公开(公告)号：EP4397142A2

公开(公告)日：2024-07-10

申请号：EP22762156.2

申请日：2022-08-29

Applicant: Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO

Inventor： HARKEMA, Stephan ,  TEUNISSEN, Jean-Pierre ,  RENTROP, Cornelis Hermanus Arnoldus ,  DE KOK, Margaretha Maria

IPC: H05K3/22 ,  H05K3/28

CPC classification number: H05K2201/207220130101 ,  H05K2203/17820130101 ,  H05K2203/17620130101 ,  H05K3/22 ,  H05K2203/078320130101 ,  H05K2203/132720130101 ,  H05K2203/132220130101 ,  H05K3/284 ,  H05K2203/131620130101 ,  H05K1/0393 ,  H05K1/119 ,  H05K2203/07420130101 ,  H05K2203/074620130101 ,  H05K2203/076320130101 ,  H05K2201/0906320130101 ,  H05K3/0014 ,  H05K1/0284 ,  H05K2201/010820130101 ,  H05K2201/011220130101 ,  H05K2201/1010620130101 ,  H05K2201/1011320130101 ,  H05K2201/1012820130101 ,  H05K2201/0993620130101

公开(公告)号：EP4266837A3

公开(公告)日：2024-06-05

申请号：EP23187766.3

申请日：2017-08-11

Applicant: Apple Inc.

Inventor： STANLEY, Craig M. ,  PORTER, Simon K. ,  SHEERIN, John H. ,  TRAINER, Glenn K. ,  DELLA ROSA, Jason C. ,  HUWE, Ethan L. ,  MCINTOSH, Sean T. ,  WANG, Erik L. ,  STRINGER, Christopher J. ,  ANDERSON, Molly J. ,  PARKER, Samuel G. ,  WU, Meiting ,  MENDEZ, Javier ,  LIU, Rong ,  COUSINS, Benjamin A. ,  SUN, Yupin ,  QI, Jun ,  BRINSFIELD, Jason W.

IPC: H04R1/02 ,  G06F3/01 ,  H04R1/26 ,  H04R1/28 ,  H04R1/30 ,  H04R1/40 ,  H04R3/12 ,  H04R5/02 ,  H04R31/00 ,  H04R9/02

CPC classification number: H04R1/026 ,  H04R1/26 ,  H04R1/30 ,  H04R5/02 ,  H04R31/006 ,  H04R2201/40120130101 ,  H04R2400/1320130101 ,  H04R2420/0720130101 ,  H03K17/962 ,  H05K1/0274 ,  H05K1/141 ,  H05K2201/0906320130101 ,  H05K2201/1010620130101 ,  H05K2201/1037820130101 ,  G06F3/0202 ,  G06F3/041 ,  G06F3/03547 ,  H03K2217/96078520130101 ,  H04R1/025 ,  H04R1/403 ,  H04R3/12 ,  H04R2201/3420130101 ,  H04R1/2826 ,  G06F3/044 ,  H04R9/022 ,  H04R2201/02820130101

Abstract: This disclosure relates to speakers and more specifically to an array speaker for distributing music uniformly across a room. A number of audio drivers can be radially distributed within a speaker housing so that an output of the drivers is distributed evenly throughout the room. In some embodiments, the exit geometry of the audio drivers can be configured to bounce off a surface supporting the array speaker to improve the distribution of music throughout the room. The array speaker can include a number of vibration isolation elements distributed within a housing of the array speaker. The vibration isolation elements can be configured reduce the strength of forces generated by a subwoofer of the array speaker.

