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    INTERFACING ARRANGEMENT, METHOD FOR MANUFACTURING AN INTERFACING ARRANGEMENT, AND MULTILAYER STRUCTURE HOSTING AN INTERFACING ARRANGEMENT
    2.
    发明申请
    INTERFACING ARRANGEMENT, METHOD FOR MANUFACTURING AN INTERFACING ARRANGEMENT, AND MULTILAYER STRUCTURE HOSTING AN INTERFACING ARRANGEMENT 审中-公开

    公开(公告)号：WO2020043939A2

    公开(公告)日：2020-03-05

    申请号：PCT/FI2019/050601

    申请日：2019-08-27

    Applicant: TACTOTEK OY

    Inventor： SIMULA, Tomi ,  BRÄYSY, Vinski ,  HEIKKINEN, Mikko ,  HINTIKKA, Juha-Matti ,  PIRKONEN, Minna ,  RAAPPANA, Pasi ,  HEIKKILÄ, Tuomas ,  SÄÄSKI, Jarmo ,  HARVELA, Juhani

    IPC: H05K3/28

    Abstract: Interface arrangement (1300, 1400, 1500, 1600, 2000), optionally consisting of or comprising an essentially electrical, or specifically, electronic node type component, for providing electrical or electromagnetic connection between an external system (46, 200) and a host structure (300) of the interface arrangement, the interface arrangement comprising a first substrate film (10) defining a cavity; a first material layer (30) arranged to at least partly fill the cavity, and to embed or at least partly cover at least one electrical element (12) at least partly arranged into the cavity, wherein the at least one electrical element comprises at least a converter element configured for adapting signals to be transferred between said external system and electronics of the host structure; and a first connection element (45), preferably arranged at least partly into the cavity, and configured for connecting to the external system (46), wherein the first connection element is further at least functionally connected to the converter element. Related multilayer structure and method of manufacture are presented.

    METHOD OF MANUFACTURE OF A STRUCTURE AND STRUCTURE
    3.
    发明申请
    METHOD OF MANUFACTURE OF A STRUCTURE AND STRUCTURE 审中-公开

    公开(公告)号：WO2021234222A1

    公开(公告)日：2021-11-25

    申请号：PCT/FI2021/050357

    申请日：2021-05-17

    Applicant: TACTOTEK OY

    Inventor： SIMULA, Tomi ,  PAANI, Mika ,  KÄRNÄ, Miikka ,  RUSANEN, Outi ,  JUVANI, Johanna ,  RAUTIO, Tapio ,  SUO-ANTTILA, Marko ,  HEIKKINEN, Mikko

    IPC: H05K3/28 ,  H05K1/14 ,  H05K5/06

    Abstract: The presented method of manufacture of a structure comprises obtaining or producing a functional electronics assembly comprising at least a first substrate, atleast one electronics component on the first substrate, and at least one connection portion, providing the functional electronics assembly on a first substratefilm, wherein the functional electronics assembly is connected to the first substrate film via the at least one connection portion, and providing first material toat least partly embed the at least one electronics component into the first material. The first substrate film is adapted to comprise a recess defining a volume,and the at least one electronics component is arranged at least partly in thevolume.

    ELECTRICAL NODE, METHOD FOR MANUFACTURING ELECTRICAL NODE AND MULTILAYER STRUCTURE COMPRISING ELECTRICAL NODE
    4.
    发明申请
    ELECTRICAL NODE, METHOD FOR MANUFACTURING ELECTRICAL NODE AND MULTILAYER STRUCTURE COMPRISING ELECTRICAL NODE 审中-公开

    公开(公告)号：WO2020144408A1

    公开(公告)日：2020-07-16

    申请号：PCT/FI2020/050019

    申请日：2020-01-10

    Applicant: TACTOTEK OY

    Inventor： KERÄNEN, Antti ,  SIMULA, Tomi ,  HEIKKINEN, Mikko ,  SÄÄSKI, Jarmo ,  RAAPPANA, Pasi ,  PIRKONEN, Minna

