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公开(公告)号：SG11201701691PA
公开(公告)日：2017-04-27
申请号：SG11201701691P
申请日：2015-08-24
Applicant: TORAY INDUSTRIES
Inventor： MASUDA YUKI , ARIMOTO YUKARI , YUBA TOMOYUKI
Abstract: The purpose of the present invention is to provide a resin that is capable of producing a photosensitive resin composition having high sensitivity and high film retention ratio. The present invention provides a resin which has a polyamide structure, a polyimide precursor structure or a polyimide structure wherein an acid having an alicyclic structure with 6-40 carbon atoms or a semi-alicyclic structure with 6-40 carbon atoms or an anhydride of the acid is contained in an amount of 5-95% by mole if the total amount of acids or anhydrides thereof is taken as 100% by mole.
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公开(公告)号：SG11201601946XA
公开(公告)日：2016-04-28
申请号：SG11201601946X
申请日：2014-09-18
Applicant: TORAY INDUSTRIES
Inventor： WAKITA JUNJI , ARIMOTO YUKARI , TOMIKAWA MASAO
Abstract: The present invention provides a polyimide precursor that serves to produce a cured film that has high light permeability in combination with low birefringence and low linear thermal expansion. The polyimide precursor includes at least an acid dianhydride residue as represented by Formula (1), a diamine residue as represented by Formula (2), and one or more diamine residues as represented by Formula (3), the acid dianhydride residue as represented by Formula (1) accounting for 50 mol % or more of the total quantity of acid dianhydride residues in the polyimide precursor, the diamine residue as represented by Formula (2) accounting for 50 mol % or more of the total quantity of diamine residues in the polyimide precursor, and the diamine residue as represented by Formula (3) accounting for 15 mol % or less of the total quantity of diamine residues in the polyimide precursor.
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公开(公告)号：SG11201706733UA
公开(公告)日：2017-10-30
申请号：SG11201706733U
申请日：2016-02-09
Applicant: TORAY INDUSTRIES
Inventor： ARIMOTO YUKARI , MASUDA YUKI , OKUDA RYOJI
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