公开(公告)号：WO2021130408A1

公开(公告)日：2021-07-01

申请号：PCT/FI2020/050850

申请日：2020-12-18

Applicant: TACTOTEK OY

Inventor： RAUTIO, Tapio ,  SIMULA, Tomi ,  PIRKONEN, Minna ,  TORVINEN, Jarkko ,  JUNKKARI, Tuukka ,  ASIKKALA, Janne ,  SINIVAARA, Hasse

IPC: H05K1/02 ,  H05K3/00 ,  H05K3/28 ,  H05K1/0277 ,  H05K1/0281 ,  H05K1/189 ,  H05K2201/0108 ,  H05K2201/0129 ,  H05K2201/091 ,  H05K2201/09118 ,  H05K2201/09781 ,  H05K2201/09909 ,  H05K2201/2009 ,  H05K2201/2027 ,  H05K2203/1327 ,  H05K3/0014 ,  H05K3/284

Abstract: Integrated functional multilayer structure (100), comprising asubstrate film (102) formed or formable so as to exhibit aselected shape (103); and a number of functional, preferably5including optical, mechanical, optoelectrical, electrical and/orspecifically, electronic, elements (110, 112, 114, 210), such asconductors (112), insulators (114), components (110, 210)and/or integrated circuits (110, 210), provided upon thesubstrate film in the proximity of the shape (103); wherein the0substrate film (102) has further been provided with a structuraltuning element (116, 316, 416, 616, 716, 816, 916, 1016),optionally comprising an elongated (316, 416), circumferential(616, 716) or other selected shape, said structural tuning elementbeing configured to locally control induced deformation,5optionally including stretching, bending, compression and/orshearing, of the substrate film within said proximity of the shape.Related method of manufacture is presented.Fig. 10

公开(公告)号：WO2021249113A1

公开(公告)日：2021-12-16

申请号：PCT/CN2021/093843

申请日：2021-05-14

Applicant: 京东方科技集团股份有限公司 ,  成都京东方光电科技有限公司

Inventor： 李飞 ,  王新鹏 ,  牛文骁 ,  黄浩 ,  王梓鉴 ,  朱潇龙 ,  陆旭 ,  梁恒镇

IPC: H05K1/02 ,  H05K1/0281 ,  H05K1/115 ,  H05K2201/2009

Abstract: 一种柔性电路板用补强板、柔性电路板组件及显示装置，柔性电路板用补强板包括基板，所述基板包括相对的第一表面和第二表面，所述基板上设有贯穿所述第一表面和所述第二表面的通孔，所述第一表面、所述第二表面和所述通孔的孔壁上均设置有导电层，所述第一表面和所述第二表面上的导电层通过所述通孔的孔壁上的导电层连通。

公开(公告)号：WO2021037808A2

公开(公告)日：2021-03-04

申请号：PCT/EP2020/073651

申请日：2020-08-24

Applicant: X-CELEPRINT LIMITED ,  LEONHARD KURZ STIFTUNG & CO. KG

Inventor： COK, Ronald, S. ,  ROITHMEIER, Gabriele ,  SCHULZ, Christian ,  SCHARFENBERG, Michael

IPC: H01L23/48 ,  H01L21/60 ,  H01L23/498 ,  H01L23/538 ,  H01L21/683 ,  H01L25/16 ,  H01L25/065 ,  H01L23/13 ,  G02B6/10 ,  G02B6/42 ,  G02B6/4281 ,  H01L2224/16225 ,  H01L2224/24225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81897 ,  H01L2224/81898 ,  H01L2224/81901 ,  H01L2224/81904 ,  H01L2224/82105 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/95136 ,  H01L23/49833 ,  H01L23/4985 ,  H01L23/49866 ,  H01L23/5387 ,  H01L23/5389 ,  H01L23/562 ,  H01L23/58 ,  H01L24/16 ,  H01L24/24 ,  H01L24/72 ,  H01L24/73 ,  H01L24/81 ,  H01L24/82 ,  H01L24/83 ,  H01L25/0652 ,  H01L25/167 ,  H01L2924/35 ,  H05K1/0271 ,  H05K1/0274 ,  H05K1/189 ,  H05K2201/0133 ,  H05K2201/09845 ,  H05K2201/2009 ,  H05K3/301

Abstract: A variable-stiffness module comprises a rigid structure (10) having a first stiffness, an intermediate substrate (20) having a second stiffness less than the first stiffness, and a flexible substrate (30) having a third stiffness less than the second stiffness. The rigid structure (10) is disposed on the intermediate substrate (20) and the intermediate substrate (20) is disposed on the flexible substrate (30). A conductor (40) is disposed partially on the intermediate substrate (21) and partially on the flexible substrate (30) and connected to the rigid structure (10). The conductor (40) extends from the rigid structure (10) to the intermediate substrate (21) to the flexible substrate (30). In some embodiments, a variable-stiffness module comprises any combination of multiple rigid structures, multiple intermediate substrates, and multiple conductors. The conductor (40) can be an optical conductor or an electrical conductor and can be disposed over the rigid structure (10) or between the rigid structure (10) and the intermediate substrate (21).