公开(公告)号：US10319489B2

公开(公告)日：2019-06-11

申请号：US15547033

申请日：2016-02-10

Applicant: University of Houston System

Inventor： Zhifeng Ren ,  Chuanfei Guo ,  Yuan Liu

IPC: H01B1/16 ,  H01B13/00 ,  H01B1/02 ,  H01B1/22 ,  G03C1/00

Abstract: Systems and methods of fabricating electrodes, including thin metallic films, include depositing a first metallic layer on a substrate and passivating the deposited layer. The processes of deposition and passivation may be done sequentially. In some embodiments, a plurality of substrates may be coated with a metallic layer and further processed at a later time, including passivation and disposal of additional layers as discussed herein.

公开(公告)号：US20180025804A1

公开(公告)日：2018-01-25

申请号：US15547033

申请日：2016-02-10

Applicant: University of Houston System

Inventor： Zhifeng Ren ,  Chuanfei Guo ,  Yuan Liu

IPC: H01B1/16 ,  H01B1/22 ,  H01B1/02 ,  H01B13/00

CPC classification number: H01B1/16 ,  H01B1/023 ,  H01B1/026 ,  H01B1/22 ,  H01B13/0036

Abstract: Systems and methods of fabricating electrodes, including thin metallic films, include depositing a first metallic layer on a substrate and passivating the deposited layer. The processes of deposition and passivation may be done sequentially. In some embodiments, a plurality of substrates may be coated with a metallic layer and further processed at a later time, including passivation and disposal of additional layers as discussed herein.