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    ADHESIVE MATERIAL FOR SEMICONDUCTOR DEVICE, RESIN-LINED METAL FOIL, AND WIRING BOARD
    1.
    发明专利
    ADHESIVE MATERIAL FOR SEMICONDUCTOR DEVICE, RESIN-LINED METAL FOIL, AND WIRING BOARD 失效

    公开(公告)号：JP2002338930A

    公开(公告)日：2002-11-27

    申请号：JP2001152407

    申请日：2001-05-22

    Applicant: TORAY INDUSTRIES

    Inventor： KOKUNI MASAHIRO ,  YOKURA MITSUYOSHI ,  YOSHIMURA TOSHIO

    IPC: B32B15/088 ,  B32B15/08 ,  B32B27/34 ,  C09J7/02 ,  C09J179/08 ,  C09J183/10 ,  H01L21/60 ,  H05K3/06 ,  H05K3/18

    Abstract: PROBLEM TO BE SOLVED: To obtain an adhesive material for semiconductor devices wherewith a firm bond is established between a heat-resistant resin film and a metal foil without damaging the physical properties of the heat-resistant resin film and emitting lesser gas during heat treatment, to prepare a resin-lined metal foil, and to provide a wiring board using the resin-lined metal foil. SOLUTION: The adhesive material for semiconductor devices has a coating of a polyimide precursor mainly comprising an aromatic tetracarboxylic dianhydride and a diamine on at least one surface of the heat-resistant resin film, wherein the aromatic tetracarboxylic dianhydride contains a substance represented by formula [I]. In formula [I], R is an alkylene group being at least one selected from the structures of formulas [II] and [III]. In formulas [II] and [III], R and R are each a lower alkylene group or phenylene group, identical to each other or different from each other; R -R are each a lower alkyl group, phenyl group, or phenoxy group, identical to each other or different from each other; and (n) is an integer of not less than 1.

    LAMINATED FILM AND FILM SPACER FOR TAB
    3.
    发明专利
    LAMINATED FILM AND FILM SPACER FOR TAB 失效

    公开(公告)号：JPH09216320A

    公开(公告)日：1997-08-19

    申请号：JP2523896

    申请日：1996-02-13

    Applicant: TORAY INDUSTRIES

    Inventor： YOKURA MITSUYOSHI ,  KABASHIMA AKIHIRO

    IPC: B32B27/18 ,  B29C45/02 ,  B29C45/14 ,  B32B27/34 ,  H01L21/60

    Abstract: PROBLEM TO BE SOLVED: To provide a laminated film which is electroconductive, excellent in heat resistance, and can be molded by a method wherein surface resistance of at least one side face is made a specific value or rubber, and the thickness of the whole is made a specific value or higher. SOLUTION: In this laminated film used as a film spacer for TAB, a surface resistance of at least one side face is 1×10 Ω/cm or under, and the thickness of the whole is 150μm or over. Further, in order to make the surface resistance of one side face at least 1×10 Ω/cm , a conductive polyimide film is laminated on, for example, the one side face of the laminated film via an adhesive layer. As the heat resisting adhesive, it is laminated via a polyimide adhesive composed of aromatic tetracaroxyl acid and a component wherein 50mol% or over of diamine component is siloxane diamine. Furthermore, when a thickness of the whole is under 150μm, a body is weak, a central part of a tape is loosened to cause impairing a product when it comes in contact with the product. When used as a spacer for TAB, the number of repetitive use times, i.e., its recyclability is decreased.

