公开(公告)号：WO2015073852A1

公开(公告)日：2015-05-21

申请号：PCT/US2014/065744

申请日：2014-11-14

Applicant: UNITED TECHNOLOGIES CORPORATION

Inventor： SCHMIDT, Wayde R. ,  CULP, Slade R.

IPC: F02C7/00 ,  F01D25/00 ,  G01D21/00 ,  G01D11/30 ,  G01L19/16 ,  G01K1/14 ,  G01K7/02 ,  G01B21/32

CPC classification number: F01D17/085 ,  B22F3/1055 ,  B22F7/06 ,  B23K20/103 ,  B32B15/043 ,  B32B15/14 ,  B32B15/18 ,  B32B2603/00 ,  B32B2605/18 ,  B33Y10/00 ,  B33Y80/00 ,  B64D45/00 ,  B64D2045/0085 ,  F01D5/147 ,  F01D17/04 ,  F01D17/08 ,  F05D2220/32 ,  G01D11/30 ,  G01K1/14 ,  G01K7/02 ,  G01K2205/00 ,  G01L19/083 ,  G01L19/16 ,  G01M15/14 ,  Y02P10/295 ,  Y02T50/672

Abstract: One exemplary embodiment of this disclosure relates to an article having a multi-layer wall structure having an embedded sensor. Further, the multi-layer wall structure and the sensor are bonded together.

Abstract translation: 本公开的一个示例性实施例涉及具有嵌入式传感器的多层壁结构的制品。 此外，多层壁结构和传感器结合在一起。

公开(公告)号：WO2017058181A1

公开(公告)日：2017-04-06

申请号：PCT/US2015/053065

申请日：2015-09-30

Applicant: UNITED TECHNOLOGIES CORPORATION

Inventor： DARDONA, Sameh ,  CULP, Slade R. ,  SCHMIDT, Wayde R. ,  HOLDEN, III, William Eaton

IPC: B22F5/12 ,  B29C67/00 ,  G05B15/00

CPC classification number: B22F5/12 ,  B22F3/008 ,  B22F3/20 ,  B22F7/02 ,  B29C64/106 ,  B29K2995/0003 ,  B29K2995/0012 ,  B33Y10/00 ,  B33Y80/00 ,  G05B15/00

Abstract: An additive fabrication process includes rotating a core member about a central axis. While the core member is rotating, a first material is selectively deposited onto the core member with respect to computerized design data representing an article to form a first radial layer of the article. While the core member with the first radial layer is rotating, a second material is selectively depositing onto the first radial layer with respect to the computerized design data to form a second radial layer of the article.

Abstract translation: 添加剂制造工艺包括围绕中心轴旋转芯部件。 当芯构件旋转时，第一材料相对于表示制品的计算机化设计数据选择性地沉积到芯构件上，以形成制品的第一径向层。 当具有第一径向层的芯构件旋转时，第二材料相对于计算机化设计数据选择性地沉积到第一径向层上，以形成制品的第二径向层。

公开(公告)号：EP3068994B1

公开(公告)日：2019-08-07

申请号：EP14862211.1

申请日：2014-11-14

Applicant: United Technologies Corporation

Inventor： SCHMIDT, Wayde R. ,  CULP, Slade R.

IPC: F02C7/00 ,  F01D25/00 ,  G01D21/00 ,  G01D11/30 ,  G01L19/16 ,  G01K1/14 ,  G01K7/02 ,  G01B21/32

公开(公告)号：EP2966946A3

公开(公告)日：2016-11-30

申请号：EP15174120.4

申请日：2015-06-26

Applicant: United Technologies Corporation

Inventor： SCHMIDT, Wayde R. ,  DARDONA, Sameh ,  CULP, Slade R. ,  PIECH, Marcin

IPC: H05K1/16 ,  H05K3/20

CPC classification number: H05K1/16 ,  H05K3/202 ,  H05K2201/0355

Abstract: A method for manufacturing an electronic assembly using direct writing with fabricated foils is provided. The electronic assembly may include one or more foil substrates (210) and one or more elements (220, 222, 224, 226, 228, 230.). The elements may be produced by an additive manufacturing process. Moreover, the elements may be produced in the same plane or out of plain with one or more foil substrates. The elements may also be various structures, including, for example, connectors, electrical components (e.g., a resistor, a capacitor, a switch, and/or the like), and/or any other suitable electrical elements and/or structures.

公开(公告)号：EP3068994A1

公开(公告)日：2016-09-21

申请号：EP14862211.1

申请日：2014-11-14

Applicant: United Technologies Corporation

Inventor： SCHMIDT, Wayde R. ,  CULP, Slade R.

IPC: F02C7/00 ,  F01D25/00 ,  G01D21/00 ,  G01D11/30 ,  G01L19/16 ,  G01K1/14 ,  G01K7/02 ,  G01B21/32

CPC classification number: F01D17/085 ,  B22F3/1055 ,  B22F7/06 ,  B23K20/103 ,  B32B15/043 ,  B32B15/14 ,  B32B15/18 ,  B32B2603/00 ,  B32B2605/18 ,  B33Y10/00 ,  B33Y80/00 ,  B64D45/00 ,  B64D2045/0085 ,  F01D5/147 ,  F01D17/04 ,  F01D17/08 ,  F05D2220/32 ,  G01D11/30 ,  G01K1/14 ,  G01K7/02 ,  G01K2205/00 ,  G01L19/083 ,  G01L19/16 ,  G01M15/14 ,  Y02P10/295 ,  Y02T50/672

Abstract: One exemplary embodiment of this disclosure relates to an article having a multi-layer wall structure having an embedded sensor. Further, the multi-layer wall structure and the sensor are bonded together.

