-
公开(公告)号：JP2002313839A
公开(公告)日：2002-10-25
申请号：JP2002057976
申请日：2002-03-04
Applicant: TESSERA INC
Inventor： GRUBE GARY W , MATHIEU GAETAN , SWEIS JASON , GRANGE JOHN
Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor inner lead bonding method in which an operation is not affected by a little size change in a connection element. SOLUTION: The connection element having a lead is arranged on the surface of a chip such that the lead is above a contact 54. The bonding region 62 of each lead is energized down by engaging a bonding tool 60 with the contact 54 of a chip, whereas the first end, that is, base end 38 of the lead is fixed to and held by a dielectric layer structure. This lead is deformed in the shape of a letter S by moving the bonding tool 60 toward the base end, that is, the first end 38 of the lead to urge the bonding region 62 toward the first end 38 and to bend the lead, or the lead is bent down by the tool 60 and then the tool is separated from the lead to be separated from the base end 38 of the lead, and then is moved down so as to fix the lead to the contact 54 of the chip.
-
公开(公告)号：JP2005101638A
公开(公告)日：2005-04-14
申请号：JP2004325234
申请日：2004-11-09
Applicant: Tessera Inc , テセラ,インコーポレイテッド
Inventor： DISTEFANO THOMAS H , KOVAC ZLATA , GRANGE JOHN
IPC: H01L21/60 , H01L21/00 , H01L21/607 , H05K3/32 , H05K13/04
CPC classification number: H01L21/67144 , H01L24/86 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , Y10T29/4913 , Y10T29/49135
Abstract: PROBLEM TO BE SOLVED: To accurately connect a portion of a microelectronic assembly having multiple contacts to a connection component including multiple leads each of which is equipped with a long narrow connector having at least one projection extending outward. SOLUTION: There are provided a process of juxtaposing a connection component 20 to a portion of a semiconductor chip assembly 10 so that respective leads are adjacent to their corresponding contacts; and a process of engaging a connector 32 on a tool so that the connector is engaged on at least one projection of the tool for restricting the motion of the tool in the longitudinal direction relative to the connector, and of displacing a bonding region 29 of the connector 32 so that the bonding region is engaged on a contact 18 for connecting the bonding region of the connector to its corresponding contact 18. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract translation: 要解决的问题：为了将具有多个触点的微电子组件的一部分精确地连接到包括多个引线的连接部件，每个引线配备有具有向外延伸的至少一个突起的长的窄连接器。 解决方案：提供了将连接部件20并置到半导体芯片组件10的一部分的过程，使得各个引线与其相应的触点相邻; 以及将连接器32接合在工具上的过程，使得连接器接合在工具的至少一个突起上，用于限制工具相对于连接器在纵向方向上的运动，并且使接合区域29 连接器32，使得接合区域接合在接触件18上，用于将连接器的接合区域连接到其相应的接触件18.版权所有：（C）2005，JPO＆NCIPI
-
公开(公告)号：JP2006013501A
公开(公告)日：2006-01-12
申请号：JP2005181311
申请日：2005-06-21
Applicant: Tessera Inc , テセラ,インコーポレイテッド
Inventor： GRUBE GARY W , MATHIEU GAETAN , SWEIS JASON , GRANGE JOHN
CPC classification number: H01L24/50 , B23K20/10 , B23K2201/40 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01033 , H01L2924/01039 , H01L2924/01079 , H01L2924/01082
Abstract: PROBLEM TO BE SOLVED: To provide a method for bonding electrical leads to contacts on semiconductor chips and related components, in the mounting and connection of semiconductor chips. SOLUTION: A bonding region (62) of each lead is urged downward, by engaging a tool (60) with a contact (54) on a chip, while a first or base end (38) of the lead is attached to and held by a dielectric layer structure. The lead is deformed into an S-shaped configuration, by moving the bonding tool (60) horizontally toward the base or first end (38) of the lead, thereby forcing the bonding region (62) toward the first end (38) and bending the lead. Alternatively, the lead is bent downward by the tool, and then the tool is separated from the lead, is shifted away from the base end (38) of the lead, and is further moved downward to secure the lead to the chip contact (54). COPYRIGHT: (C)2006,JPO&NCIPI
Abstract translation: 要解决的问题：提供一种用于将半导体芯片的安装和连接中的电引线接合到半导体芯片和相关部件上的触点的方法。 解决方案：通过将工具（60）与芯片上的触点（54）接合在一起，引线的接合区域（62）被向下推动，同时引线的第一或基端（38）附接到 并由介电层结构保持。 通过使接合工具（60）水平地朝向引线的基部或第一端（38）移动，引线变形为S形构造，从而迫使接合区域（62）朝向第一端（38）并弯曲 带头。 或者，引线通过工具向下弯曲，然后工具与引线分离，从引线的基端（38）移开，并进一步向下移动以将引线固定到芯片接触（54 ）。 版权所有（C）2006，JPO＆NCIPI