公开(公告)号：EP4340555A3

公开(公告)日：2024-09-04

申请号：EP24155860.0

申请日：2018-06-11

Applicant: AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

Inventor： Stahr, Johannes ,  Weidinger, Gerald ,  Schmid, Gerhard ,  Zluc, Andreas

IPC: H05K1/18 ,  H05K3/46

CPC classification number: H05K1/185 ,  H05K1/186 ,  H05K3/4602 ,  H05K2201/010820130101 ,  H05K2201/0906320130101 ,  H05K2201/0907220130101 ,  H05K2201/0912720130101 ,  H05K2201/0984520130101 ,  H05K2201/1012120130101 ,  H05K2201/1051520130101 ,  H05K2203/015620130101 ,  H05K2203/019120130101 ,  H05K2203/06320130101 ,  H05K2203/146920130101

Abstract: Described are component carriers (100; 200a, 200b) comprising a stepped cavity (150; 250) into which a stepped component assembly (160; 260) is embedded. The component carriers comprise (a) fully cured electrically insulating material (M) originating from at least one electrically insulating layer structure (112) of the component carrier (100) and circumferentially surrounding the stepped component assembly (160) and/or (b) an undercut (254a) in a transition region between a narrow recess (252) and a wide recess (254) of the stepped cavity (250). Further described are methods for manufacturing such component carriers (100; 200a, 200b).

公开(公告)号：EP3598855B1

公开(公告)日：2024-04-17

申请号：EP18847835.8

申请日：2018-04-27

IPC: H05K1/02 ,  H05K3/00

CPC classification number: H05K2203/16720130101 ,  H05K2201/200920130101 ,  H05K1/0277 ,  H05K2201/0906320130101 ,  H05K1/028 ,  H05K3/0008 ,  H05K1/0281

公开(公告)号：EP4432791A2

公开(公告)日：2024-09-18

申请号：EP24183664.2

申请日：2021-03-12

Applicant: Ascensia Diabetes Care Holdings AG

Inventor： Gofman, Igor Y.

IPC: H05K3/40

CPC classification number: H05K1/115 ,  H05K1/113 ,  H05K3/321 ,  H05K2201/1003720130101 ,  H05K2201/05620130101 ,  H05K1/189 ,  H05K2201/05320130101 ,  H05K2201/0906320130101 ,  H05K2201/097920130101 ,  H05K1/095 ,  H05K3/4069 ,  H05K3/1283 ,  Y02E60/10

Abstract: A flexible printed circuit board (PCB) may have one or more coin cell batteries mounted thereto such that the flexibility of the flexible PCB is maintained. The flexible PCB has one or more battery contact pads fabricated thereon. Each battery contact pad includes a pattern of metalized vias each extending from a top surface to a bottom surface of the flexible PCB. A coin cell battery may be positioned over or under the battery contact pad. Conductive light curable epoxy is applied to and in each metalized via to contact and adhere to the coin cell battery to form a conductive path from the battery through the battery contact pad to printed conductors on the flexible PCB. Methods of mounting one or more coin cell batteries to a flexible PCB are also provided, as are other aspects.

公开(公告)号：EP4420491A2

公开(公告)日：2024-08-28

申请号：EP22840388.7

申请日：2022-11-18

Applicant: Kollmorgen Corporation

Inventor： BREWSTER, Jeffery Todd ,  HAWLEY, Heather Cassidy ,  ANDERSON IV, William Edward ,  WOOD, Tyler William ,  MIDKIFF, George Edward ,  CANTANDO, Elizabeth

IPC: H05K1/02 ,  H05K3/34 ,  H02K15/00

CPC classification number: H05K1/0269 ,  H05K2201/0991820130101 ,  H05K2201/096920130101 ,  H05K2201/0906320130101 ,  H05K2201/0972720130101 ,  H05K2201/0948120130101 ,  H05K2201/093920130101 ,  H05K3/3421 ,  H05K2201/0938120130101 ,  H05K2201/0902720130101 ,  H05K2201/1028720130101 ,  H02K2203/0320130101 ,  H02K3/522 ,  H02K3/50

公开(公告)号：EP4420200A1

公开(公告)日：2024-08-28

申请号：EP22840385.3

申请日：2022-11-18

Applicant: Kollmorgen Corporation

Inventor： BREWSTER, Jeffery Todd ,  ANDERSON William Edward, IV ,  WOOD, Tyler William ,  CANTANDO, Elizabeth

