公开(公告)号：EP2782123A4

公开(公告)日：2016-01-06

申请号：EP12849763

申请日：2012-11-08

Applicant: TANAKA PRECIOUS METAL IND

Inventor： OGASHIWA TOSHINORI ,  KURITA MASAAKI ,  NISHIMORI TAKASHI ,  KANEHIRA YUKIO

IPC: H01L21/60

CPC classification number: H01L21/4814 ,  B22F7/08 ,  B23K35/007 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/322 ,  B23K2035/008 ,  B23K2201/40 ,  B32B15/018 ,  C22C5/02 ,  C22C5/04 ,  C23C18/165 ,  C25D7/00 ,  H01L21/71 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/94 ,  H01L2224/03003 ,  H01L2224/031 ,  H01L2224/0312 ,  H01L2224/03334 ,  H01L2224/0401 ,  H01L2224/0508 ,  H01L2224/05082 ,  H01L2224/05083 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05166 ,  H01L2224/05169 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05669 ,  H01L2224/0567 ,  H01L2224/05671 ,  H01L2224/05673 ,  H01L2224/05676 ,  H01L2224/05678 ,  H01L2224/05681 ,  H01L2224/05684 ,  H01L2224/11003 ,  H01L2224/111 ,  H01L2224/1112 ,  H01L2224/11334 ,  H01L2224/11505 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/13166 ,  H01L2224/13169 ,  H01L2224/1317 ,  H01L2224/13171 ,  H01L2224/13173 ,  H01L2224/13176 ,  H01L2224/13178 ,  H01L2224/13181 ,  H01L2224/13184 ,  H01L2224/94 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1461 ,  H01L2924/15788 ,  H01L2924/181 ,  Y10T428/12056 ,  H01L2224/11 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01046 ,  H01L2924/00012

公开(公告)号：EP2645409A4

公开(公告)日：2016-01-06

申请号：EP11843493

申请日：2011-11-18

Applicant: TANAKA PRECIOUS METAL IND

Inventor： OGASHIWA TOSHINORI ,  KURITA MASAAKI ,  NISHIMORI TAKASHI ,  KANEHIRA YUKIO

IPC: H01L21/60

CPC classification number: H01L21/4885 ,  B22F7/08 ,  B23K1/0016 ,  B23K35/0244 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/322 ,  B23K2201/40 ,  B81C1/00095 ,  B81C1/00373 ,  B81C2201/0188 ,  B81C2201/0194 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/94 ,  H01L2224/03003 ,  H01L2224/031 ,  H01L2224/0312 ,  H01L2224/03334 ,  H01L2224/0401 ,  H01L2224/0508 ,  H01L2224/05082 ,  H01L2224/05083 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05166 ,  H01L2224/05169 ,  H01L2224/05639 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05669 ,  H01L2224/0567 ,  H01L2224/05671 ,  H01L2224/05673 ,  H01L2224/05676 ,  H01L2224/05678 ,  H01L2224/05681 ,  H01L2224/05684 ,  H01L2224/11003 ,  H01L2224/111 ,  H01L2224/1112 ,  H01L2224/11334 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/13166 ,  H01L2224/13169 ,  H01L2224/1317 ,  H01L2224/13171 ,  H01L2224/13173 ,  H01L2224/13176 ,  H01L2224/13178 ,  H01L2224/13181 ,  H01L2224/13184 ,  H01L2224/94 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1461 ,  H01L2924/15788 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/11

Abstract: The present invention provides a transfer substrate for transferring a metal wiring material to a transfer-receiving object, the transfer substrate comprising a substrate, at least one metal wiring material formed on the substrate and an underlying metal film formed between the substrate and the metal wiring material, wherein the metal wiring material is a molded article prepared by sintering, e.g., gold powder having a purity of 99.9% by weight or more and an average particle size of 0.01 µm to 1.0 µm and the underlying metal film is composed of a metal such as gold or an alloy. The transfer substrate is capable of transferring a metal wiring material to the transfer-receiving object even at a temperature for heating the transfer-receiving object of 80 to 300°C.

