公开(公告)号：JP2003101193A

公开(公告)日：2003-04-04

申请号：JP2002011743

申请日：2002-01-21

Applicant: TORAY INDUSTRIES

Inventor： AKAMATSU TAKAYOSHI ,  MATSUDA YOSHIO ,  ENOMOTO YUTAKA ,  KOKUNI MASAHIRO

IPC: H05K3/18

Abstract: PROBLEM TO BE SOLVED: To form a circuit pattern of high accuracy even on a flexible film which is liable to cause a change in dimension by the influence of heat, humidity or external force. SOLUTION: In this production method for circuit board, the flexible film is stuck with a reinforcing plate through a releasable organic layer. After the circuit pattern is formed on the flexible film, the flexible film is released from the reinforcing plate.

公开(公告)号：JPH09321169A

公开(公告)日：1997-12-12

申请号：JP12964596

申请日：1996-05-24

Applicant: TORAY INDUSTRIES

Inventor： AKAMATSU TAKAYOSHI ,  ENOMOTO YUTAKA ,  SAWAMURA TAIJI

IPC: H01L21/60 ,  H01L23/12 ,  H01L23/28

Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor package which enables high-density mounting. SOLUTION: In this semiconductor package using an interposer having a plastic film 12 as a base and in a circuit board for this semiconductor package, a thick adhesive layer 18 is provided between the plastic base and a copper foil so as to have the function to relax a stress generated between a semiconductor chip 19 and the printed circuit board by the difference in coefficient of linear expansion of materials.

公开(公告)号：JPH09148739A

公开(公告)日：1997-06-06

申请号：JP30558395

申请日：1995-11-24

Applicant: TORAY INDUSTRIES

Inventor： AKAMATSU TAKAYOSHI ,  INOUE YOSHINORI ,  ENOMOTO YUTAKA

IPC: H05K3/46

Abstract: PROBLEM TO BE SOLVED: To obtain a multilayer circuit board which can be mounted in high density by a method wherein blind via holes and/or through holes are formed from the outermost wiring layer to the other wiring layer. SOLUTION: Photoresist 16 is applied to both surfaces of a laminated body, and the photoresist is dried up. A YAG fundamental wavelength laser beam 17, which is narrowed to the prescribed range, is directed to both sides of the laminated body, and blind via holes 18 are formed using the wiring layer in the laminated body as a stopper. As a result, a high density wiring can be formed by a process shorter than the connection utilizing a bump and at less restriction on the rule of wiring design. Also, when the electrical connection between the wirings of a multilayer circuit board is performed by metal connection, the connection of low resistance can be accomplished in a highly reliable manner.

公开(公告)号：JPH08330736A

公开(公告)日：1996-12-13

申请号：JP13512595

申请日：1995-06-01

Applicant: TORAY INDUSTRIES

Inventor： AKAMATSU TAKAYOSHI ,  INOUE YOSHINORI ,  ENOMOTO YUTAKA

IPC: H05K3/46 ,  H05K3/32

Abstract: PURPOSE: To make a high-density wiring possible by a method wherein two sheets of flexible substrates are formed in such a way that the total of the heights of projections or pads on the substrate on one side of the substrates, which, are butted to each other at the time of a laminating of the substrates, is longer than the total of the heights of wiring patterned conductors formed on the laminated surfaces of the two substrates. CONSTITUTION: Two sheets of flexible substrates are formed in such a way that the total of the heights of projections or pads on the substrate on one side of the substrates, which are butted to each other at the time of a laminating of the substrates, is longer than the total of the heights of wiring patterned conductors formed on the laminated surfaces of the two substrates which are laminated together. The two sheets of the obtained flexible substrates are shown in diagrams (k) and (0). An anisotropic conductive film 11 is superposed on the flexible substrate on one side of these flexible substrates, the film 11 is temporarily pressure bonded to the substrate by a bonding tool, then, a protective film on the film 11 is peeled off. The projections or the pads, which correspond to each other, of the two sheets of the flexible substrates are aligned with each other and the film 11 is finally pressure bonded to the flexible substrate on one side by the bonding tool to obtain a multilayer flexible board having four layers of wirings.

公开(公告)号：JPH10144736A

公开(公告)日：1998-05-29

申请号：JP29619996

申请日：1996-11-08

Applicant: TORAY INDUSTRIES

Inventor： KIGOSHI SHOJI ,  ENOMOTO YUTAKA ,  SAWAMURA TAIJI

IPC: H01L23/12 ,  H01L21/60

Abstract: PROBLEM TO BE SOLVED: To provide a new bonding agent composition for a semiconductor device, which is superior in laminating processability, adhesive force and durability, a semiconductor integrated circuit connection substrate using that composition and a semiconductor device from an industrial viewpoint and to raise the economical efficiency and reliability of the high-density mounting semiconductor integrated circuit connection substrate and the semiconductor substrate, which are based on an easy processability of the substrate and the device. SOLUTION: In a substrate for semiconductor integrated circuit connection, which has at least one layer of more of insulator layers 3 and wiring board layers 4 consisting of a wiring pattern and at least one layer or more of layers 7, which are not formed with a conductor pattern, and bonding agent layers 6, when the tack strengths of both surfaces of a bonding agent sheet forming the layers 6 are respectively assumed P1 and P2 (P1 >P2 ), the P2 and P1 are set on the condition of 0 .