公开(公告)号：AU2002348133A1

公开(公告)日：2003-05-12

申请号：AU2002348133

申请日：2002-10-31

Applicant: VIRTIUM TECHNOLOGY INC

Inventor： HOANG PHAN ,  NGUYEN CHINH ,  HOANG PHU ,  LE ANDY

IPC: H01L25/10 ,  H05K1/14 ,  H05K3/34 ,  H05K1/16

Abstract: In one embodiment of the invention, a stacking element includes a printed circuit board (PCB) and a plurality of solder bumps. The PCB has a top side and a bottom side. The top side is attached to first pins of a first device. The plurality of solder bumps are on the bottom side and attached to upper areas of second pins of a second device to provide electrical connections between the first pins and the second pins.

公开(公告)号：WO03038865A2

公开(公告)日：2003-05-08

申请号：PCT/US0234923

申请日：2002-10-31

Applicant: VIRTIUM TECHNOLOGY INC

Inventor： NGUYEN CHINH ,  HOANG PHU ,  HOANG PHAN ,  LE ANDY

IPC: H01L25/10 ,  H05K1/14 ,  H05K3/34 ,  H01L

CPC classification number: H05K1/141 ,  H01L25/105 ,  H01L2225/107 ,  H01L2924/0002 ,  H05K1/144 ,  H05K3/3421 ,  H05K3/3463 ,  H05K2201/0367 ,  H05K2201/10477 ,  H05K2201/10515 ,  H05K2201/10689 ,  H05K2201/10992 ,  H05K2203/043 ,  Y10T29/49144 ,  Y10T29/49147 ,  H01L2924/00

Abstract: In one embodiment of the invention, a stacking element includes a printed circuit board (PCB) and a plurality of solder bumps. The PCB has a top side and a bottom side. The top side is attached to first pins of a first device. The plurality of solder bumps are on the bottom side and attached to upper areas of second pins of a second device to provide electrical connections between the first pins and the second pins.

Abstract translation: 在本发明的一个实施例中，堆叠元件包括印刷电路板（PCB）和多个焊料凸块。 PCB具有顶侧和底侧。 顶侧连接到第一设备的第一个引脚。 多个焊料凸块位于底侧，并附接到第二器件的第二引脚的上部区域，以提供第一引脚和第二引脚之间的电连接。