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公开(公告)号:DE60122343D1
公开(公告)日:2006-09-28
申请号:DE60122343
申请日:2001-05-10
Applicant: XEROX CORP
Inventor: CHUA L , LEMMI FRANCESCO , VAN SCHUYLENBERGH F , LU PING , FORK K , PEETERS ERIC , SUN DECAI , SMITH L , ROMANO T
IPC: G03C5/56 , H01F41/04 , G01R1/067 , G01R3/00 , G03C5/00 , G03C5/58 , G03F7/00 , H01F17/00 , H01F17/02 , H01F27/29 , H01L21/02 , H01L21/027 , H01L21/60 , H01L21/768 , H01L23/485 , H01L23/49 , H01L23/498 , H01L23/522 , H01L33/00 , H01R9/03 , H05K7/02
Abstract: An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate (14) plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member (61 a) having an intrinsic stress profile. The intrinsic stress profile biases a free portion (11) away from the substrate (14) forming a loop winding (142). An anchor portion (12) remains fixed to the substrate (14). The free portion end becomes a second anchor portion (61 c) which may be connected to the substrate (14) via soldering or plating. A series of individual coil structures (140) can be joined via their anchor portions to form inductors and transformers.
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公开(公告)号:DE60122343T2
公开(公告)日:2006-12-14
申请号:DE60122343
申请日:2001-05-10
Applicant: XEROX CORP
Inventor: CHUA L , LEMMI FRANCESCO , VAN SCHUYLENBERGH F , LU PING , FORK K , PEETERS ERIC , SUN DECAI , SMITH L , ROMANO T
IPC: G03C5/56 , H01F41/04 , G01R1/067 , G01R3/00 , G03C5/00 , G03C5/58 , G03F7/00 , H01F17/00 , H01F17/02 , H01F27/29 , H01L21/02 , H01L21/027 , H01L21/60 , H01L21/768 , H01L23/485 , H01L23/49 , H01L23/498 , H01L23/522 , H01L33/00 , H01R9/03 , H05K7/02
Abstract: An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate (14) plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member (61 a) having an intrinsic stress profile. The intrinsic stress profile biases a free portion (11) away from the substrate (14) forming a loop winding (142). An anchor portion (12) remains fixed to the substrate (14). The free portion end becomes a second anchor portion (61 c) which may be connected to the substrate (14) via soldering or plating. A series of individual coil structures (140) can be joined via their anchor portions to form inductors and transformers.
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