公开(公告)号：US20250149392A1

公开(公告)日：2025-05-08

申请号：US18395755

申请日：2023-12-26

Applicant: Unimicron Technology Corp.

Inventor： Chia Ching Wang ,  Chien-Chou Chen ,  Hsuan Ming Hsu ,  Ho-Shing Lee ,  Yunn-Tzu Yu ,  Yao Yu Chiang ,  Po-Wei Chen ,  Wei-Ti Lin ,  Wen Chi Chang

IPC: H01L23/12 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498

Abstract: A package substrate includes a core layer, at least one functional component, at least one spacer, a filler, a first and a second build-up structures. The core layer has at least one opening and multiple conductive through vias. The functional component is disposed in the openings. The spacer is disposed on the functional component. The filler is filled in the opening, covering the functional component and spacer, and completely filling the gap between the opening, the functional component and the spacer. The first build-up structure is disposed on a first surface of the core layer and a third surface of the filler, and electrically connected to the functional component and the conductive through vias. The second build-up structure is disposed on a second surface of the core layer and a fourth surface of the filler, contacts the spacer and electrically connected to the conductive through vias.