公开(公告)号：EP2405474A4

公开(公告)日：2015-05-27

申请号：EP10748829

申请日：2010-03-05

Applicant: TANAKA PRECIOUS METAL IND

Inventor： OGASHIWA TOSHINORI ,  MIYAIRI MASAYUKI

IPC: H01L23/485 ,  H01L21/60

CPC classification number: H01L24/11 ,  H01L24/05 ,  H01L24/13 ,  H01L24/17 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05166 ,  H01L2224/05644 ,  H01L2224/11312 ,  H01L2224/1132 ,  H01L2224/11332 ,  H01L2224/11416 ,  H01L2224/11442 ,  H01L2224/1145 ,  H01L2224/11452 ,  H01L2224/1146 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/1147 ,  H01L2224/11505 ,  H01L2224/11901 ,  H01L2224/11902 ,  H01L2224/13017 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/75251 ,  H01L2224/75343 ,  H01L2224/81097 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81207 ,  H01L2224/8121 ,  H01L2224/81444 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01103 ,  H01L2924/01108 ,  H01L2924/01203 ,  H01L2924/15788 ,  H01L2924/351 ,  H01L2924/381 ,  H01L2924/384 ,  H01L2924/20103 ,  H01L2924/20107 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00

Abstract: A two-layer structure bump including a first bump layer of a bulk body of a first conductive metal, which is any of gold, copper, and nickel, formed on a substrate and a second bump layer of a sintered body of a powder of a second conductive metal, which is any of gold and silver, formed on the first bump layer. The bulk body composing the first bump layer is formed through any of plating, sputtering, or CVD. The sintered body composing the second bump layer is formed by sintering the powder of the second conductive metal having a purity of not lower than 99.9 wt% and an average particle diameter of 0.005 µm to 1.0 µm. The second bump layer has a Young's modulus 0.1 to 0.4 times that of the first bump layer.

公开(公告)号：EP2124254A4

公开(公告)日：2013-10-02

申请号：EP08722323

申请日：2008-03-18

Applicant: TANAKA PRECIOUS METAL IND

Inventor： OGASHIWA TOSHINORI ,  MIYAIRI MASAYUKI ,  NAGANO YOJI

IPC: H01L23/10 ,  B22F1/00 ,  B22F3/10 ,  B22F3/24 ,  B22F9/00 ,  H03H3/02 ,  H03H9/10

CPC classification number: H01L23/10 ,  B22F1/0074 ,  B22F3/1021 ,  B22F2003/248 ,  B22F2998/10 ,  B22F2999/00 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/3011 ,  H03H9/1021 ,  Y10T29/42 ,  Y10T29/49002 ,  Y10T29/49005 ,  B22F9/24 ,  B22F3/24 ,  B22F2201/20 ,  H01L2924/00

Abstract: The present invention is a metal paste for sealing comprising a metal powder and an organic solvent characterized in that the metal powder is one or more kinds of metal powders selected from a gold powder, a silver powder, a platinum powder and a palladium powder which has a purity of 99.9% by weight or more and an average particle size of 0.1 µm to 1.0 µm and that the metal powder is contained in a ratio of 85 to 93% by weight and the organic solvent is contained in a ratio of 5 to 15% by weight. This metal paste preferably contains an additive such as a surfactant in accordance with the application method. As a sealing method using this metal paste, there is a method of applying and drying a metal paste, sintering it at 80 to 300°C to form a metal powder sintered body and after that pressurizing the base member and the cap member while heating the metal powder sintered body.