IPC: H01R13/58 ,  H05K1/02 ,  H01R12/77 ,  H05K5/00 ,  H05K3/34 ,  H05K3/30 ,  H05K7/06 ,  H05K7/12 ,  H02G3/32

CPC classification number: H05K2201/207220130101 ,  H05K2201/1035620130101 ,  H05K3/3405 ,  H05K1/0271 ,  H05K2201/0906320130101 ,  H05K3/301 ,  H05K2201/1060620130101 ,  H02G3/32

公开(公告)号：EP4404697A1

公开(公告)日：2024-07-24

申请号：EP23213160.7

申请日：2023-11-29

Applicant: Meta Platforms Technologies, LLC

Inventor： LI, Qiuming ,  ELDRIDGE, Colden Niles ,  LEI, Ming ,  LIU, Yibo ,  ISLAM, Md Rashidul ,  OH, Sung Hoon

IPC: H05K3/40 ,  H05K1/02 ,  H05K3/28

CPC classification number: H05K2201/1040920130101 ,  H05K2201/1009820130101 ,  H05K2201/1037120130101 ,  H05K1/0215 ,  H05K1/0243 ,  H05K2201/102520130101 ,  H05K3/284 ,  H05K2203/132720130101 ,  H05K2203/131620130101 ,  H05K2201/0906320130101 ,  H01L23/552

Abstract: A circuit package may comprise (1) a substrate, (2) at least one radio frequency (RF) circuit disposed on the substrate, and (3) a plurality of screw holes that are incorporated into the substrate and configured to support mounting the substrate to an enclosure, wherein at least one of the screw holes is further configured to provide at least one supplemental function in connection with the RF circuit. Various other apparatuses, systems, and methods are also disclosed.

公开(公告)号：EP4193814B1

公开(公告)日：2024-06-05

申请号：EP21791371.4

申请日：2021-10-14

IPC: H05K1/02 ,  C04B37/02 ,  H05K1/14 ,  H05K1/03 ,  H05K3/46

CPC classification number: H05K1/0204 ,  H05K1/142 ,  H05K3/4694 ,  H05K1/0306 ,  H05K2201/018720130101 ,  H05K2201/0903620130101 ,  H05K2201/0906320130101 ,  H05K2201/0915420130101 ,  H05K2201/1010620130101 ,  H05K2201/1041620130101 ,  H05K2201/0916320130101 ,  H05K2201/20920130101 ,  H05K2201/04820130101 ,  H05K2201/06820130101 ,  C04B37/023 ,  C04B2237/34320130101 ,  C04B2237/3420130101 ,  C04B2237/36520130101 ,  C04B2237/36820130101 ,  C04B2237/36620130101 ,  C04B2237/40720130101 ,  C04B2237/40220130101 ,  C04B2237/40320130101 ,  C04B2237/0420130101 ,  C04B2237/12220130101

公开(公告)号：EP4376436A1

公开(公告)日：2024-05-29

申请号：EP22845817.0

申请日：2022-07-12

Applicant: Denso Electronics Corporation

Inventor： MIYATA Susumu

IPC: H04R1/02

CPC classification number: H05K2201/0906320130101 ,  H05K2201/1008320130101 ,  H05K1/18 ,  B60Q5/00 ,  H04R1/021 ,  H04R1/023 ,  H04R2499/1320130101 ,  H04R9/06

Abstract: An electric device includes an electric board (7) having a board hole (7a), a housing accommodating the electric board, a shaft portion (30) disposed in the housing and inserted into the board hole, a recessed portion (44) disposed in the housing, and a bonding portion (45). The bonding portion is interposed between the shaft portion and the recessed portion and between the recessed portion and a hole peripheral portion (73) of the electric board that forms a peripheral edge of the board hole, and bonds the shaft portion, the hole peripheral portion, and the recessed portion. The board hole has a size such that a radial gap is provided between the hole peripheral portion of the electric board and the shaft portion.