-
公开(公告)号：AU7369794A
公开(公告)日：1995-02-20
申请号：AU7369794
申请日：1994-07-21
Applicant: TESSERA INC
Inventor： GRUBE GARY W , MATHIEW GAETAN , SWEIS JASON , GRANGE JOHN
Abstract: In a semiconductor inner lead bonding process, a connection component having leads is disposed on the chip surface so that the leads lie above the contacts. A bond region of each lead is forced downwardly by a tool into engagement with a contact on the chip while a first or proximal end of the lead remains attached to a dielectric support structure. The lead is deformed into an S-shaped configuration by moving the bonding tool horizontally towards the proximal or first end of the lead, thereby forcing the bonding region towards the first end and bending or buckling the lead. Alternatively, the lead is bent downwardly by a tool and the tool may then be disengaged from the lead, shifted away from the proximal end of the lead and again advanced downwardly to secure the lead to the chip contact.
-
公开(公告)号：AU3555995A
公开(公告)日：1996-04-09
申请号：AU3555995
申请日：1995-09-19
Applicant: TESSERA INC
Inventor： DISTEFANO THOMAS H , KOVAC ZLATA , GRANGE JOHN
Abstract: A method of connecting a semiconductor chip assembly having at least first and second contacts to a connection component including at least first and second connection leads by means of a tool consisting of the steps of juxtaposing moving and connecting the leads to the corresponding contacts. The connection component is juxtaposed with the semiconductor chip assembly so that the first and second connection leads are aligned with the first and second contacts in such a manner that the first connection lead is offset from the first contact in the first direction and the second connection lead is offset from the second contact in the same first direction. The first connection lead is moved by means of the tool substantially downwardly and towards the first contact in a second direction which is opposite to the first direction, so that an open space is formed between the first connection lead and the second contact and lead to facilitate movement of the second connection lead by the tool substantially downwardly and towards the second contact in the second direction.
-
Patent Agency Ranking
公开(公告)号：AU7369194A
公开(公告)日：1995-02-20
申请号：AU7369194
申请日：1994-07-21
Applicant: TESSERA INC
Inventor： DISTEFANO THOMAS H , KHANDROS IGOR Y , MATHIEW GAETAN , SWEIS JASON , GRANGE JOHN , GRUBE GARY W
Abstract: A bonding tool for bonding inner leads to semiconductor chips is arranged to capture and align elongated lead sections extending in any one of plural directions, and preferably, in any one of two mutually orthogonal directions. Thus, the tool can be applied to align and bond all of the leads to a chip without turning the tool or the chip even where the leads extend in multiple directions.
-
公开(公告)号：AT256378T
公开(公告)日：2003-12-15
申请号：AT95932549
申请日：1995-09-19
Applicant: TESSERA INC
Inventor： DISTEFANO THOMAS H , KOVAC ZLATA , GRANGE JOHN
Abstract: A method of connecting a semiconductor chip assembly having at least first and second contacts to a connection component including at least first and second connection leads by means of a tool consisting of the steps of juxtaposing moving and connecting the leads to the corresponding contacts. The connection component is juxtaposed with the semiconductor chip assembly so that the first and second connection leads are aligned with the first and second contacts in such a manner that the first connection lead is offset from the first contact in the first direction and the second connection lead is offset from the second contact in the same first direction. The first connection lead is moved by means of the tool substantially downwardly and towards the first contact in a second direction which is opposite to the first direction, so that an open space is formed between the first connection lead and the second contact and lead to facilitate movement of the second connection lead by the tool substantially downwardly and towards the second contact in the second direction.