公开(公告)号：EP3070738A4

公开(公告)日：2017-06-21

申请号：EP14861471

申请日：2014-11-10

Applicant: TANAKA PRECIOUS METAL IND

Inventor： OGASHIWA TOSHINORI ,  MURAI HIROSHI ,  KANEHIRA YUKIO

IPC: H01L23/12 ,  B81B7/00 ,  B81C1/00 ,  H01L23/14

CPC classification number: B81C1/00301 ,  B23K20/023 ,  B81B7/007 ,  B81B2207/095 ,  B81C2203/037 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49866 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The present invention relates to a through electrode to be mounted on a substrate having a through hole. The through electrode includes: a penetrating part that passes through the through hole; a convex bump part that is formed on at least one end of the penetrating part and is wider than the through electrode; and a metal film that has at least one layer and is formed on a surface of the convex bump part that comes in contact with the substrate. The through electrode part and the convex bump part are formed of a sintered body prepared by sintering one or more kind of metal powder selected from gold, silver, palladium, and platinum having a purity of 99.9 wt% or more and an average particle size of 0.005 µm to 1.0 µm, and the metal film contains gold, silver, palladium, or platinum having a purity of 99.9 wt% or more. The through electrode according to present invention is useful for a circuit board having a multilayer structure, makes it possible to reduce the trace length of an element, such as MEMS, and is also adaptable to hermetic sealing.

Abstract translation: 本发明涉及一种通过电极被安装在具有通孔的基板。 贯通电极，包括：穿透部分并穿过该通孔; 一个凸包部分没有形成在穿透部分中的至少一个端部，并抵抗比贯通电极; 和金属膜确实具有至少一个层，并且形成所述凸包部分的表面上没有开始与基板接触。 贯通电极部和凸包部分形成通过烧结一种或多种类型的金属粉末的从金，银，钯，和具有99.9重量％以上，并且平均粒径的纯度铂制备的烧结体的 0.005微米至1.0微米，并且所述金属影片包含金，银，钯，或铂具有99.9重量％以上的纯度。 贯通电极gemäß到本发明对于具有多层结构的电路板是有用的，使得有可能降低的元素，颜色的轨迹长度：诸如MEMS，因此是适用于气密密封。

公开(公告)号：EP1916709A4

公开(公告)日：2014-07-09

申请号：EP07744651

申请日：2007-06-04

Applicant: TANAKA PRECIOUS METAL IND

Inventor： OGASHIWA TOSHINORI ,  MIYAIRI MASAYUKI

IPC: H01L21/52 ,  H01B1/22 ,  H01L21/60 ,  H01L23/00 ,  H01L23/482 ,  H05K3/32

CPC classification number: H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/0558 ,  H01L2224/05669 ,  H01L2224/1132 ,  H01L2224/11416 ,  H01L2224/11505 ,  H01L2224/1155 ,  H01L2224/1329 ,  H01L2224/13339 ,  H01L2224/13344 ,  H01L2224/13364 ,  H01L2224/13369 ,  H01L2224/16245 ,  H01L2224/27505 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/75252 ,  H01L2224/81048 ,  H01L2224/81097 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81207 ,  H01L2224/81464 ,  H01L2224/8184 ,  H01L2224/83048 ,  H01L2224/83191 ,  H01L2224/83207 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/351 ,  H01L2224/05644 ,  H01L2224/13099 ,  H01L2224/743 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/01203 ,  H01L2224/80097 ,  H01L2924/20108 ,  H01L2924/20103

公开(公告)号：EP3089207A4

公开(公告)日：2017-08-02

申请号：EP14875158

申请日：2014-12-22

Applicant: TANAKA PRECIOUS METAL IND

Inventor： OGASHIWA TOSHINORI ,  SASAKI YUYA ,  MIYAIRI MASAYUKI

IPC: H01L23/02 ,  B81C1/00

CPC classification number: B81B7/0045 ,  B81C1/00269 ,  B81C1/00325 ,  B81C2203/019 ,  H01B1/02 ,  H01L21/50 ,  H01L21/56 ,  H01L23/00 ,  H01L23/10 ,  H01L24/94 ,  H01L51/5243 ,  H01L51/5246 ,  H01L2924/0002 ,  H01L2924/10253 ,  H01L2924/16235 ,  H01L2924/16598 ,  H01L2924/167 ,  H01L2924/00

