公开(公告)号：US10383226B2

公开(公告)日：2019-08-13

申请号：US15836923

申请日：2017-12-11

Applicant: Unimicron Technology Corp.

Inventor： Chang-Fu Chen ,  Chun-Hao Chen

IPC: H05K3/46 ,  H05K1/11 ,  H05K3/42 ,  H05K3/00

Abstract: A multi-layer circuit structure including a core layer, a first circuit structure, a second circuit structure, and a build-up circuit structure is provided. The first circuit structure and the second circuit structure are respectively disposed on two opposite surfaces of the core layer. The build-up circuit structure includes a first dielectric layer disposed on the first circuit structure, first conductive blind holes, a second dielectric layer disposed on the first dielectric layer, second conductive blind holes, and a patterned circuit layer disposed on the second dielectric layer. The first conductive blind holes penetrate through the first dielectric layer and electrically contact the first circuit structure. The second conductive blind holes penetrate through the second dielectric layer and electrically contact the first conductive blind holes respectively. The patterned circuit layer electrically contacts the second conductive blind holes. A manufacturing method of the multi-layer circuit structure is also provided.

公开(公告)号：US10825599B2

公开(公告)日：2020-11-03

申请号：US15818773

申请日：2017-11-21

Applicant: Unimicron Technology Corp.

Inventor： Chang-Fu Chen ,  Chun-Hao Chen ,  Kuan-Hsi Wu ,  Pi-Te Pan

IPC: H01F27/28 ,  H01F27/24 ,  H05K1/11 ,  H05K1/16 ,  H01F17/04 ,  H01F17/00 ,  H01F5/00 ,  H01L23/522

Abstract: A carrier structure includes a substrate, a first patterned circuit layer and at least one magnetic element. The substrate has a first surface and an opening passing through the substrate. The first patterned circuit layer is disposed on the first surface of the substrate and includes an annular circuit for generating an electromagnetic field. The magnetic element is disposed within the opening of the substrate, wherein the magnetic element couples the annular circuit and acts in response to the magnetic force of the electromagnetic field.

公开(公告)号：US20190088401A1

公开(公告)日：2019-03-21

申请号：US15818773

申请日：2017-11-21

Applicant: Unimicron Technology Corp.

Inventor： Chang-Fu Chen ,  Chun-Hao Chen ,  Kuan-Hsi Wu ,  Pi-Te Pan

IPC: H01F27/28 ,  H01F27/24 ,  H05K1/16 ,  H05K1/11

Abstract: A carrier structure includes a substrate, a first patterned circuit layer and at least one magnetic element. The substrate has a first surface and an opening passing through the substrate. The first patterned circuit layer is disposed on the first surface of the substrate and includes an annular circuit for generating an electromagnetic field. The magnetic element is disposed within the opening of the substrate, wherein the magnetic element couples the annular circuit and acts in response to the magnetic force of the electromagnetic field.

公开(公告)号：US20190116667A1

公开(公告)日：2019-04-18

申请号：US15836923

申请日：2017-12-11

Applicant: Unimicron Technology Corp.

Inventor： Chang-Fu Chen ,  Chun-Hao Chen

IPC: H05K1/11 ,  H05K3/46 ,  H05K3/42 ,  H05K3/00

CPC classification number: H05K1/115 ,  H05K3/0023 ,  H05K3/0026 ,  H05K3/0041 ,  H05K3/421 ,  H05K3/423 ,  H05K3/429 ,  H05K3/4644 ,  H05K3/4679 ,  H05K2201/09509 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2203/107

Abstract: A multi-layer circuit structure including a core layer, a first circuit structure, a second circuit structure, and a build-up circuit structure is provided. The first circuit structure and the second circuit structure are respectively disposed on two opposite surfaces of the core layer. The build-up circuit structure includes a first dielectric layer disposed on the first circuit structure, first conductive blind holes, a second dielectric layer disposed on the first dielectric layer, second conductive blind holes, and a patterned circuit layer disposed on the second dielectric layer. The first conductive blind holes penetrate through the first dielectric layer and electrically contact the first circuit structure. The second conductive blind holes penetrate through the second dielectric layer and electrically contact the first conductive blind holes respectively. The patterned circuit layer electrically contacts the second conductive blind holes. A manufacturing method of the multi-layer circuit structure is also provided.

公开(公告)号：US11637060B2

公开(公告)日：2023-04-25

申请号：US17654405

申请日：2022-03-11

Applicant: Unimicron Technology Corp.

Inventor： Chun-Hao Chen ,  Chia-Lung Lin ,  Chien-Hsiang Chou ,  Yi-Lin Chiang ,  Chien-Chen Lin

IPC: H05K1/11 ,  H05K3/40 ,  H01L23/498 ,  H01L21/48 ,  H05K3/06

Abstract: A wiring board includes an insulating layer, a wiring layer and a plurality of conductive columns. The insulating layer has a first surface and a second surface opposite to the first surface. The wiring layer is disposed in the insulating layer and has a third surface and a fourth surface opposite to the third surface. The insulating layer covers the third surface, and the second surface of the insulating layer is flush with the fourth surface of the wiring layer. The conductive columns are disposed in the insulating layer and connected to the wiring layer. The conductive columns extend from the third surface of the wiring layer to the first surface of the insulating layer, and protrude from the first surface.