ,  H01J37/32862 ,  H01J2237/0266 ,  H05H1/46

Abstract: A slotted conducting cylinder (11) surrounds a reactor chamber body (10) and is in turn surrounded by an antenna (12). The cylinder (11) can be grounded during normal operation of the plasma processing apparatus, but when RF driven it serves to enhance capacitive coupling with the plasma causing the inner surface (16) of the body (10) to become charged and hence the plasma will sputter clean the inner surface (16).

公开(公告)号：EP1088329A1

公开(公告)日：2001-04-04

申请号：EP00919057.0

申请日：2000-04-12

Applicant: Surface Technology Systems Limited

Inventor： BHARDWAJ, Jyoti Kiron ,  LEA, Leslie Michael ,  GUIBARRA, Edward

IPC: H01J37/32 ,  H01L21/3065

CPC classification number: H01J37/32935 ,  H01J37/321 ,  H01L21/30655

Abstract: A workpiece is processed in a chamber by striking a plasma in the chamber, treating the workpiece by cyclically adjusting the processing parameters between at least a first step having a first set of processing parameters and a second step having a second set of process parameters, wherein the plasma is stabilised during the transition between the first and second steps. These steps may comprise cyclic etch and deposition steps. One possibility for stabilising the plasma is by matching the impedance of the plasma to the impedance of the power supply which provides energy to the plasma, by means of a matching unit which can be controlled in a variety of ways depending upon the step type or time during the step. Another possibility is to prevent or reduce substantially variation in the pressure in the chamber between the first and second steps.

公开(公告)号：EP0995219A1

公开(公告)日：2000-04-26

申请号：EP98932275.5

申请日：1998-07-06

Applicant: Surface Technology Systems Limited

Inventor： LEA, Leslie, Michael ,  GUIBARRA, Edward

IPC: H01J37/32

CPC classification number: H01J37/32174 ,  H01J37/321

Abstract: Plasma processing apparatus frequently incorporates an antenna fed from a power supply and in this invention a power supply feeds a conventional matching circuit (10), which in turn is connected to the primary (11) of a transformer (12). The antenna (15) is coupled across the secondary winding (13) of the transformer (12) and that winding is tapped to ground at (16). This creates a virtual earth (17) near the mid point of the antenna (15) significantly reducing the variation, along the length of the antenna, in the power supplied to the plasma.

Abstract translation: 等离子体处理设备通常包含从电源馈送的天线，并且在本发明中，电源供给传统的匹配电路（10），该匹配电路又连接到变压器（12）的主电路（11）。 天线（15）耦合在变压器（12）的次级绕组（13）的两端，该绕组在（16）处接地。 这在天线（15）的中点附近产生虚拟地球（17），这显着地减少了沿等离子体供电的天线长度的变化。