公开(公告)号：AT380393T

公开(公告)日：2007-12-15

申请号：AT01958398

申请日：2001-08-22

Applicant: TORAY INDUSTRIES

Inventor： OGURA MIKIHIRO ,  KIGOSHI SYOUJI ,  TOKUNAGA MASAMI ,  TSUTSUMI YASUAKI ,  KAMEI RYUICHI ,  SHIMIZU KEN

IPC: H01L21/60 ,  H01L23/31 ,  H01L23/495

Abstract: Semiconductor-use tape with an adhesive comprises a laminate consisting of an insulating film layer having a linear expansion coefficient in a film width direction (TD) at 50-200[deg]C of 17-30 ppm/[deg]C and tensile modulus of elasticity of 6-12 Gpa, and at least one semi-cured adhesive layer. .

公开(公告)号：DE60131725D1

公开(公告)日：2008-01-17

申请号：DE60131725

申请日：2001-08-22

Applicant: TORAY INDUSTRIES

Inventor： OGURA MIKIHIRO ,  KIGOSHI SYOUJI ,  TOKUNAGA MASAMI ,  TSUTSUMI YASUAKI ,  KAMEI RYUICHI ,  SHIMIZU KEN

IPC: H01L21/60 ,  H01L23/31 ,  H01L23/495

Abstract: Semiconductor-use tape with an adhesive comprises a laminate consisting of an insulating film layer having a linear expansion coefficient in a film width direction (TD) at 50-200[deg]C of 17-30 ppm/[deg]C and tensile modulus of elasticity of 6-12 Gpa, and at least one semi-cured adhesive layer. .

公开(公告)号：DE60131725T2

公开(公告)日：2008-11-06

申请号：DE60131725

申请日：2001-08-22

Applicant: TORAY INDUSTRIES

Inventor： OGURA MIKIHIRO ,  KIGOSHI SYOUJI ,  TOKUNAGA MASAMI ,  TSUTSUMI YASUAKI ,  KAMEI RYUICHI ,  SHIMIZU KEN

IPC: H01L21/60 ,  H01L23/31 ,  H01L23/495

Abstract: Semiconductor-use tape with an adhesive comprises a laminate consisting of an insulating film layer having a linear expansion coefficient in a film width direction (TD) at 50-200[deg]C of 17-30 ppm/[deg]C and tensile modulus of elasticity of 6-12 Gpa, and at least one semi-cured adhesive layer. .

公开(公告)号：HK1051441A1

公开(公告)日：2003-08-01

申请号：HK03103570

申请日：2003-05-20

Applicant: TORAY INDUSTRIES

Inventor： OGURA MIKIHIRO ,  KIGOSHI SYOUJI ,  TOKUNAGA MASAMI ,  TSUTSUMI YASUAKI ,  KAMEI RYUICHI ,  SHIMIZU KEN

IPC: H01L21/60 ,  H01L23/31 ,  H01L23/495 ,  H01L

Abstract: Semiconductor-use tape with an adhesive comprises a laminate consisting of an insulating film layer having a linear expansion coefficient in a film width direction (TD) at 50-200[deg]C of 17-30 ppm/[deg]C and tensile modulus of elasticity of 6-12 Gpa, and at least one semi-cured adhesive layer. .

公开(公告)号：JPH10277990A

公开(公告)日：1998-10-20

申请号：JP10098697

申请日：1997-04-03

Applicant: TORAY INDUSTRIES

Inventor： KURAMOTO KEITA ,  SHIMOZONO HISAYASU ,  OGURA MIKIHIRO

IPC: B26D1/09 ,  B26D1/24

Abstract: PROBLEM TO BE SOLVED: To suppress the generation of palpus and chips when a sheet form article is cut by a shear cutter. SOLUTION: In a cutting device of sheet form article which cuts the sheet form articles running continuously, by a shear cutter consisting of plural upper blades and lower blades provided in the width direction, the positioning relation in the sheet form article width direction of the upper blades 22 and the lower blades 23 of the shear cutter which are positioned at both sides in the width direction of the sheet form article to be cut in the band form, is made in the reversal positioning relation. Consequently, the pushing in direction of the upper blade of the shear cutter can be specified in an optimum direction at both sides, and the rubbing of the cutting end surfaces each other when band form cut films are separated can be suppressed at the minimum limit.

公开(公告)号：JP2002076062A

公开(公告)日：2002-03-15

申请号：JP2000255352

申请日：2000-08-25

Applicant: TORAY INDUSTRIES

Inventor： OGURA MIKIHIRO ,  KIGOSHI SHOJI ,  TOKUNAGA MASAMI

IPC: H01L21/60 ,  H01L23/31 ,  H01L23/495

Abstract: PROBLEM TO BE SOLVED: To provide an adhesive applied tape for semiconductor devices, a copper-plated laminate, and a semiconductor device using the same, which can reduce warping in either case of 'with copper foil' or 'after forming circuit pattern'. SOLUTION: This adhesive applied tape for semiconductor devices is constituted of an organic insulation film layer having properties (1) to (3) and one or more layers of half-hardened adhesive layers. (1) Film thickness is 10 to 65 μm. (2) Coefficient of linear expansion of the film in the direction of width (TD) at 50 to 200 deg.C is 17 to 30 ppm/ deg.C. (3) Tensile elastic modulus at 25 deg.C is 6 to 12 GPa.

