公开(公告)号：EP4410061A1

公开(公告)日：2024-08-07

申请号：EP21786850.4

申请日：2021-10-01

Applicant: Telefonaktiebolaget LM Ericsson (publ)

Inventor： LJUNGBRO, Agneta ,  NYLANDER, Emil ,  INGELHAG, Per

IPC: H05K1/02 ,  H05K3/00

CPC classification number: H05K3/0061 ,  H05K1/021 ,  H05K1/0221 ,  H05K1/0243 ,  H05K2201/0974520130101 ,  H05K2201/0980920130101 ,  H05K2201/1009820130101

公开(公告)号：EP4402503A1

公开(公告)日：2024-07-24

申请号：EP22776919.7

申请日：2022-09-07

Applicant: Robert Bosch GmbH

Inventor： HIMMELSTOSS, Armin

IPC: G01S7/03 ,  H01P5/08 ,  H05K1/02

CPC classification number: G01S7/032 ,  H01P5/087 ,  H05K1/0243 ,  H05K2201/1009820130101 ,  H05K3/3436

公开(公告)号：EP3903377B1

公开(公告)日：2024-07-03

申请号：EP20778501.5

申请日：2020-03-27

IPC: H01Q1/02 ,  H01Q1/22 ,  H01Q1/24 ,  G06F1/20

CPC classification number: H04M1/0277 ,  H04B1/3888 ,  H01Q1/243 ,  H01Q1/526 ,  H01Q1/38 ,  H01Q1/40 ,  H05K1/165 ,  H05K2201/1009820130101 ,  H05K1/0393 ,  H05K1/147 ,  H05K1/0224 ,  G06F1/1635

公开(公告)号：EP4174369B8

公开(公告)日：2024-10-09

申请号：EP21833384.7

申请日：2021-06-25

IPC: H01Q1/44 ,  H01Q13/10 ,  H05K1/02 ,  F21V23/04 ,  F21K9/00 ,  F21Y103/33 ,  F21Y115/10

CPC classification number: Y02B20/40 ,  H01Q1/44 ,  H01Q13/10 ,  F21K9/00 ,  F21Y2115/1020160801 ,  F21Y2103/3320160801 ,  F21V23/045 ,  H05K1/0237 ,  H05K2201/1009820130101 ,  H05K2201/0902720130101 ,  H05K2201/0906320130101 ,  H05K2201/1010620130101 ,  H05K2201/1028720130101 ,  H05K1/0207

公开(公告)号：EP4406373A1

公开(公告)日：2024-07-31

申请号：EP22873791.2

申请日：2022-09-16

Applicant: Jabil Inc.

Inventor： TIMMINS, Ian, Jeffery ,  RAFIE, Babak, Zarrin ,  FALTONE, Youssef ,  FINNELL, John

IPC: H05K1/18

CPC classification number: H01Q1/38 ,  H05K2201/1009820130101 ,  H05K1/165 ,  H05K1/181 ,  H05K1/0298 ,  H01Q9/0407 ,  H01Q21/06 ,  H01Q3/34 ,  H01Q21/0006 ,  H01Q1/241

公开(公告)号：EP4352652A1

公开(公告)日：2024-04-17

申请号：EP22733905.8

申请日：2022-05-30

Applicant: EYCO

Inventor： EYMARD, Eric

IPC: G06K19/077 ,  H05K1/18 ,  H01L23/498 ,  H05K3/46

CPC classification number: H05K1/188 ,  H05K1/185 ,  H05K2203/146920130101 ,  H05K2203/154520130101 ,  H05K2201/1009820130101 ,  H05K3/4644 ,  G06K19/07745 ,  H01L23/49855 ,  H01L21/4857 ,  G06K19/0775

公开(公告)号：EP4425708A2

公开(公告)日：2024-09-04

申请号：EP24188182.0

申请日：2018-11-29

Applicant: Dai Nippon Printing Co., Ltd.

Inventor： SUZUKI, Koichi ,  TAKE, Seiji ,  MATSUURA, Daisuke

IPC: H01Q5/10

CPC classification number: H05K1/0274 ,  H05K1/0287 ,  H05K3/108 ,  H05K1/165 ,  H05K2201/1009820130101 ,  H05K2201/0968120130101 ,  H05K2201/0927220130101 ,  H05K2203/010820130101 ,  H05K2201/010820130101 ,  H05K2201/0972720130101 ,  H05K2201/0928120130101 ,  H01Q1/36

Abstract: A wiring board (10) comprising: a substrate (11) having transparency; and an antenna pattern region (20) which is arranged on the substrate (11) and includes a plurality of antenna wirings (21) having a function as an antenna, wherein an aperture ratio (Ac) of a widthwise central portion (20c) of the antenna pattern region (20) is higher than an aperture ratio (Ae) of a widthwise edge portion (20e1, 20e2) of the antenna pattern region (20).

公开(公告)号：EP4406029A1

公开(公告)日：2024-07-31

申请号：EP22873787.0

申请日：2022-09-16

Applicant: Jabil Inc.

Inventor： TIMMINS, Ian, Jeffery ,  RAFIE, Babak, Zarrin ,  FALTONE, Youssef ,  FINNELL, John

IPC: H01L27/10 ,  H01Q3/26 ,  H01Q9/04 ,  H05K1/02

CPC classification number: H01Q3/26 ,  H01Q1/2283 ,  H01Q21/065 ,  H01Q1/40 ,  H01Q1/523 ,  H05K2201/1009820130101 ,  H05K1/0243 ,  H05K2201/0961820130101

公开(公告)号：EP4404697A1

公开(公告)日：2024-07-24

申请号：EP23213160.7

申请日：2023-11-29

Applicant: Meta Platforms Technologies, LLC

Inventor： LI, Qiuming ,  ELDRIDGE, Colden Niles ,  LEI, Ming ,  LIU, Yibo ,  ISLAM, Md Rashidul ,  OH, Sung Hoon

IPC: H05K3/40 ,  H05K1/02 ,  H05K3/28

CPC classification number: H05K2201/1040920130101 ,  H05K2201/1009820130101 ,  H05K2201/1037120130101 ,  H05K1/0215 ,  H05K1/0243 ,  H05K2201/102520130101 ,  H05K3/284 ,  H05K2203/132720130101 ,  H05K2203/131620130101 ,  H05K2201/0906320130101 ,  H01L23/552

Abstract: A circuit package may comprise (1) a substrate, (2) at least one radio frequency (RF) circuit disposed on the substrate, and (3) a plurality of screw holes that are incorporated into the substrate and configured to support mounting the substrate to an enclosure, wherein at least one of the screw holes is further configured to provide at least one supplemental function in connection with the RF circuit. Various other apparatuses, systems, and methods are also disclosed.

公开(公告)号：EP3759763B1

公开(公告)日：2024-06-19

申请号：EP19760389.7

申请日：2019-02-27

IPC: H01Q21/28 ,  H01Q21/24 ,  H01Q1/00 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q9/42 ,  H04B7/0413 ,  H05K1/14

CPC classification number: H04B7/0413 ,  H01Q21/28 ,  H01Q21/24 ,  H01Q9/42 ,  H01Q1/007 ,  H01Q1/48 ,  H01Q1/38 ,  H05K1/141 ,  H05K2201/1009820130101