Abstract:
An aerogel precursor sol is disclosed herein. This aerogel precursor sol comprises a metal-based aerogel precursor reactant and a first solvent comprising a polyol; wherein, the molar ratio of the first solvent molecules to the metal atoms in the reactant is at least 1 : 16 . Preferably, the first solvent is glycerol. Preferably, the aerogel precursor reactant may selected from the group consisting of metal alkoxides, at least partially hydrolyzed metal alkoxides, particulate metal oxides, and combinations thereof. Typically, the molar ratio of the first solvent molecules to the metal atoms in the reactant is no greater than 12 : 1, and preferably, the molar ratio of the first solvent molecules to the metal atoms in the reactant is between 1 : 2 and 12 : 1. In some embodiments, the molar ratio of the first solvent molecules to the metal atoms in the reactant is between 2.5 :1 and 12:1. In some embodiments, the first solvent comprises a glycol. In some embodiments, the reactant is tetraethoxysilane that may be at least partially hydrolyzed. In some embodiments, the first polyol is selected from the group consisting of 1,2,4-butanetriol; 1,2,3- butanetriol; 2 methyl-propanetriol; and 2-(hydroxymethyl)-1,3-propanediol; 1-4, 1-4, butanediol; and 2-methyl-1,3-propanediol, and combinations thereof. This invention allows controlled porosity thin film nanoporous aerogels to be deposited, gelled, aged, and dried without atmospheric controls. In another aspect, this invention allows controlled porosity thin film nanoporous aerogels to be deposited, gelled, rapidly aged at an elevated temperature, and dried with only passive atmospheric controls, such as limiting the volume of the aging chamber.
Abstract:
An aerogel precursor sol is disclosed herein. This aerogel precursor sol comprises a metal-based aerogel precursor reactant and a first solvent comprising a polyol; wherein, the molar ratio of the first solvent molecules to the metal atoms in the reactant is at least 1 : 16 . Preferably, the first solvent is glycerol. Preferably, the aerogel precursor reactant may selected from the group consisting of metal alkoxides, at least partially hydrolyzed metal alkoxides, particulate metal oxides, and combinations thereof. Typically, the molar ratio of the first solvent molecules to the metal atoms in the reactant is no greater than 12 : 1, and preferably, the molar ratio of the first solvent molecules to the metal atoms in the reactant is between 1 : 2 and 12 : 1. In some embodiments, the molar ratio of the first solvent molecules to the metal atoms in the reactant is between 2.5 :1 and 12:1. In some embodiments, the first solvent comprises a glycol. In some embodiments, the reactant is tetraethoxysilane that may be at least partially hydrolyzed. In some embodiments, the first polyol is selected from the group consisting of 1,2,4-butanetriol; 1,2,3- butanetriol; 2 methyl-propanetriol; and 2-(hydroxymethyl)-1,3-propanediol; 1-4, 1-4, butanediol; and 2-methyl-1,3-propanediol, and combinations thereof. This invention allows controlled porosity thin film nanoporous aerogels to be deposited, gelled, aged, and dried without atmospheric controls. In another aspect, this invention allows controlled porosity thin film nanoporous aerogels to be deposited, gelled, rapidly aged at an elevated temperature, and dried with only passive atmospheric controls, such as limiting the volume of the aging chamber.
Abstract:
This invention provides an improved porous structure for semiconductor devices and a process for making the same. This process may be applied to an existing porous structure 28 , which may be deposited, for example, between patterned conductors 24 . The process may include baking the structure in a reducing atmosphere, preferably a forming gas, to dehydroxylate the pore surfaces. The process may include baking the structure in a halogen-containing atmosphere to bond halogens to the pore surfaces. It has been found that a porous structure treated in such a manner generally exhibits improved dielectric properties relative to an untreated sample.
Abstract:
This invention provides a process for making a semiconductor device with reduced capacitance between adjacent conductors. This process can include applying a solution between conductors 24 , and then gelling, surface modifying, and drying the solution to form an extremely porous dielectric layer 28 . A non-porous dielectric layer 30 may be formed over porous layer 28 , which may complete an interlayer dielectric. A novel process for creating the porous dielectric layer is disclosed, which can be completed at vacuum or ambient pressures, yet results in porosity, pore size, and shrinkage of the dielectric during drying comparable to that previously attainable only by drying gels at supercritical pressure.