公开(公告)号：US11532543B2

公开(公告)日：2022-12-20

申请号：US17402635

申请日：2021-08-16

Applicant: Unimicron Technology Corp.

Inventor： Wei-Ti Lin ,  Chun-Hsien Chien ,  Yu-Hua Chen

IPC: H05K1/03 ,  H01L23/498 ,  H01L21/48 ,  H05K1/18

Abstract: A package carrier includes a substrate, at least one interposer disposed in at least one opening of the substrate, a conductive structure layer, a first build-up structure, and a second build-up structure. The interposer includes a glass substrate, at least one conductive via, at least one first pad, and at least one second pad. The conductive via passes through the glass substrate, and the first and the second pads are disposed respectively on an upper surface and a lower surface of the glass substrate opposite to each other and are connected to opposite ends of the conductive via. The conductive structure layer is disposed on the substrate and is structurally and electrically connected to the first and the second pads. The first and the second build-up structures are disposed respectively on the first and the second surfaces of the substrate and are electrically connected to the conductive structure layer.

公开(公告)号：US20200266181A1

公开(公告)日：2020-08-20

申请号：US16869595

申请日：2020-05-08

Applicant: Unimicron Technology Corp.

Inventor： Wei-Ti Lin ,  Chun-Hsien Chien ,  Fu-Yang Chen

IPC: H01L25/16 ,  H01L23/00 ,  H01L25/075 ,  H01L33/62

Abstract: A manufacturing method of the light-emitting diode package structure is provided. A carrier is formed. The carrier comprises a first build-up circuit. At least one self-assembled material layer is formed on the first build-up circuit. A first solder mask layer is formed on the first build-up circuit. The first solder mask layer has at least one opening to expose a portion of the at least one self-assembled material layer. At least one light-emitting diode is disposed on the first build-up circuit. The at least one light-emitting diode has a self-assembled pattern, and the at least one light-emitting diode is self-assembled into the at least one opening of the first solder mask layer through a force between the self-assembled pattern and the at least one self-assembled material layer.

公开(公告)号：US11678441B2

公开(公告)日：2023-06-13

申请号：US16950910

申请日：2020-11-18

Applicant: Unimicron Technology Corp.

Inventor： Wei-Ti Lin ,  Chun-Hsien Chien ,  Chien-Chou Chen ,  Fu-Yang Chen ,  Ra-Min Tain

IPC: H05K3/46 ,  H05K3/40 ,  H05K3/42 ,  H05K3/28 ,  H05K3/30 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00

CPC classification number: H05K3/4644 ,  H05K1/111 ,  H05K1/115 ,  H05K1/181 ,  H05K3/007 ,  H05K3/0097 ,  H05K3/28 ,  H05K3/303 ,  H05K3/4007 ,  H05K3/421 ,  H05K3/429 ,  H05K2201/09136 ,  H05K2201/09509 ,  H05K2201/09827 ,  H05K2201/10234 ,  H05K2201/10522

Abstract: A circuit carrier board structure includes a first substrate, a second substrate, an adhesive layer, and a plurality of contact pads. The first substrate includes a first surface and a second surface, and also includes a plurality of first build-up layers sequentially stacked. The first build-up layers include a first dielectric layer and a first circuit layer. The second substrate includes a third surface and a fourth surface, and also includes a plurality of second build-up layers sequentially stacked. The second build-up layers include a second dielectric layer and a second circuit layer. The second surface is combined to the third surface. The connection pads are on the first surface and electrically connected to the first circuit layer. The first substrate is electrically connected to the second substrate. A manufacturing method of the circuit carrier board structure is also provided.

公开(公告)号：US20220022316A1

公开(公告)日：2022-01-20

申请号：US16996911

申请日：2020-08-19

Applicant: Unimicron Technology Corp.

Inventor： Po-Wei Chen ,  Wei-Ti Lin ,  Chun-Hsien Chien

IPC: H05K1/11 ,  H05K3/10 ,  H05K3/46 ,  H05K3/18 ,  H01L23/498

Abstract: A package carrier includes a build-up circuit structure, a first insulation protective layer, a plurality of connection pads, and a plurality of metal balls. The build-up circuit structure has an upper surface. The first insulation protective layer is disposed on the upper surface of the build-up circuit structure and has a plurality of first openings. The connection pads are respectively disposed in the first openings of the first insulation protective layer and are structurally and electrically connected to the build-up circuit structure. Each of the connection pads has an arc-shaped groove. The metal balls are respectively disposed in the arc-shaped groove of the connection pads. The metal balls and the corresponding connection pads define a plurality of bump structures, and a plurality of top surfaces of the bump structures are on a same plane.

公开(公告)号：US11037869B2

公开(公告)日：2021-06-15

申请号：US16690143

申请日：2019-11-21

Applicant: Unimicron Technology Corp.

Inventor： Fu-Yang Chen ,  Chun-Hsien Chien ,  Cheng-Hui Wu ,  Wei-Ti Lin

IPC: H01L21/48 ,  H01L23/498

Abstract: A method of preparing a package structure is provided, which includes providing a carrier plate including a supporting layer, a first release layer, and a first metal layer; forming a first dielectric layer over the first metal layer, the first dielectric layer having a plurality of holes, each of the holes having an end portion substantially coplanar with each other at a same plane; forming a plurality of conductive protrusions filling the holes, each of the conductive protrusions having a first end and a second end opposite thereto; forming a circuit layer structure including at least one circuit layer and at least one second dielectric layer, the circuit layer being connected to the second end, the second dielectric layer being disposed over the circuit layer; removing the carrier plate; and removing a portion of the first dielectric layer to expose the conductive protrusions. A package structure is also provided.