    HEAT-RESISTANT ADHESIVE MATERIAL
    4.
    发明专利
    HEAT-RESISTANT ADHESIVE MATERIAL 失效

    公开(公告)号：JPH07258611A

    公开(公告)日：1995-10-09

    申请号：JP4846894

    申请日：1994-03-18

    Applicant: TORAY INDUSTRIES

    Inventor： YOKURA MITSUYOSHI ,  KOMURA MAKOTO ,  KITAZAWA TAKASHI

    IPC: C09J7/02 ,  C09J179/08 ,  C09J183/10 ,  H01L21/312 ,  H01L21/52 ,  H05K3/38

    Abstract: PURPOSE:To provide a heat-resistant adhesive material having good puntchability and excellent heat-resistance and electrical characteristics, enabling the bonding at a low temperature and effective for remarkably simplifying the production process of a package for semiconductor mounting use by laminating a heat-resistant adhesive to a metallic foil. CONSTITUTION:This heat-resistant adhesive material is a laminate having a heat-resistant adhesive layer on at least one surface of a metallic foil (preferably copper-based metallic foil, etc.). The heat-resistant adhesive is preferably a polyimide resin thin film produced by reacting an aromatic tetracarboxylic acid such as 3,3',4,4'-benzophenonetetracarboxylic acid dianhydride with a diamine component containing >=70mol% of a siloxane-based diamine consisting of 1,1,3,3-tetramethyl-1,3-bis(4-aminopropyl)disiloxane and imidating the obtained polyamic acid. The material can be produced e.g. by extruding a solvent solution containing the varnish of the above polyamic acid through a film-forming slit, uniformly applying the solution to a surface of a metallic foil, removing the solvent with heat and heat-treating the product for imidation.

    LAMINATED STRUCTURE
    5.
    发明专利
    LAMINATED STRUCTURE 失效

    公开(公告)号：JPH01242241A

    公开(公告)日：1989-09-27

    申请号：JP7117688

    申请日：1988-03-24

    Applicant: TORAY INDUSTRIES

    Inventor： YOKURA MITSUYOSHI ,  MATSUMOTO SATOSHI

    IPC: B32B15/088 ,  B32B15/08

    Abstract: PURPOSE:To eliminate the generation of the curling of a printed circuit board and the wrinkles of a copper foil, by constituting a laminated structure of a metal foil and two or more heat-resistant resin layers and thermally bonding the heat-resistant resin layers through a discharge treatment layer. CONSTITUTION:A laminated structure is formed of a metal foil and at least two heat-resistant resin layers and the heat-resistant resin layers are thermally bonded through a discharge treatment layer. Concretely, a heat-resistant resin film A having a predetermined thickness is thermally bonded to the metal foil and predetermined discharge treatment is applied to the surface thereof. A heat-resistant resin film B having a predetermined thickness is separately prepared and predetermined discharge treatment is preliminarily applied to said film B. Subsequently, the discharge treatment surface of the heat-resistant resin film B is superposed on the heat-resistant resin film A subjected to discharge treatment and heat bonding treatment is applied to the whole in this state to prepare a heat-resistant resin laminate.

    THREE-LAYER PLATED PRINTED CIRCUIT BOARD
    10.
    发明专利
    THREE-LAYER PLATED PRINTED CIRCUIT BOARD 审中-公开

    公开(公告)号：JP2003086937A

    公开(公告)日：2003-03-20

    申请号：JP2001277912

    申请日：2001-09-13

    Applicant: TORAY INDUSTRIES

    Inventor： YOKURA MITSUYOSHI ,  KOKUNI MASAHIRO ,  YOSHIMURA TOSHIO

    IPC: C08G73/10 ,  H05K1/03 ,  H05K3/24 ,  H05K3/38

    Abstract: PROBLEM TO BE SOLVED: To obtain a plating-type circuit board material which has high initial bond strength to plated copper formed on a heat-resistant film and the bond strength of which drops very little even after a high-temperature heat load is imposed upon the material and the material is plated with tin. SOLUTION: A three-layer plated printed circuit board has a heat-resistant resin layer having a glass transition point (Tg) of 60-230 deg.C on at least one surface of the heat-resistant resin film, a conductive metallic layer having a thickness of 2-400 nm and formed on the resin layer by sputtering or vapor deposition, and a copper layer having a thickness of 1-18 μm and formed on the conductive metallic layer by electroplating.

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