PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

    公开(公告)号:US20250149426A1

    公开(公告)日:2025-05-08

    申请号:US18895309

    申请日:2024-09-24

    Abstract: A package structure includes a package substrate, an organic interposer and an electronic unit. The package substrate includes a plurality of first pads. The organic interposer is disposed on the package substrate and includes a plurality of second pads. The second pads are directly connected to the first pads to electrically connected the organic interposer to the package substrate. At least one of each of the first pads and each of the second pads includes a pad portion and a plurality of contact portions connecting the pad portion. A first extension direction of the pad portion is different from a second extension direction of the contact portions. The electronic unit is disposed on the organic interposer, wherein the electronic unit is electrically connected to the package substrate through the organic interposer.

    Electrochromic mirror module
    2.
    发明授权

    公开(公告)号:US11472344B2

    公开(公告)日:2022-10-18

    申请号:US16721953

    申请日:2019-12-20

    Abstract: An electrochromic mirror module including a cover lens, a connecting layer, and an electrochromic device is provided. The connecting layer includes a first absorbing material. The connecting layer connects between the cover lens and the electrochromic device. The electrochromic mirror module is configured to receive an incident light, and the incident light sequentially transmits through the cover plate and the connection layer to reach the electrochromic device. The first absorbing material is configured to absorb light of the incident light, whose wavelength falls in a first spectrum, and the wavelength of the first spectrum fall within the range of 570 nm to 720 nm.

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