公开(公告)号：JPH11260865A

公开(公告)日：1999-09-24

申请号：JP5987798

申请日：1998-03-11

Applicant: TORAY INDUSTRIES

Inventor： KONISHI YUKITSUNA ,  OGURA MIKIHIRO ,  KIGOSHI SHOJI

IPC: H01L21/60 ,  C09J7/02 ,  C09J161/06 ,  C09J163/00 ,  C09J177/00 ,  H01L23/12

Abstract: PROBLEM TO BE SOLVED: To provide a tape with adhesive for a semiconductor device having superior high adhesiveness and high insulation, and a substrate for connecting a semiconductor using the tape, and a semiconductor device. SOLUTION: This tape with an adhesive for tape automated bonding(TAB) is composed of a laminated product having an adhesive layer and a protective film layer on an organic insulating film having flexibility, and this adhesive layer contains polyamide resin and a phenol derivative constituted of two nuclides, which is shown by at least one kind of formula as indispensable components. In this case, X indicates a group or a bording containing at least one of sulfur and oxygen atoms, and Y1 and Y2 indicate a hydrocarbon radical whose carbon number is 1-5, and those X and Y can be made either the same or different. Also, (m) indicates an integer which is 0

公开(公告)号：JP2000277572A

公开(公告)日：2000-10-06

申请号：JP8626799

申请日：1999-03-29

Applicant: TORAY INDUSTRIES

Inventor： KONISHI YUKITSUNA ,  OGURA MIKIHIRO ,  KIGOSHI SHOJI

IPC: H01L23/12 ,  H01L21/60

Abstract: PROBLEM TO BE SOLVED: To provide a tape with an adhesive for a semiconductor device having excellent high lifetime and high adhesive properties and a substrate for connecting a semiconductor using the tape and the semiconductor device. SOLUTION: In the tape with the adhesive for the TAB having a protective film layer and an adhesive layer on an organic insulating film having flexibility, total calorific values are kept within the ranges of 0.5

公开(公告)号：EP1249863A4

公开(公告)日：2005-03-16

申请号：EP01958398

申请日：2001-08-22

Applicant: TORAY INDUSTRIES

Inventor： OGURA MIKIHIRO ,  KIGOSHI SYOUJI ,  TOKUNAGA MASAMI ,  TSUTSUMI YASUAKI ,  KAMEI RYUICHI ,  SHIMIZU KEN

IPC: H01L21/60 ,  H01L23/31 ,  H01L23/495

CPC classification number: H01L24/86 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3185 ,  H01L23/49572 ,  H01L24/97 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2224/45144 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/351 ,  Y10T428/24843 ,  Y10T428/28 ,  Y10T428/2852 ,  Y10T428/287 ,  H01L2924/00 ,  H01L2224/0401

Abstract: The present invention relates to an adhesive-backed tape for semiconductors which is characterized in that it is composed of a laminate of an insulating film layer having the following characteristics (1) and (2) and at least one adhesive agent layer in the semi-cured state. (1) The coefficient of linear expansion in the film transverse direction (TD) at 50-200° C. is 17-30 ppm/° C. (2) The tensile modulus of elasticity is 6-12 GPa By means of this construction the present invention can provide, on an industrial basis, an adhesive-backed tape suitable for producing semiconductor devices, together with copper-clad laminates, semiconductor connecting substrates and semiconductor devices employing said tape, and it enables, the reliability of semiconductor devices for high density mounting to be enhanced.

公开(公告)号：JP2001244302A

公开(公告)日：2001-09-07

申请号：JP2000051154

申请日：2000-02-28

Applicant: TORAY INDUSTRIES

Inventor： KIGOSHI SHOJI ,  OGURA MIKIHIRO

IPC: H05K1/02 ,  H01L21/60 ,  H05K3/24

Abstract: PROBLEM TO BE SOLVED: To provide a component wherein a circuit is formed to be used for a COF method with a suitability for transportation and processing in a conven tional TAB tape manufacturing line, and to provide a semiconductor device. SOLUTION: A copper plated tape for a flexible substrate consists of an insulation film (A) provided with an electrically conducting part on the surface, and a film (C) for reinforcement provided on the reverse side of the electrically conductive part of this insulation film through an adhesive layer (B). The reinforcement film can be easily peeled from the insulation film and the bending resistance is 5×10-4 to 1×10-1N.