公开(公告)号：SG122957A1

公开(公告)日：2006-06-29

申请号：SG200508449

申请日：2005-11-14

Applicant: UNITED TECHNOLOGIES CORP

Inventor： BELOUSOV IGOR V ,  MALASHENKO IGOR S ,  SERGIYENKO GREGORY A ,  SHELKOVOI ANATOLI N ,  MEMMEN ROBERT L ,  RUTZ DAVID A ,  KINSTLER MONIKA D

Abstract: A method for depositing a first material on a substrate (108) includes providing the substrate (108) in a deposition chamber. A molten body (164) is formed between the substrate and a source of the first material by melting one or more second materials. A flow of the first material is passed through the molten body (164) and from the molten body (164) to the substrate (108) as a vapor flow. An essentially non-expending portion of the molten body comprises an alloy having a melting temperature below a melting temperature of the first material.

公开(公告)号：UA86366C2

公开(公告)日：2009-04-27

申请号：UAA200509014

申请日：2005-09-23

Applicant: UNITED TECHNOLOGIES CORP

Inventor： BELOUSOV IGOR V ,  MALASHENKO IGOR S ,  SERGIYENKO GREGORY A ,  SHELKOVOI EUGENE A ,  MEMMEN ROBERT L ,  RUTZ DAVID A ,  KINSTLER MONIKA A

IPC: C23C16/00 ,  B05D3/04 ,  B32B15/00

Abstract: Способосажденияпервогоматериаланаподложкувключаетрасположениеподложкив камередляосаждения. Образуютрасплавмеждуподложкойи источникомпервогоматериалапутемрасплавленияодногоилинесколькихвторыхматериалов. Потокпервогоматериалапроходитсквозьрасплави отрасплавак подложкекакпотокпара. Практическинерасходнаячастьрасплававключаетсплав, которыйимееттемпературуплавления, нижетемпературыплавленияпервогоматериала.

公开(公告)号：SG122960A1

公开(公告)日：2006-06-29

申请号：SG200508453

申请日：2005-11-14

Applicant: UNITED TECHNOLOGIES CORP

Inventor： KINSTLER MONIKA D ,  IVASISHIN OREST M ,  MARKOVSKY PAVEL E ,  BONDARCHUK VADIM I ,  SERGIYENKO GREGORY A ,  BELOUSOV IGOR V

Abstract: A method for treating a deposited titanium-base material from an initial condition to a treated condition includes a rapid heating and a rapid cooling. The heating is from a first temperature to a second temperature, the first temperature being below a ² transus and the second temperature being below above the transus. The cooling is from the second temperature to a third temperature below an equilibrium ² transus.