公开(公告)号：US11777186B2

公开(公告)日：2023-10-03

申请号：US16647319

申请日：2018-09-14

Applicant: ALLEN-VANGUARD CORPORATION

Inventor： Sulav Adhikari ,  Ernst Wallisch, Jr.

IPC: H01P1/213 ,  H01P1/207 ,  H01P3/12 ,  H04W88/08 ,  H05K1/11 ,  H05K1/18 ,  H05K3/34 ,  H01P1/208 ,  H01P11/00

CPC classification number: H01P1/2138 ,  H01P1/207 ,  H01P1/2088 ,  H01P3/121 ,  H01P11/007 ,  H04W88/08 ,  H05K1/115 ,  H05K1/18 ,  H05K3/3494 ,  H05K2201/015 ,  H05K2201/037 ,  H05K2201/09609 ,  H05K2201/09985

Abstract: System, apparatuses and methods are disclosed which relate to the use of substrate integrated waveguide technology in front-end modules. An example circuit card assembly for use as a cellular base station front-end is disclosed which includes at least one component printed circuit board (PCB) layer having front-end module hardware components and at least one filter PCB layer including at least one substrate integrated waveguide (SIW) filter.

公开(公告)号：US20240332772A1

公开(公告)日：2024-10-03

申请号：US18526349

申请日：2023-12-01

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Hiroshi TANEDA ,  Tatsuki SUMI ,  Yoko NAKABAYASHI

IPC: H01P3/12 ,  H01P11/00 ,  H05K1/02 ,  H05K3/46

CPC classification number: H01P3/121 ,  H01P3/122 ,  H01P11/002 ,  H05K1/0237 ,  H05K3/4682 ,  H05K2201/09985 ,  H05K2203/0723 ,  H05K2203/107

Abstract: A wiring board has a built-in post wall waveguide having a region surrounded by two mutually opposing conductors and first and second post walls connecting the two conductors and serving as a transmission path for electromagnetic waves. The conductors oppose each other with insulating layers interposed therebetween. The first post wall has first columnar portions, formed by a laminate of via interconnects penetrating the insulating layers, arranged at predetermined intervals in a first direction in which the electromagnetic waves are transmitted. The second post wall has second columnar portions similar to the first columnar portions. In a cross sectional view taken in a second direction perpendicular to the first direction, an interval between adjacent via interconnects in one of the insulating layers not in contact with the conductor is wider than an interval between adjacent via interconnects in two of the insulating layers in contact with the two conductors, respectively.

公开(公告)号：US12010790B2

公开(公告)日：2024-06-11

申请号：US17504401

申请日：2021-10-18

Applicant: Robert Bosch GmbH

Inventor： Christian Hollaender ,  Klaus Baur ,  Gustav Klett ,  Klaus Voigtlaender ,  Michael Schoor ,  Ronny Ludwig

IPC: H05K1/02 ,  H01Q1/52 ,  H01Q21/06 ,  H01Q23/00

CPC classification number: H05K1/0243 ,  H01Q1/526 ,  H01Q21/064 ,  H01Q23/00 ,  H05K2201/09985 ,  H05K2201/10098 ,  H05K2201/1059

Abstract: A high-frequency circuit including a circuit board which bears at least one electronic component and a conductor structure, and including a waveguide structure manufactured separately from the circuit board. The waveguide structure is positioned on the circuit board in such a way that high-frequency signals are transferable between the conductor structure on the circuit board and the waveguide structure. The waveguide structure is held with the aid of press-fit pins on the circuit board.

公开(公告)号：US11757166B2

公开(公告)日：2023-09-12

申请号：US17155949

申请日：2021-01-22

Applicant: Aptiv Technologies Limited

Inventor： Biswadeep Das Gupta ,  Sara J. Cavazos ,  Kurt E. Gilbertson

IPC: H01P5/107 ,  H01Q1/22 ,  H05K1/18 ,  H01Q1/32

CPC classification number: H01P5/107 ,  H01Q1/2283 ,  H01Q1/3233 ,  H05K1/181 ,  H05K2201/037 ,  H05K2201/09985 ,  H05K2201/10098

Abstract: Waveguide assemblies are described that utilize a surface-mount waveguide for vertical transitions of a printed circuit board (PCB). The surface-mount waveguide enables low transmission-loss (e.g., increased return-loss bandwidth) by utilizing a waveguide cavity positioned over a plated slot to efficiently transfer electromagnetic energy from one side of the PCB to another side. The waveguide cavity is designed to excite two resonant peaks of the EM energy to reduce a return-loss of power and increase power delivered to an antenna while supporting a high bandwidth of EM energy. Furthermore, the surface-mount waveguide does not require precise fabrication often required for vertical transitions, allowing the surface-mount waveguide to be compatible with low-cost PCB materials (e.g., hybrid PCB stack-ups).

公开(公告)号：US12074357B2

公开(公告)日：2024-08-27

申请号：US17389605

申请日：2021-07-30

Applicant: BOARDTEK ELECTRONICS CORPORATION

Inventor： Chung-Hsing Liao

IPC: H01P3/12 ,  H01P5/107 ,  H01Q9/04 ,  H05K1/02 ,  H05K1/18 ,  H05K3/24 ,  H05K3/42 ,  H05K3/46

CPC classification number: H01P3/121 ,  H01P5/107 ,  H01Q9/045 ,  H05K1/0218 ,  H05K1/0298 ,  H05K1/18 ,  H05K3/243 ,  H05K3/429 ,  H05K3/4652 ,  H05K3/4664 ,  H05K3/4697 ,  H05K2201/0367 ,  H05K2201/0723 ,  H05K2201/09981 ,  H05K2201/09985 ,  H05K2201/10098 ,  H05K2201/10507 ,  H05K2203/0723

Abstract: An electromagnetic wave transmission board proofed against internal signal leakage includes an inner plate, a first outer plate, a second outer plate, a first plate bump, a first conductive bump, a second plate bump, and a second conductive bump. The inner plate defines a first through hole with a plated metal layer on the hole wall. The first and second plated bumps are disposed between the first outer and inner plates. The second plate bump and the second conductive bump are disposed between the second outer plate and the inner plate. The plate metal layer, the first plate bump, the first conductive bump, the first outer plate, the second outer plate, the second conductive bump, and the second plated bump jointly form an air-filled chamber. A method for manufacturing the electromagnetic wave transmission board is also provided.

公开(公告)号：US20240030575A1

公开(公告)日：2024-01-25

申请号：US18478858

申请日：2023-09-29

Applicant: ALLEN-VANGUARD CORPORATION

Inventor： Sulav ADHIKARI ,  Ernst WALLISCH, JR.

IPC: H01P1/213 ,  H01P1/207 ,  H01P3/12 ,  H04W88/08 ,  H05K1/11 ,  H05K1/18 ,  H05K3/34 ,  H01P1/208 ,  H01P11/00

CPC classification number: H01P1/2138 ,  H01P1/207 ,  H01P3/121 ,  H04W88/08 ,  H05K1/115 ,  H05K1/18 ,  H05K3/3494 ,  H01P1/2088 ,  H01P11/007 ,  H05K2201/09985 ,  H05K2201/015 ,  H05K2201/037 ,  H05K2201/09609

Abstract: System, apparatuses and methods are disclosed which relate to the use of substrate integrated waveguide technology in front-end modules. An example circuit card assembly for use as a cellular base station front-end is disclosed which includes at least one component printed circuit board (PCB) layer having front-end module hardware components and at least one filter PCB layer including at least one substrate integrated waveguide (SIW) filter.