公开(公告)号：EP2626893A4

公开(公告)日：2016-08-03

申请号：EP11830573

申请日：2011-09-30

Applicant: TANAKA PRECIOUS METAL IND

Inventor： MIYAIRI MASAYUKI ,  AKIYAMA NOBUYUKI ,  INAGAKI KATSUJI ,  OGASHIWA TOSHINORI

IPC: H01L21/52 ,  B23K35/30 ,  H01B1/22 ,  H01L23/00

CPC classification number: B23K35/3006 ,  B23K35/3013 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/04026 ,  H01L2224/05166 ,  H01L2224/05644 ,  H01L2224/29101 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/83203 ,  H01L2224/8384 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/351 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/29298 ,  H01L2924/00015 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2924/01203 ,  H01L2224/29144 ,  H01L2924/00014 ,  H01L2224/29139

Abstract: A precious metal paste which does not cause contamination of a member, which can be uniformly coated to a member to be bonded, and which is in good condition after bonding is provided. The present invention relates to a precious metal paste for bonding a semiconductor element, of the paste including a precious metal powder and an organic solvent, in which the precious metal powder has a purity of 99.9 mass% or more and an average particle diameter of 0.1 to 0.5 µm, the organic solvent has a boiling point of 200 to 350°C, and a thixotropy index (TI) value calculated from a measurement value of a viscosity at a shear rate of 4/s with respect to a viscosity at a shear rate of 40/s at 23°C by means of a rotational viscometer is 6.0 or more.

公开(公告)号：EP2833393A4

公开(公告)日：2015-12-09

申请号：EP13767655

申请日：2013-03-21

Applicant: TANAKA PRECIOUS METAL IND

Inventor： OGASHIWA TOSHINORI ,  SHIOYA AKIKAZU ,  MIYAIRI MASAYUKI

IPC: H01L23/488 ,  B22F1/02 ,  B23K35/22 ,  B23K35/30 ,  B23K35/32 ,  H01L21/60 ,  H01L23/485

CPC classification number: H01L24/83 ,  B22F1/0074 ,  B22F1/025 ,  B23K1/203 ,  B23K35/0222 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/226 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  B23K35/322 ,  B23K2201/40 ,  H01B1/22 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05082 ,  H01L2224/05166 ,  H01L2224/05169 ,  H01L2224/05644 ,  H01L2224/11312 ,  H01L2224/11318 ,  H01L2224/1132 ,  H01L2224/11416 ,  H01L2224/13294 ,  H01L2224/13339 ,  H01L2224/13347 ,  H01L2224/13364 ,  H01L2224/13444 ,  H01L2224/16227 ,  H01L2224/27312 ,  H01L2224/27318 ,  H01L2224/2732 ,  H01L2224/27416 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/29364 ,  H01L2224/29444 ,  H01L2224/32225 ,  H01L2224/81192 ,  H01L2224/81203 ,  H01L2224/81444 ,  H01L2224/8184 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83444 ,  H01L2224/8384 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01203 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/15747 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

公开(公告)号：ES2698621T3

公开(公告)日：2019-02-05

申请号：ES14861471

申请日：2014-11-10

Applicant: TANAKA PRECIOUS METAL IND

Inventor： OGASHIWA TOSHINORI ,  MURAI HIROSHI ,  KANEHIRA YUKIO

IPC: H01L23/12 ,  B81B7/00 ,  B81C1/00 ,  H01L23/14

Abstract: Un electrodo pasante para ser montado en un sustrato que tiene un orificio pasante, que comprende: una parte penetrante que pasa a través del agujero pasante; una parte protuberante convexa formada en al menos un extremo de la parte penetrante y más ancha que la parte penetrante; y una película metálica que tiene al menos una capa y formada en una superficie de la parte protuberante convexa que entra en contacto con el sustrato, en la que la parte penetrante y la parte protuberante convexa están formadas por un cuerpo sinterizado preparado por sinterización de uno o más tipos de polvo metálico seleccionado de oro, plata, paladio y platino con una pureza de 99,9 % en peso o más y un tamaño de partícula promedio de 0,005 μm a 1,0 μm, y la película metálica contiene oro, plata, paladio o platino con una pureza de 99,9 % en peso o más.