-
公开(公告)号：DE69532298T2
公开(公告)日：2004-09-16
申请号：DE69532298
申请日：1995-09-19
Applicant: TESSERA INC
Inventor： DISTEFANO H , KOVAC ZLATA , GRANGE JOHN
Abstract: A method of connecting a semiconductor chip assembly having at least first and second contacts to a connection component including at least first and second connection leads by means of a tool consisting of the steps of juxtaposing moving and connecting the leads to the corresponding contacts. The connection component is juxtaposed with the semiconductor chip assembly so that the first and second connection leads are aligned with the first and second contacts in such a manner that the first connection lead is offset from the first contact in the first direction and the second connection lead is offset from the second contact in the same first direction. The first connection lead is moved by means of the tool substantially downwardly and towards the first contact in a second direction which is opposite to the first direction, so that an open space is formed between the first connection lead and the second contact and lead to facilitate movement of the second connection lead by the tool substantially downwardly and towards the second contact in the second direction.
-
公开(公告)号：DE69532298D1
公开(公告)日：2004-01-22
申请号：DE69532298
申请日：1995-09-19
Applicant: TESSERA INC
Inventor： DISTEFANO H , KOVAC ZLATA , GRANGE JOHN
Abstract: A method of connecting a semiconductor chip assembly having at least first and second contacts to a connection component including at least first and second connection leads by means of a tool consisting of the steps of juxtaposing moving and connecting the leads to the corresponding contacts. The connection component is juxtaposed with the semiconductor chip assembly so that the first and second connection leads are aligned with the first and second contacts in such a manner that the first connection lead is offset from the first contact in the first direction and the second connection lead is offset from the second contact in the same first direction. The first connection lead is moved by means of the tool substantially downwardly and towards the first contact in a second direction which is opposite to the first direction, so that an open space is formed between the first connection lead and the second contact and lead to facilitate movement of the second connection lead by the tool substantially downwardly and towards the second contact in the second direction.
-
10.发明公开
公开(公告)号：EP0800753A4
公开(公告)日：2001-01-17
申请号：EP95932549
申请日：1995-09-19
Applicant: TESSERA INC
Inventor： DISTEFANO THOMAS H , KOVAC ZLATA , GRANGE JOHN
CPC classification number: H01L21/67144 , H01L24/86 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , Y10T29/4913 , Y10T29/49135
Abstract: A method of connecting a semiconductor chip assembly (12) having at least first and second contacts (18) to a connection component (20) including at least first and second connection leads (30) by means of a tool (60) consisting of the steps of juxtaposing moving and connecting the leads to the corresponding contacts. The connection component (20) is juxtaposed with the semiconductor chip assembly (12) so that the first and second connection leads (30) are aligned with the first and second contacts (18) in such a manner that the first connection lead is offset from the first contact in the first direction and the second connection lead is offset from the second contact in the same first direction. The first connection lead is moved by means of the tool (60) substantially downwardly and towards the first contact in a second direction which is opposite to the first direction, so that an open space (A1) is formed between the first connection lead and the second contact and lead to facilitate movement of the second connection lead by the tool (60) substantially downwardly and towards the second contact in the second direction.
Abstract translation: 一种将具有至少第一和第二触点的半导体芯片组件连接到包括至少第一和第二连接引线的连接部件的连接部件的方法，所述连接部件通过工具组成，所述工具包括将引线移动并连接到相应的触点。 连接部件与半导体芯片组件并置，使得第一和第二连接引线与第一和第二触点对准，使得第一连接引线在第一方向上偏离第一触点并且第二连接引线 在相同的第一方向上偏离第二接触。 第一连接引线通过工具基本向下移动并且在与第一方向相反的第二方向上朝着第一接触移动，使得在第一连接引线和第二触点之间形成开放空间，并且导致方便 所述第二连接引线通过所述工具在所述第二方向上大致向下并朝向所述第二接触件移动。
-
-
-
-
-
-
-
-
-
Search Results
10
records
(took 0.021 seconds)
