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公开(公告)号：DE69111566D1
公开(公告)日：1995-08-31
申请号：DE69111566
申请日：1991-10-31
Applicant: UBE INDUSTRIES
Inventor： IMATANI KATSUO , MATSUI YUJI
Abstract: An abrasive sheet having a high flexibility, mechanical strength and heat resistance, comprises (A) a matrix comprising an aromatic polyimide resin and (B) abrasive grains having an average size of 65 - 150 mu m and evenly dispersed in an amount of 2 to 50% by weight in the matrix, and is produced by forming a thin liquid layer from a dispersion comprising an aromatic polyamic acid solution with a rotation viscosity of 3000 to 6000 poises at 30 DEG C and the above-mentioned abrasion grains dispersed in the solution, and dry-solidifying the liquid layer of the dispersion while imidizing the aromatic polyamic acid to a corresponding aromatic polyimide, the abrasive sheet having a thickness of 1.1 to 3.0 times the average size of the abrasive grains.
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公开(公告)号：DE69111566T2
公开(公告)日：1996-03-28
申请号：DE69111566
申请日：1991-10-31
Applicant: UBE INDUSTRIES
Inventor： IMATANI KATSUO , MATSUI YUJI
Abstract: An abrasive sheet having a high flexibility, mechanical strength and heat resistance, comprises (A) a matrix comprising an aromatic polyimide resin and (B) abrasive grains having an average size of 65 - 150 mu m and evenly dispersed in an amount of 2 to 50% by weight in the matrix, and is produced by forming a thin liquid layer from a dispersion comprising an aromatic polyamic acid solution with a rotation viscosity of 3000 to 6000 poises at 30 DEG C and the above-mentioned abrasion grains dispersed in the solution, and dry-solidifying the liquid layer of the dispersion while imidizing the aromatic polyamic acid to a corresponding aromatic polyimide, the abrasive sheet having a thickness of 1.1 to 3.0 times the average size of the abrasive grains.
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公开(公告)号：JPS61264027A
公开(公告)日：1986-11-21
申请号：JP10367485
申请日：1985-05-17
Applicant: UBE INDUSTRIES
Inventor： KUMAKAWA KIYOSHI , KUNIYASU KENJI , MATSUI YUJI
Abstract: PURPOSE:To obtain a film having high dimensional stability under heat and bondable easily to a metal, etc., at high temperature, by polymerizing a biphenyltetracarboxylic acid and a phenylenediamine compound, forming a thin film from the obtained polymer solution, drying and heat-treating the film, and again heat-treating the product. CONSTITUTION:A biphenyltetracarboxylic acid and a phenylenediamine compound are polymerized in a polar organic solvent to obtain a polymer solution, which is converted to a thin film on the surface of a substrate. The thin film is dried to obtain a solidified film containing about 20-60wt% solvent. The film is peeled off from the substrate, and dried and heat-treated at about 200-500 deg.C fixing at least a pair of opposite side edges. The obtained aromatic polyimide film is heat-treated again at 330-500 deg.C under a low tension, i.e. .
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公开(公告)号：JP2002012664A
公开(公告)日：2002-01-15
申请号：JP2000195883
申请日：2000-06-29
Applicant: UBE INDUSTRIES
Inventor： ISHIKAWA SEIJI , MATSUI YUJI
IPC: C08K3/00 , C08G73/10 , C08K5/00 , C08K5/29 , C08L63/00 , C08L79/08 , C09D5/25 , C09D179/08 , H01B3/30
Abstract: PROBLEM TO BE SOLVED: To provide a method for producing a polyimide polymer by which the rise in the viscosity of the polymer liquid is controlled to prevent the polymer liquid from winding around a stirrer on the production of the polyimidosiloxane and which does not need a special operation for lowering the viscosity during the process. SOLUTION: This method for producing the polyimide copolymer, characterized by carrying out the copolymerization of (a) a tetracarboxylic acid component capable of giving the heat-resistant polyimide with a diamine component comprising (b) a diaminopolysiloxane, (c) an aromatic diamine having a polar group, and, if necessary, (d) an aromatic diamine having plural benzene rings in an organic solvent under the flow of humidified nitrogen in a reaction vessel equipped with a stirrer.
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公开(公告)号：JPH08134234A
公开(公告)日：1996-05-28
申请号：JP20573295
申请日：1995-08-11
Applicant: UBE INDUSTRIES
Inventor： INOUE HIROSHI , TAKABAYASHI SEIICHIRO , MATSUI YUJI
Abstract: PURPOSE: To obtain a modified polyimide film having a high modulus in tension, excellent chemical resistance, high adhesion strength, high dimensional accuracy, and satisfactory suitability for alignment by regulating the contents of specific elements. CONSTITUTION: The film is produced from a polymer obtained from an aromatic tetracarboxylic acid ingredient and an aromatic diamine ingredient, and has on at least one surface thereof a C/O weight ratio of 2.9 to 4.6, an O/N weight ratio of 2.4 to 3.5, and an Si content of 0.7-3.0%. The whole film has a P content of 5-500ppm. It is obtained, for example, by casting on a substrate an organic solvent solution of both a phosphorus compound and an aromatic polyamic acid obtained from an aromatic acid dianhydride and an aromatic diamine, heating the cast to form a film, applying a solution of a silane coupling agent to the film, and heating the coated film.
