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    Method of manufacturing wiring board
    8.
    发明专利
    Method of manufacturing wiring board 审中-公开
    制造接线板的方法

    公开(公告)号：JP2007324297A

    公开(公告)日：2007-12-13

    申请号：JP2006151511

    申请日：2006-05-31

    Applicant: Toppan Printing Co Ltd ,  凸版印刷株式会社

    Inventor： SEKINE HIDEKATSU ,  KAWAMOTO KENJI ,  SATO JIN

    IPC: H05K1/16

    Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring board that incorporates a capacitor by which a change in shape of a dielectric can be reduced and the accuracy of the capacitor capacity in a substrate can be improved in the method of manufacturing the printed wiring board.
    SOLUTION: A wiring layer 21a and a wiring layer 21b are formed on one surface of an insulating substrate 11, and a conductor layer 22 is formed on the other surface thereof, so as to manufacture a wiring board midway of a process. Next, a dielectric layer 31 and a conductor layer 25 are formed on the conductor layer 22, and the conductor layer 25 is patterned to form a capacitor upper electrode 25a. Furthermore, the dielectric layer 31 is patterned to form a dielectric 31a. The dielectric layer, protruding from the capacitor upper electrode 25a, is removed by blasting method, so as to form a dielectric 31b having corrected shape. The conductor layer 24 is patterned to form a capacitor lower electrode 24a, and a wiring board 100 incorporating a capacitor is obtained.
    COPYRIGHT: (C)2008,JPO&INPIT

    Abstract translation: 要解决的问题：提供一种制造布线板的方法，该布线板包括电容器，通过该电容器可以降低电介质的形状变化，并且可以提高基板中的电容器容量的精度， 制造印刷电路板。 解决方案：在绝缘基板11的一个表面上形成布线层21a和布线层21b，并且在其另一个表面上形成导体层22，以便在工艺中途制造布线板。 接着，在导体层22上形成介质层31和导体层25，对导体层25进行图案化，形成电容器上部电极25a。 此外，电介质层31被图案化以形成电介质31a。 从电容器上部电极25a突出的电介质层通过喷砂法除去，形成具有校正形状的电介质31b。 导体层24被图案化以形成电容器下电极24a，并且获得并入电容器的布线板100。 版权所有（C）2008，JPO＆INPIT

    Wiring board with built-in element and manufacturing method therefor
    9.
    发明专利
    Wiring board with built-in element and manufacturing method therefor 审中-公开
    具有内置元件的接线板及其制造方法

    公开(公告)号：JP2007201326A

    公开(公告)日：2007-08-09

    申请号：JP2006020350

    申请日：2006-01-30

    Applicant: Toppan Printing Co Ltd ,  凸版印刷株式会社

    Inventor： SEKINE HIDEKATSU ,  KAWAMOTO KENJI ,  SATO JIN

    IPC: H05K3/46 ,  H01L23/12 ,  H05K3/40

    Abstract: PROBLEM TO BE SOLVED: To provide a wiring board with built-in elements and a manufacturing method therefor, wherein the manufacturing time of built in capacitors is reduced in cost-affective manner. SOLUTION: Each of capacitors 1 includes a first electrode 4 of a conductive paste hardened material, a second electrode 2 of a metal foil, and a dielectric layer 8 sandwiched between them; and the first electrode is made conductive to an external wiring 5 through a via 15 penetrated through the dielectric layer. The manufacturing method includes a step (1) of forming a sheet member, comprising the metal foil layer and the dielectric layer; a step (2) of printing and laying out a conductive paste to the dielectric layer and curing the paste to form the first electrode; a step (3) of laminating a side of the function electrode to another wiring board via a prepreg; a step (4) of forming the via hole penetrated through the metal foil layer and reaching the first electrode; a step (5) of filling a conductive material to the via hole to form the via; a step (6) of forming an etching resist to a side of the metallic foil layer; and a step (7) of etching the metal foil layer to form the second electrode. COPYRIGHT: (C)2007,JPO&INPIT

