公开(公告)号：WO2021130408A1

公开(公告)日：2021-07-01

申请号：PCT/FI2020/050850

申请日：2020-12-18

Applicant: TACTOTEK OY

Inventor： RAUTIO, Tapio ,  SIMULA, Tomi ,  PIRKONEN, Minna ,  TORVINEN, Jarkko ,  JUNKKARI, Tuukka ,  ASIKKALA, Janne ,  SINIVAARA, Hasse

IPC: H05K1/02 ,  H05K3/00 ,  H05K3/28 ,  H05K1/0277 ,  H05K1/0281 ,  H05K1/189 ,  H05K2201/0108 ,  H05K2201/0129 ,  H05K2201/091 ,  H05K2201/09118 ,  H05K2201/09781 ,  H05K2201/09909 ,  H05K2201/2009 ,  H05K2201/2027 ,  H05K2203/1327 ,  H05K3/0014 ,  H05K3/284

Abstract: Integrated functional multilayer structure (100), comprising asubstrate film (102) formed or formable so as to exhibit aselected shape (103); and a number of functional, preferably5including optical, mechanical, optoelectrical, electrical and/orspecifically, electronic, elements (110, 112, 114, 210), such asconductors (112), insulators (114), components (110, 210)and/or integrated circuits (110, 210), provided upon thesubstrate film in the proximity of the shape (103); wherein the0substrate film (102) has further been provided with a structuraltuning element (116, 316, 416, 616, 716, 816, 916, 1016),optionally comprising an elongated (316, 416), circumferential(616, 716) or other selected shape, said structural tuning elementbeing configured to locally control induced deformation,5optionally including stretching, bending, compression and/orshearing, of the substrate film within said proximity of the shape.Related method of manufacture is presented.Fig. 10

公开(公告)号：WO2021234222A1

公开(公告)日：2021-11-25

申请号：PCT/FI2021/050357

申请日：2021-05-17

Applicant: TACTOTEK OY

Inventor： SIMULA, Tomi ,  PAANI, Mika ,  KÄRNÄ, Miikka ,  RUSANEN, Outi ,  JUVANI, Johanna ,  RAUTIO, Tapio ,  SUO-ANTTILA, Marko ,  HEIKKINEN, Mikko

IPC: H05K3/28 ,  H05K1/14 ,  H05K5/06

Abstract: The presented method of manufacture of a structure comprises obtaining or producing a functional electronics assembly comprising at least a first substrate, atleast one electronics component on the first substrate, and at least one connection portion, providing the functional electronics assembly on a first substratefilm, wherein the functional electronics assembly is connected to the first substrate film via the at least one connection portion, and providing first material toat least partly embed the at least one electronics component into the first material. The first substrate film is adapted to comprise a recess defining a volume,and the at least one electronics component is arranged at least partly in thevolume.

公开(公告)号：EP4154688A1

公开(公告)日：2023-03-29

申请号：EP21727501.5

申请日：2021-05-17

Applicant: TactoTek Oy

Inventor： SIMULA, Tomi ,  PAANI, Mika ,  KÄRNÄ, Miikka ,  RUSANEN, Outi ,  JUVANI, Johanna ,  RAUTIO, Tapio ,  SUO-ANTTILA, Marko ,  HEIKKINEN, Mikko

IPC: H05K3/28 ,  H05K1/14 ,  H05K5/06

公开(公告)号：EP4548009A1

公开(公告)日：2025-05-07

申请号：EP23739315.2

申请日：2023-06-27

Applicant: TactoTek Oy

Inventor： KERÄNEN, Antti ,  HEIKKINEN, Tero ,  KORHONEN, Pasi ,  APILO, Pälvi ,  HEIKKINEN, Mikko ,  SÄÄSKI, Jarmo ,  NISKALA, Paavo ,  WALLENIUS, Ville ,  TUOVINEN, Heikki ,  ASIKKALA, Janne ,  SALMI, Taneli ,  KELA, Suvi ,  RUSANEN, Outi ,  JUVANI, Johanna ,  SIPPARI, Mikko ,  SIMULA, Tomi ,  RAUTIO, Tapio ,  YRJÄNÄ, Samuli ,  RAJANIEMI, Tero ,  KOIVIKKO, Simo ,  HINTIKKA, Juha-Matti ,  SINIVAARA, Hasse ,  BRÄYSY, Vinski ,  MIGLIORE, Olimpia ,  SEPPONEN, Juha

IPC: F21V8/00 ,  F21V23/00 ,  H05K1/02

公开(公告)号：EP4548001A1

公开(公告)日：2025-05-07

申请号：EP23741751.4

申请日：2023-06-27

Applicant: TactoTek Oy

Inventor： KERÄNEN, Antti ,  TORVINEN, Sami ,  HEIKKINEN, Tero ,  KORHONEN, Pasi ,  APILO, Pälvi ,  HEIKKINEN, Mikko ,  SÄÄSKI, Jarmo ,  NISKALA, Paavo ,  WALLENIUS, Ville ,  TUOVINEN, Heikki ,  ASIKKALA, Janne ,  SALMI, Taneli ,  KELA, Suvi ,  RUSANEN, Outi ,  JUVANI, Johanna ,  SIPPARI, Mikko ,  SIMULA, Tomi ,  RAUTIO, Tapio ,  YRJÄNÄ, Samuli ,  RAJANIEMI, Tero ,  KOIVIKKO, Simo ,  HINTIKKA, Juha-Matti ,  SINIVAARA, Hasse ,  BRÄYSY, Vinski ,  MIGLIORE, Olimpia ,  SEPPONEN, Juha

IPC: F21S2/00 ,  G02B6/00 ,  H05K1/02 ,  H05K1/18

公开(公告)号：EP4082304A1

公开(公告)日：2022-11-02

申请号：EP20829621.0

申请日：2020-12-18

Applicant: TactoTek Oy

Inventor： RAUTIO, Tapio ,  SIMULA, Tomi ,  PIRKONEN, Minna ,  TORVINEN, Jarkko ,  JUNKKARI, Tuukka ,  ASIKKALA, Janne ,  SINIVAARA, Hasse

IPC: H05K1/02 ,  H05K3/00 ,  H05K3/28

公开(公告)号：EP4497305A1

公开(公告)日：2025-01-29

申请号：EP23714077.7

申请日：2023-03-16

Applicant: TactoTek Oy

Inventor： SIMULA, Tomi ,  RAUTIO, Tapio

IPC: H05K3/00 ,  H05K3/28 ,  H05K1/14 ,  H05K1/18 ,  H05K3/34 ,  H05K3/40 ,  H05K1/03