公开(公告)号：JPS60182147A

公开(公告)日：1985-09-17

申请号：JP3712984

申请日：1984-02-28

Applicant: TOSHIBA KK

Inventor： CHIBA KOUICHI ,  TERASAKA YOSHIO

IPC: H01L21/60

Abstract: PURPOSE:To prevent the adjoining bonding wires to come in contact with each other by a method wherein, in an area which is electrically independent, a wire bonding operation is performed in the direction where a new bonding will be conducted. CONSTITUTION:An electrically independent area 6 consisting of a metal foil of the same material as lead frames 4a and 4b is provided in advance in parallel with the side 2b of a semiconductor chip 2. After the bonding operation for the final bonding pad 3a along a side 2a and the lead frame 4a has been finished, the direction of bonding operation of a capillary is changed to the direction of bonding operation between a bonding pad 3b along the side 2b and the lead frame 4b, and a bonding operation is performed in the area 6. Subsequently, a wire bonding between the bonding pad 3b and the lead frame 4b is conducted along the side 2b.

公开(公告)号：JPS60182730A

公开(公告)日：1985-09-18

申请号：JP3806484

申请日：1984-02-29

Applicant: TOSHIBA KK

Inventor： CHIBA KOUICHI ,  TERASAKA YOSHIO

IPC: H01L21/603 ,  H01L21/60 ,  H01L21/607

Abstract: PURPOSE:To solidify connection by turning back and doubling a wire projecting from a capillary and contact-bonding the wire onto a lead frame when a semiconductor pellet is die-bonded onto a substrate and a pad fitted to the semiconductor pellet is wire-bonded with the lead frame similarly mounted onto the substrate. CONSTITUTION:A semiconductor pellet 2 is die-bonded on a substrate 1, and a ball 7 at the tip of a bonding wire 5 penetrated through and projected from a capillary 6 is fixed to a bonding pad 3 fitted to the semiconductor pellet. The wire 5 is positioned on a lead frame 4 similarly mounted onto the substrate 1 while being pulled out of the capillary 6, and the capillary 6 is pushed up and the wire 5 is contact-bonded onto the frame 4. The capillary 6 is returned slightly in the original direction and the wire 6 is superposed doubly at that time, and the capillary 6 is returned to a fixed position and the doubling wire 5 is contact- bonded with the frame 4.

公开(公告)号：JPS60182146A

公开(公告)日：1985-09-17

申请号：JP3712884

申请日：1984-02-28

Applicant: TOSHIBA KK

Inventor： CHIBA KOUICHI ,  SAKAMOTO TSUGIO ,  TERASAKA YOSHIO

IPC: H01L21/603 ,  H01L21/60

Abstract: PURPOSE:To automatically set the off-center quantity in a short period by a method wherein the position of a ball is determined by performing a pattern recognition, and the center corresponding to the bonding position of an optical readout part is coincided with the position of the ball. CONSTITUTION:In the case of a pattern recognition device 12, an optical leading part 15 reads out a picture pattern, a pattern discriminating part 16 distinguishes the pattern of a gold ball, and the position of the gold ball is computed by a position recognizing part 17 taking into consideration of the distance of movement of an X-Y table device 10 and the position of the picture pattern in visual field. The distance between said position of the gold ball and the center part corresponding to the bonding position of the optical reading part 15 which was set in advance in calculated, the optical reading part 15 is shifted in the amount of the above-mentioned distance by the X-Y table device 10, and its center part is coincided with the position of the gold ball. The off-center quantity is set by an off-center quantity setting device 13.

公开(公告)号：JPS6030119A

公开(公告)日：1985-02-15

申请号：JP13847483

申请日：1983-07-28

Applicant: TOSHIBA KK

Inventor： CHIBA KOUICHI ,  TERASAKA YOSHIO ,  SASAOKA KENJI

IPC: H01L21/68 ,  H01L21/02 ,  H01L21/67

Abstract: PURPOSE:To identify patterns accurately and avoid eroneous wire bonding by a method wherein identification marks are provided in or near the bonding pads and bonding positions are determined by the pattern identification of those marks. CONSTITUTION:Near a bonding pad 4 of a group of bonding pads 4 positioned at a far end, an identification mark 7 for pattern identification is provided. The identification mark 7 is provided also near a bonding pad 4 of the bonding pads in a facing row also positioned at the far ends. When a leadframe on a substrate and the bonding pads 4 are wire-bonded with wires such as gold wires, the identification mark 7 provided near the bonding pad 4 formed on a semiconductor pellet 3 is read by a TV camera and the like for pattern identification to determine the bonding position and the leadframe and the bonding pads 4 are wire-bonded by a bonder.