Abstract:
A laminate (1) provided with: a base material (2); an undercoat layer (3), which is formed on at least a portion of the outer surface of the base material (2), contains an organic polymer with a functional group, and is formed in a membrane form or film form; and an atomic layer deposition film (4), which contains a precursor (6) that serves as a starting material, is formed so as to cover the surface of the undercoat layer (3), and in which at least some of the precursor (6) are bonded to the functional groups. The linear expansion coefficient of a layered film provided with the base material (2) and the undercoat layer (3) is 1.0 × 10 -5 /K to 8.0 × 10 -5 /K.
Abstract:
A laminate body (1) of the present invention includes a base material (2), a film-like or a membrane-like undercoat layer (3 or 103) that is formed in at least a portion of the outer surface of the base material (2), and an atomic layer deposition film (4) that is formed on a surface opposite to a surface coming into contact with the base material (2) among both surfaces of the undercoat layer (3 or 103) in the thickness direction thereof. At least a portion of precursors of the atomic layer deposition film (4) bind to the undercoat layer (3 or 103), and the atomic layer deposition film (4) is formed into a membrane shape covering the undercoat layer (3 or 103).
Abstract:
A laminate of the present invention includes: a substrate (11) made of a polymer material; an undercoat layer (12) disposed on at least part of an outer surface (11a) of the substrate (11) and made up of an inorganic material containing an inorganic substance having a functional group; and an atomic layer deposition film (13) disposed so as to cover an outer surface (12a) of the undercoat layer (12) and containing a precursor which is a deposition raw material such that the precursor located on the outer surface (12a) of the undercoat layer (12) and the functional group of the inorganic substance are bound to each other.
Abstract:
A laminate (1) includes: a base material (4) having a top surface; an under coat layer (3) formed on at least a part of the top surface of the base material, having a membranous shape or a film shape and containing an organic polymer having an OH group; and an atomic layer deposition film (2) formed in a membranous shape to cover an exposed surface of the under coat layer (3), the atomic layer deposition film being formed by a precursor as a material thereof. At least a part of the precursor is coupled to the OH group of the organic polymer.
Abstract:
A laminate (10) includes: a first substrate (11); an atomic layer deposition film (12) that is an inorganic oxide layer disposed on a first surface (11a) of the first substrate; a second substrate (14) disposed on one surface of the atomic layer deposition film; and a first adhesive layer (13) disposed between the atomic layer deposition film and the second substrate for adhering the atomic layer deposition film to the second substrate.
Abstract:
A laminate body of the present invention includes a base material (2), an atomic layer deposition film (4) that is formed along the outer surface of the base material (2), and an overcoat layer (5) that covers the atomic layer deposition film (4) with a film having a mechanical strength higher than that of the atomic layer deposition film (4).
Abstract:
PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring board that incorporates a capacitor by which a change in shape of a dielectric can be reduced and the accuracy of the capacitor capacity in a substrate can be improved in the method of manufacturing the printed wiring board. SOLUTION: A wiring layer 21a and a wiring layer 21b are formed on one surface of an insulating substrate 11, and a conductor layer 22 is formed on the other surface thereof, so as to manufacture a wiring board midway of a process. Next, a dielectric layer 31 and a conductor layer 25 are formed on the conductor layer 22, and the conductor layer 25 is patterned to form a capacitor upper electrode 25a. Furthermore, the dielectric layer 31 is patterned to form a dielectric 31a. The dielectric layer, protruding from the capacitor upper electrode 25a, is removed by blasting method, so as to form a dielectric 31b having corrected shape. The conductor layer 24 is patterned to form a capacitor lower electrode 24a, and a wiring board 100 incorporating a capacitor is obtained. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a wiring board with built-in elements and a manufacturing method therefor, wherein the manufacturing time of built in capacitors is reduced in cost-affective manner. SOLUTION: Each of capacitors 1 includes a first electrode 4 of a conductive paste hardened material, a second electrode 2 of a metal foil, and a dielectric layer 8 sandwiched between them; and the first electrode is made conductive to an external wiring 5 through a via 15 penetrated through the dielectric layer. The manufacturing method includes a step (1) of forming a sheet member, comprising the metal foil layer and the dielectric layer; a step (2) of printing and laying out a conductive paste to the dielectric layer and curing the paste to form the first electrode; a step (3) of laminating a side of the function electrode to another wiring board via a prepreg; a step (4) of forming the via hole penetrated through the metal foil layer and reaching the first electrode; a step (5) of filling a conductive material to the via hole to form the via; a step (6) of forming an etching resist to a side of the metallic foil layer; and a step (7) of etching the metal foil layer to form the second electrode. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a component-mounting substrate and a manufacturing method therefor having low manufacturing cost and high product quality. SOLUTION: In the manufacturing method of the component-mounting substrate, a multilayer printed wiring board 20 is previously prepared, wherein insulating layers and wiring layers 21 having wirings and vacant portions alternately are so laminated as to position the wiring layer 21 in the outermost layer in thickness direction. Also, a conductive-resin pattern 11 is formed, by applying a plastic conductive resin to a surface of a support sheet 10 which is present in its thickness direction. Furthermore, an element 12 is formed in the conductive resin which constitutes the conductive-resin pattern 11 in the surface of the support sheet 10. Moreover, the element 12 is so inserted into the vacant portion and the surface with the conductive-resin pattern 11 formed thereon is superimposed on the wiring layer 21 of the multilayer printed wiring board 20, to bond pressingly the support sheet 10 to the multilayer printed wiring board 20. Furthermore, the support sheet 10 is peeled from the multilayer printed wiring board 20 to transcribe the conductive-resin pattern 11 and the element 12 on the wiring layer 21. Consequently, the component mounting substrate is obtained. COPYRIGHT: (C)2008,JPO&INPIT