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Patent Agency Ranking
公开(公告)号：JPH0888460A
公开(公告)日：1996-04-02
申请号：JP22162194
申请日：1994-09-16
Applicant: UBE INDUSTRIES
Inventor： YASUNO HIROSHI , MATSUBARA TAKEYUKI , MATSUI YUJI , SHIMIZU YUKIO
Abstract: PURPOSE: To easily manufacture a wiring board with a flexed part with improved heat resistance adhesion property between a flexible base film layer and copper foil corresponding to a flexed part. CONSTITUTION: When forming a copper-clad substrate, polyimidesiloxane solution composition is applied to 'a reverse side 5 (a slit-shaped opening 3) of copper foil' where copper foil is exposed in the slit-shaped opening 3 of base film made of aromatic polyimide and is dried, a flexible base film layer made of polyimidesiloxane is formed on the reverse side of copper foil and a copper-clad substrate is manufactured, and the copper-clad substrate is used to manufacture the wiring board with flexed part by etching operation and the operation for forming a covering layer.
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公开(公告)号：JPH07302968A
公开(公告)日：1995-11-14
申请号：JP9214494
申请日：1994-04-28
Applicant: UBE INDUSTRIES
Inventor： YASUNO HIROSHI , MATSUBARA TAKEYUKI , MATSUI YUJI , SHIMIZU YUKIO
IPC: C08G73/10 , C09D179/08 , H05K3/28
Abstract: PURPOSE:To provide a printed-wiring board which restrains a plating liquid from creeping into a boundary face between a metal circuit and an overcoat layer when the wiring board is brought into contact with the plating liquid by a method wherein a pretreatment in which a silane coupling layer is formed directly on the face of the metal circuit on the printed-wiring board is executed and a polyimide siloxane solution composition is, then coated and dried so as to form the overcoat layer. CONSTITUTION:A silane coupling layer which is composed of an alkoxysilyl compound is formed directly on a metal circuit on a flexible printed-wiring board in which a roughly heat-resistant polyimide film is used as an insulating board (a base film). After that, a polyimide siloxane solution composition is coated and dried so as to form an overcoat layer.
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公开(公告)号：JPH0543717A
公开(公告)日：1993-02-23
申请号：JP29101791
申请日：1991-08-20
Applicant: UBE INDUSTRIES
Inventor： MATSUI YUJI , IMATANI KATSUO
Abstract: PURPOSE:An abrasive sheet produced by holding abrasive grains having a specific average particle diameter on the surface layer of an aromatic polyimide film in the state that a part of each particle is embedded and that many projections comprising the partially exposed abrasive grains are formed over the whole region, and reduced in the amount of the expensive abrasive grains used. CONSTITUTION:An aromatic polyamic acid solution is extruded from a polymer-feeding opening 9 on a support 15 through an extrusion die 10, and the formed thin film 4 is thermally dried with a heater 5 in a casting oven 6 to obtain an aromatic polyamic acid film 4'. The film 4' is dipped in a dispersion 8 comprising an organic solvent and abrasive grains homogeneously dispersed in the solvent to coat the surface of the film. The film is dried in a drying region 14 and treated at a high temperature with a heater 11 in a curing oven 13 to imidate the polymer, followed by winding up on a roll 30 to obtain the abrasive sheet 1 in which the abrasive grains having an average particle diameter of 0.1-100mum are held on the surface layer of the aromatic polyimide film in the state that the abrasive grains are partially embedded in the layer and that many projections in a rate of 1-5X10 projections/mm over the whole region of the film are formed from the partially exposed abrasive grains.
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公开(公告)号：JPH0888461A
公开(公告)日：1996-04-02
申请号：JP22162294
申请日：1994-09-16
Applicant: UBE INDUSTRIES
Inventor： YASUNO HIROSHI , MATSUBARA TAKEYUKI , MATSUI YUJI , SHIMIZU YUKIO
Abstract: PURPOSE: To easily manufacture a wiring board with a flexed part having improved heat-resistance adhesion property between a flexible base film layer and a copper foil (wiring) corresponding to the flexed part. CONSTITUTION: When forming a copper-clad substrate, silane coupling agent layer is formed at 'a reverse side 5 (a slit-shaped opening 3) of copper foil' where copper foil is exposed in the slit-shaped opening 3 of base film made of aromatic polyimide, polyimidesiloxane solution composition is applied to the silane coupling agent layer and is dried, a flexible base film layer made of polyimidesiloxiane is formed on the reverse side of copper foil for manufacturing the copper-clad substrate, and the copper-clad substrate is used to manufacture the wiring board with flexed part by etching operation and the operation for forming a covering layer.
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公开(公告)号：JPS61264023A
公开(公告)日：1986-11-21
申请号：JP10367685
申请日：1985-05-17
Applicant: UBE INDUSTRIES
Inventor： KUNIMOTO AKIHIRO , TAKABAYASHI SEIICHIRO , MATSUI YUJI , SHIRASAKI YASUYUKI
IPC: C08G73/00 , C08G73/10 , C08J5/18 , C09J7/00 , C09J179/08
Abstract: PURPOSE:To provide the titled film containing two kinds of recurring units at a specific ratio, and giving improved adhesivity when bonded with an epoxy adhesive without lowering the mechanical properties, heat-resistance, etc. CONSTITUTION:(A) An aromatic tetracarboxylic acid compound (e.g. 2,3,3',4'- biphenyltetracarboxylic acid) is made to react with (B) an aromatic diamine component containing (i) 95-99.5mol% phenylenediamine compound and (ii) 0.1-5mol% diaminodiphenylmethane compound (e.g. 4,4'-diamino-3,3',5,5'- tetrachlorodiphenylmethane) e.g. in an organic polar solvent at =95mol% recurring unit of formula I and 0.1-5mol% recurring unit of formula II (R is halogen, etc.; n is 1 or 2; m is 0 or 1).
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