公开(公告)号：US20200075711A1

公开(公告)日：2020-03-05

申请号：US16159726

申请日：2018-10-15

Applicant: Unimicron Technology Corp.

Inventor： Yu-Hua Chen ,  Fu-Yang Chen ,  Chun-Hsien Chien ,  Chien-Chou Chen ,  Wei-Ti Lin

IPC: H01L49/02 ,  H01L23/522 ,  H01L23/532 ,  H01L23/15 ,  H01L23/498

Abstract: A manufacturing method of a substrate structure includes the following steps. A first build-up circuit structure is formed. At least one copper pillar is formed on the first build-up circuit structure. A dielectric layer is formed on the first build-up circuit structure, and the dielectric layer wraps the copper pillar. A second build-up circuit structure and a capacitive element are formed on the dielectric layer. In particular, the second build-up circuit structure and the first build-up circuit structure are respectively located at two opposite sides of the dielectric layer. The capacitive element is disposed in a capacitive element setting region within the second build-up circuit structure. The copper pillar penetrates the dielectric layer and is electrically connected to the second build-up circuit structure and the first build-up circuit structure. A substrate structure obtained by the manufacturing method of the substrate structure is provided.

公开(公告)号：US10123418B1

公开(公告)日：2018-11-06

申请号：US15903049

申请日：2018-02-23

Applicant: Unimicron Technology Corp.

Inventor： Wei-Ti Lin ,  Chun-Hsien Chien ,  Fu-Yang Chen

IPC: H05K1/16 ,  H05K3/10 ,  H05K1/18 ,  H05K1/02 ,  H01F27/06 ,  H05K1/03 ,  H05K3/00 ,  H01F41/04 ,  H05K1/11

Abstract: A circuit board structure including an insulating layer, first and second dielectric layers, and first and second inductors is provided. The insulating layer includes a first surface, a second surface, and a first conductive through hole. The first dielectric layer is disposed on the first surface. The first inductor is disposed on the first surface and includes a first conductive coil in a solenoid form penetrating the first dielectric layer and a first magnetic flux axis of which the direction is substantially parallel to the first surface. The second dielectric layer is disposed on the second surface. The second inductor is disposed on the second surface and includes a second conductive coil in a solenoid form penetrating the second dielectric layer and a second magnetic flux axis of which the direction is substantially parallel to the second surface. A manufacturing method of a circuit board structure is provided.

公开(公告)号：US11139234B1

公开(公告)日：2021-10-05

申请号：US16942743

申请日：2020-07-29

Applicant: Unimicron Technology Corp.

Inventor： Wei-Ti Lin ,  Chun-Hsien Chien ,  Yu-Hua Chen

IPC: H05K1/18 ,  H01L23/498 ,  H01L21/48

Abstract: A package carrier includes a substrate, at least one interposer disposed in at least one opening of the substrate, a conductive structure layer, a first build-up structure, and a second build-up structure. The interposer includes a glass substrate, at least one conductive via, at least one first pad, and at least one second pad. The conductive via passes through the glass substrate, and the first and the second pads are disposed respectively on an upper surface and a lower surface of the glass substrate opposite to each other and are connected to opposite ends of the conductive via. The conductive structure layer is disposed on the substrate and is structurally and electrically connected to the first and the second pads. The first and the second build-up structures are disposed respectively on the first and the second surfaces of the substrate and are electrically connected to the conductive structure layer.

公开(公告)号：US20210219435A1

公开(公告)日：2021-07-15

申请号：US17219898

申请日：2021-04-01

Applicant: Unimicron Technology Corp.

Inventor： Chun-Hsien Chien ,  Wen-Liang Yeh ,  Wei-Ti Lin

IPC: H05K3/46 ,  H05K1/11 ,  H05K3/40 ,  H05K3/00

Abstract: A circuit carrier board includes a first build-up layer structure, a substrate, an adhesive layer, and a conductive structure. The first build-up layer includes a plurality of first dielectric layers and a plurality of first circuit layers original stacked. The substrate includes a base and a second build-up layer structure disposed on the base. The second build-up layer structure includes a plurality of second dielectric layers and a plurality of second circuit layer original stacked. A top most layer of the second circuit layers is exposed outside of the second dielectric layers. The conductive structure penetrates through the first dielectric layers, the first circuit layers and the adhesive layer, and contacts with the top most layer of the second circuit layers. The conductive structure electrical connects the first circuit layers to the second circuit layers. A manufacturing method of the circuit carrier board is also provided.

公开(公告)号：US10886264B2

公开(公告)日：2021-01-05

申请号：US16869595

申请日：2020-05-08

Applicant: Unimicron Technology Corp.

Inventor： Wei-Ti Lin ,  Chun-Hsien Chien ,  Fu-Yang Chen

IPC: H01L25/16 ,  H01L23/00 ,  H01L25/075 ,  H01L33/62

Abstract: A manufacturing method of the light-emitting diode package structure is provided. A carrier is formed. The carrier comprises a first build-up circuit. At least one self-assembled material layer is formed on the first build-up circuit. A first solder mask layer is formed on the first build-up circuit. The first solder mask layer has at least one opening to expose a portion of the at least one self-assembled material layer. At least one light-emitting diode is disposed on the first build-up circuit. The at least one light-emitting diode has a self-assembled pattern, and the at least one light-emitting diode is self-assembled into the at least one opening of the first solder mask layer through a force between the self-assembled pattern and the at least one self-assembled material layer.