公开(公告)号：EP4078674B1

公开(公告)日：2024-05-15

申请号：EP20823860.0

申请日：2020-12-16

IPC: H01L25/075 ,  H01L33/56 ,  H01L33/62 ,  H05K1/18 ,  H05K3/28

CPC classification number: H01L25/0753 ,  H01L33/62 ,  H01L33/56 ,  H05K3/284 ,  H05K2201/1010620130101 ,  H05K1/184 ,  H05K1/0274 ,  H05K2201/010820130101 ,  H05K1/095

公开(公告)号：EP4425708A2

公开(公告)日：2024-09-04

申请号：EP24188182.0

申请日：2018-11-29

Applicant: Dai Nippon Printing Co., Ltd.

Inventor： SUZUKI, Koichi ,  TAKE, Seiji ,  MATSUURA, Daisuke

IPC: H01Q5/10

CPC classification number: H05K1/0274 ,  H05K1/0287 ,  H05K3/108 ,  H05K1/165 ,  H05K2201/1009820130101 ,  H05K2201/0968120130101 ,  H05K2201/0927220130101 ,  H05K2203/010820130101 ,  H05K2201/010820130101 ,  H05K2201/0972720130101 ,  H05K2201/0928120130101 ,  H01Q1/36

Abstract: A wiring board (10) comprising: a substrate (11) having transparency; and an antenna pattern region (20) which is arranged on the substrate (11) and includes a plurality of antenna wirings (21) having a function as an antenna, wherein an aperture ratio (Ac) of a widthwise central portion (20c) of the antenna pattern region (20) is higher than an aperture ratio (Ae) of a widthwise edge portion (20e1, 20e2) of the antenna pattern region (20).

公开(公告)号：EP4406372A1

公开(公告)日：2024-07-31

申请号：EP22786280.2

申请日：2022-09-18

Applicant: ofs - Beteiligungs - GmbH Holding

Inventor： KRAFT, Peter ,  REUTER, Julian ,  KÖHN, Moritz ,  GRÜNEBERGER, Felix

IPC: H05K1/03 ,  B27K9/00 ,  D06M11/00 ,  H05K1/02 ,  H05K1/16 ,  H05K3/40

CPC classification number: B27K9/00 ,  H05K1/0313 ,  H05K2201/029320130101 ,  H05K2201/028720130101 ,  H05K2201/011620130101 ,  H05K2201/010820130101 ,  H05K2201/1005320130101 ,  H05K3/4069 ,  H05K2201/0956320130101 ,  H05K2201/1071220130101 ,  H05K2201/0930920130101 ,  H05K1/162 ,  H05K2201/1015120130101

公开(公告)号：EP3276684B1

公开(公告)日：2024-09-18

申请号：EP16789458.3

申请日：2016-04-28

IPC: H01L33/62 ,  F21S2/00 ,  F21V19/00 ,  F21V23/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/28

CPC classification number: F21S2/00 ,  F21V19/00 ,  F21V23/00 ,  H01L33/62 ,  H01L2924/18120130101 ,  H01L2224/1622520130101 ,  H05K1/0274 ,  H05K1/189 ,  H05K3/284 ,  H05K2201/010820130101 ,  H05K2201/012920130101 ,  H05K2201/013320130101 ,  H05K2201/014520130101 ,  H05K2201/0968120130101 ,  H05K2201/1010620130101

公开(公告)号：EP4397142A2

公开(公告)日：2024-07-10

申请号：EP22762156.2

申请日：2022-08-29

Applicant: Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO

Inventor： HARKEMA, Stephan ,  TEUNISSEN, Jean-Pierre ,  RENTROP, Cornelis Hermanus Arnoldus ,  DE KOK, Margaretha Maria

IPC: H05K3/22 ,  H05K3/28

CPC classification number: H05K2201/207220130101 ,  H05K2203/17820130101 ,  H05K2203/17620130101 ,  H05K3/22 ,  H05K2203/078320130101 ,  H05K2203/132720130101 ,  H05K2203/132220130101 ,  H05K3/284 ,  H05K2203/131620130101 ,  H05K1/0393 ,  H05K1/119 ,  H05K2203/07420130101 ,  H05K2203/074620130101 ,  H05K2203/076320130101 ,  H05K2201/0906320130101 ,  H05K3/0014 ,  H05K1/0284 ,  H05K2201/010820130101 ,  H05K2201/011220130101 ,  H05K2201/1010620130101 ,  H05K2201/1011320130101 ,  H05K2201/1012820130101 ,  H05K2201/0993620130101

公开(公告)号：EP4340555A3

公开(公告)日：2024-09-04

申请号：EP24155860.0

申请日：2018-06-11

Applicant: AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

Inventor： Stahr, Johannes ,  Weidinger, Gerald ,  Schmid, Gerhard ,  Zluc, Andreas

IPC: H05K1/18 ,  H05K3/46

CPC classification number: H05K1/185 ,  H05K1/186 ,  H05K3/4602 ,  H05K2201/010820130101 ,  H05K2201/0906320130101 ,  H05K2201/0907220130101 ,  H05K2201/0912720130101 ,  H05K2201/0984520130101 ,  H05K2201/1012120130101 ,  H05K2201/1051520130101 ,  H05K2203/015620130101 ,  H05K2203/019120130101 ,  H05K2203/06320130101 ,  H05K2203/146920130101

Abstract: Described are component carriers (100; 200a, 200b) comprising a stepped cavity (150; 250) into which a stepped component assembly (160; 260) is embedded. The component carriers comprise (a) fully cured electrically insulating material (M) originating from at least one electrically insulating layer structure (112) of the component carrier (100) and circumferentially surrounding the stepped component assembly (160) and/or (b) an undercut (254a) in a transition region between a narrow recess (252) and a wide recess (254) of the stepped cavity (250). Further described are methods for manufacturing such component carriers (100; 200a, 200b).

公开(公告)号：EP3720256B1

公开(公告)日：2024-08-07

申请号：EP18883753.8

申请日：2018-11-29

IPC: H05K1/02 ,  H05K3/10 ,  H01Q1/36 ,  H01Q5/10 ,  H05K1/16

CPC classification number: H05K1/0274 ,  H05K1/0287 ,  H05K3/108 ,  H05K1/165 ,  H05K2201/1009820130101 ,  H05K2201/0968120130101 ,  H05K2201/0927220130101 ,  H05K2203/010820130101 ,  H05K2201/010820130101 ,  H05K2201/0972720130101 ,  H05K2201/0928120130101 ,  H01Q1/36