Method for connecting at last one wire conductor disposed on a substrate with a chip of a transponder unit
    1.
    发明公开
    Method for connecting at last one wire conductor disposed on a substrate with a chip of a transponder unit 有权
    一种用于在一个转发器单元,其具有芯片的基板上连接至少一个电线导体的方法

    公开(公告)号:EP2302566A1

    公开(公告)日:2011-03-30

    申请号:EP09012053.6

    申请日:2009-09-22

    Abstract: Method for connecting at least one wire conductor (6) with at least one terminal device (22a, 22b) of a chip module (5) for producing a transponder device (1) comprising a coil device (2) and said chip module (5), wherein, in a first method step, the coil device (2) is disposed and fixed on a substrate (3),and, in a further method step, the wire conductor (6) of the coil device (2) is connected to the chip module (5), characterised in that , during the first method step, end portions (7a, 7b) of the wire conductor (6) are laid so as to extend across the accommodating window (4) in a spaced-apart relation in a central area (Z) of an accommodating window (4) for the chip module (5), the partial areas (8a, 8b) of the wire conductor (6) extending across the accommodating window (4) are displaced from said central area (Z) towards a corresponding edge (23a, 23b) of the accommodating window (4) by means of a positioning device (3) until at least a section of the partial area (8a, 8b) extends over the desired position of a terminal area (22a, 22b), the chip module (5) is subsequently inserted into the accommodating window (4) and the section is then connected in an electrically conductive manner with the terminal area (22a, 22b).

    Abstract translation: 用于连接至少一个线导体的方法(6)与至少一个终端设备(22A,22B)的芯片模块(5),用于生产(1),包括线圈装置的应答器设备(2)和所述芯片模块(5 )worin,在第一方法步骤中,将线圈装置(2)设置并固定在一个基片(3),并且在进一步的方法步骤中,导线导体(6),线圈装置(2)连接 到芯片模块(5),在第一方法步骤中该特征的,端部(7A,7B)的金属丝导体(6)布置成以间隔开的穿过容纳窗口(4)延伸的 在容纳窗口的中心区域(Z)的关系(4)芯片模块(5),该部分区域(8A,8B)的金属丝导体(6)在整个容纳窗口延伸的(4)从所述移位 中央区域(Z)朝向相应的边缘(23A,23B)通过定位装置的手段的容纳窗口(4)的(3),直到至少部分区域的部分(8A,8B)延伸 在终端区域的所希望的位置(22A,22B),所述芯片模块(5)随后插入到容纳窗(4)和部分随后与终端区域连接在导电的方式(22A,22B) ,

Patent Agency Ranking