Abstract translation: 本公开的一个示例性实施例涉及具有嵌入式传感器的多层壁结构的制品。 此外，多层壁结构和传感器结合在一起。

公开(公告)号：EP3474297A1

公开(公告)日：2019-04-24

申请号：EP18198295.0

申请日：2018-10-02

Applicant: United Technologies Corporation

Inventor： DARDONA, Sameh ,  SHEEDY, Paul ,  SCHMIDT, Wayde R. ,  CALDWELL, Dustin D. ,  CULP, Slade R.

IPC: H01F1/00 ,  H01F1/44 ,  H01F41/02 ,  H01F41/16 ,  B29C64/129

Abstract: A system for direct writing a conformal or free-form magnet (70) includes producing a magnetic ink compound (30) by mixing an photopolymer base (20) and a magnetic material powder (22), extruding a layer (50) of the magnetic ink compound (30) through a nozzle (42) on to a target substrate (46) to form a layer (50), soft-curing the layer (50) by exposing the layer (50) to a first light (54), repeatedly extruding a layer (50) and soft-curing the layer (50), then post-curing the magnet (70) by exposing the magnet (70) to a second light (64) and an elevated temperature.

公开(公告)号：EP3023603B1

公开(公告)日：2019-03-13

申请号：EP15194348.7

申请日：2015-11-12

Applicant: United Technologies Corporation

Inventor： SHEEDY, Paul ,  DARDONA, Sameh ,  McCAFFREY, Michael G. ,  SCHMIDT, Wayde R. ,  CULP, Slade R.

IPC: G01M15/14 ,  H05K1/02 ,  H05K1/03 ,  F01D17/02 ,  F01D25/00 ,  F01D5/28 ,  H05K1/18

公开(公告)号：EP3023603A1

公开(公告)日：2016-05-25

申请号：EP15194348.7

申请日：2015-11-12

Applicant: United Technologies Corporation

Inventor： SHEEDY, Paul ,  DARDONA, Sameh ,  McCAFFREY, Michael G. ,  SCHMIDT, Wayde R. ,  CULP, Slade R.

IPC: F01D17/02 ,  F01D25/00 ,  F01D5/28

CPC classification number: H05K1/0201 ,  F01D5/284 ,  F01D17/02 ,  F01D25/005 ,  F05D2300/211 ,  F05D2300/222 ,  G01M15/14 ,  H05K1/0306 ,  H05K1/18 ,  H05K2201/068

Abstract: An instrumented article (20; 120; 220; 320; 420; 520) includes a ceramic-based substrate (22) and at least one conformal electronic device (24; 524a, 524b) deposited on a surface of the ceramic-based substrate (22). A compliant layer (26) is located between the ceramic-based substrate (22) and the one or more conformal electronic devices (24; 524a, 524b). The compliant layer (26) has a thermal expansion that is intermediate of the thermal expansions of, respectively, the ceramic-based substrate (22) and the one or more conformal electronic devices (24; 524a, 524b).

Abstract translation: 的仪表化制品（20; 120; 220; 320; 420; 520）包括陶瓷基底（22）和至少一个共形电子器件;沉积在所述陶瓷基底的一个表面上（（24 524A，524B） 22）。 柔顺层（26）位于所述陶瓷基底（22）和所述一个或多个保形的电子设备之间（24; 524A，524B）。 柔顺层（26）具有热膨胀所做的是中间的，分别是基于陶瓷的基片（22）和所述一个或多个保形的电子器件中的热膨胀（24; 524A，524B）。

公开(公告)号：EP2966946A2

公开(公告)日：2016-01-13

申请号：EP15174120.4

申请日：2015-06-26

Applicant: United Technologies Corporation

Inventor： SCHMIDT, Wayde R. ,  DARDONA, Sameh ,  CULP, Slade R. ,  PIECH, Marcin

IPC: H05K1/16 ,  H05K3/20

CPC classification number: H05K1/16 ,  H05K3/202 ,  H05K2201/0355

Abstract: A method for manufacturing an electronic assembly using direct writing with fabricated foils is provided. The electronic assembly may include one or more foil substrates (210) and one or more elements (220, 222, 224, 226, 228, 230.). The elements may be produced by an additive manufacturing process. Moreover, the elements may be produced in the same plane or out of plain with one or more foil substrates. The elements may also be various structures, including, for example, connectors, electrical components (e.g., a resistor, a capacitor, a switch, and/or the like), and/or any other suitable electrical elements and/or structures.

Abstract translation: 提供了一种用于使用直接写入与制造的箔制造电子组件的方法。 该电子组件可以包括一个或多个箔基材（210）和一个或多个元素（220，222，224，226，228，230）。 这些元件可以通过附加的制造处理来制造。 更上方，元件可以在相同的平面或出产生的纯与一个或多个箔衬底。 因此，该元件可以是各种结构，包括，例如，连接器，电气部件（E. G.，电阻器，电容器，开关，和/或类似物），和/或任何其他适当的电元件和/或结构。