    Abstract translation: 要解决的问题：为了提供具有内置元件的布线板及其制造方法，其中内置电容器的制造时间以成本效益的方式降低。 解决方案：每个电容器1包括导电浆料硬化材料的第一电极4，金属箔的第二电极2和夹在它们之间的电介质层8; 并且第一电极通过穿过电介质层的通孔15而导电到外部配线5。 该制造方法包括形成片状部件的步骤（1），该片材部件包括金属箔层和电介质层; 将导电浆料印刷并布置到电介质层并固化糊料以形成第一电极的步骤（2）; 将功能电极的一侧经由预浸料层压到另一配线基板上的工序（3） 形成穿过所述金属箔层并到达所述第一电极的所述通孔的步骤（4）; 将导电材料填充到通孔以形成通孔的步骤（5）; 在所述金属箔层侧形成抗蚀剂的工序（6） 以及蚀刻金属箔层以形成第二电极的步骤（7）。 版权所有（C）2007，JPO＆INPIT

    Component-mounting substrate, and manufacturing method therefor
    10.
    发明专利
    Component-mounting substrate, and manufacturing method therefor 有权
    组件安装基板及其制造方法

    公开(公告)号：JP2008016552A

    公开(公告)日：2008-01-24

    申请号：JP2006184572

    申请日：2006-07-04

    Applicant: Toppan Printing Co Ltd ,  凸版印刷株式会社

    Inventor： KUMAI KOICHI ,  AKIYAMA NAOYUKI ,  SATO JIN ,  KAWAMOTO KENJI

    IPC: H05K3/46 ,  H05K3/32

    Abstract: PROBLEM TO BE SOLVED: To provide a component-mounting substrate and a manufacturing method therefor having low manufacturing cost and high product quality.
    SOLUTION: In the manufacturing method of the component-mounting substrate, a multilayer printed wiring board 20 is previously prepared, wherein insulating layers and wiring layers 21 having wirings and vacant portions alternately are so laminated as to position the wiring layer 21 in the outermost layer in thickness direction. Also, a conductive-resin pattern 11 is formed, by applying a plastic conductive resin to a surface of a support sheet 10 which is present in its thickness direction. Furthermore, an element 12 is formed in the conductive resin which constitutes the conductive-resin pattern 11 in the surface of the support sheet 10. Moreover, the element 12 is so inserted into the vacant portion and the surface with the conductive-resin pattern 11 formed thereon is superimposed on the wiring layer 21 of the multilayer printed wiring board 20, to bond pressingly the support sheet 10 to the multilayer printed wiring board 20. Furthermore, the support sheet 10 is peeled from the multilayer printed wiring board 20 to transcribe the conductive-resin pattern 11 and the element 12 on the wiring layer 21. Consequently, the component mounting substrate is obtained.
    COPYRIGHT: (C)2008,JPO&INPIT

    Abstract translation: 要解决的问题：提供具有低制造成本和高产品质量的部件安装基板及其制造方法。 解决方案：在组件安装基板的制造方法中，预先制备多层印刷布线板20，其中交替布置有布线层和空位部分的绝缘层和布线层21，以将布线层21定位在 厚度方向的最外层。 此外，通过将塑料导电树脂施加到沿其厚度方向存在的支撑片材10的表面上，形成导电树脂图案11。 此外，在支撑片10的表面中构成导电树脂图案11的导电树脂中形成元件12.此外，元件12被插入到空的部分中，并且表面与导电树脂图案11 叠层在多层印刷电路板20的布线层21上，将支撑片10按压到多层印刷电路板20上。此外，支撑片10从多层印刷线路板20剥离， 导电树脂图案11和布线层21上的元件12。因此，获得部件安装基板。 版权所有（C）2008，JPO＆INPIT

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