    IPC: H05K1/02 ,  H05K3/28 ,  H05K3/46

    Abstract: Electrical node (100, 100b, 100c, 200, 200b, 200c, 300, 400, 502, 602, 702, 802, 1404, 404B, 1502, 1504), comprising a substrate (20, 60) for accommodating at least one functional element, preferably an essentially electrical element (12, 14), said substrate having a first side and an opposite second side, said substrate further hosting a number of connecting elements (16, 31) for electrically or electromagnetically, such as inductively, capacitively or optically, connecting the at least one functional element with a circuit of an external structure; the at least one functional element optionally comprising at least one electronic component and further optionally a number of conductive traces connecting thereto, provided to the substrate and optionally projecting from the first side of the substrate; and a first material layer (30) defining a protective covering (10) at least upon said at least one functional element, said first material layer optionally defining at least portion of the exterior surface of the node; wherein the first material layer comprises elastic material arranged to reduce at least thermal expansion and/or mechanical deformation related stresses between one or more elements included in the node, adjacent the node and/or at least at a proximity thereto, preferably between the connecting elements and at least one element of the external structure, such as a material layer (90) molded, cast or otherwise produced or provided on the node. A related multilayer structure and method of manufacture are presented.

    INTEGRATED MULTILAYER STRUCTURE FOR USE IN SENSING APPLICATIONS AND METHOD FOR MANUFACTURING THEREOF
    6.
    发明申请
    INTEGRATED MULTILAYER STRUCTURE FOR USE IN SENSING APPLICATIONS AND METHOD FOR MANUFACTURING THEREOF 审中-公开

    公开(公告)号：WO2020043940A1

    公开(公告)日：2020-03-05

    申请号：PCT/FI2019/050602

    申请日：2019-08-27

    Applicant: TACTOTEK OY

    Inventor： BRÄYSY, Vinski ,  ISOHÄTÄLÄ, Anne ,  SÄÄSKI, Jarmo ,  SIMULA, Tomi

    IPC: H03K17/96

    Abstract: An integrated multilayer structure for use in sensing applications and a method of manufacture are presented. The multilayer structure comprises at least one molded or cast plastic layer and a film layer on both first and second sides of said plastic layer. The film layer on the first side of said plastic layer is provided with reactance sensing electronics. The sensing electronics comprises at least one sensing element and an electrical connection for connecting the sensing element to an associated control circuitry. The film layer on the second side of said plastic layer having a sensing area superimposed with the sensing element of the sensing electronics. The electrical distance between the film layer on the second side of said plastic layer and the sensing element being locally reduced by a physical feature at the position of the sensing area of the film layer to improve the associated sensing sensitivity.

    METHOD FOR MANUFACTURING A MULTILAYER STRUCTURE WITH EMBEDDED FUNCTIONALITIES AND RELATED MULTILAYER STRUCTURE
    8.
    发明申请
    METHOD FOR MANUFACTURING A MULTILAYER STRUCTURE WITH EMBEDDED FUNCTIONALITIES AND RELATED MULTILAYER STRUCTURE 审中-公开

    公开(公告)号：WO2020043938A1

    公开(公告)日：2020-03-05

    申请号：PCT/FI2019/050600

    申请日：2019-08-27

    Applicant: TACTOTEK OY

    Inventor： ASIKKALA, Janne ,  SIMULA, Tomi ,  KERÄNEN, Antti

    IPC: B32B3/26 ,  B32B7/06 ,  H05K1/00

    Abstract: Method (300) for manufacturing an integrated multilayer structure, comprising: obtaining (304) a substrate film of selected material and having a first and second side, said substrate film optionally being flexible and/or comprising plastic and/or composite material; providing (308, 310, 312) at least on the first side of the substrate film one or more first functional features, optionally including decorative, informative, other optical, protective, electrical and/or electronic features such as conductors and/or electronic components; arranging (316) at least one layer, preferably at least partially comprising electrically substantially insulating and/or conductive material, optionally plastic material, upon at least the first side of the substrate film; removing (318), optionally selectively and locally, at least a portion of the substrate film so that space (206), optionally comprising a through-hole in the substrate film, is released in the structure, wherein a detachment-enhancing feature provided to the substrate film, is configured to facilitate the removal of said at least portion such that the adjacent remaining film material, if any, the arranged layer and the first functional features are preserved and preferably remain substantially intact; and providing (320) at least one second functional feature into the space released for use so that the at least one second functional feature least functionally, preferably optically, electrically and/or electromagnetically, connects with at least one of said one or more first functional features.

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