-
公开(公告)号:EP4420491A2
公开(公告)日:2024-08-28
申请号:EP22840388.7
申请日:2022-11-18
Applicant: Kollmorgen Corporation
Inventor: BREWSTER, Jeffery Todd , HAWLEY, Heather Cassidy , ANDERSON IV, William Edward , WOOD, Tyler William , MIDKIFF, George Edward , CANTANDO, Elizabeth
CPC classification number: H05K1/0269 , H05K2201/0991820130101 , H05K2201/096920130101 , H05K2201/0906320130101 , H05K2201/0972720130101 , H05K2201/0948120130101 , H05K2201/093920130101 , H05K3/3421 , H05K2201/0938120130101 , H05K2201/0902720130101 , H05K2201/1028720130101 , H02K2203/0320130101 , H02K3/522 , H02K3/50
-
公开(公告)号:EP4395474A1
公开(公告)日:2024-07-03
申请号:EP23209794.9
申请日:2023-11-14
Applicant: Japan Aviation Electronics Industry, Limited
Inventor: ASHIBU, Kenta
IPC: H05K1/03 , H05K3/30 , H05K1/18 , H01R12/59 , H01R12/61 , H05K1/11 , H05K1/14 , H01R12/77 , H01R13/24 , H01R12/70
CPC classification number: H01R12/774 , H05K1/189 , H01R13/2421 , H01R12/592 , H05K1/038 , H05K1/115 , H05K3/308 , H05K1/147 , H05K2201/1029520130101 , H05K2201/1018920130101 , H05K2201/1028720130101 , H05K2201/105920130101 , H05K2201/1039320130101 , H05K2201/1026520130101 , H05K2203/16720130101
Abstract: The connector includes a sheet member having flexibility and insulating property, and including a fitting portion to be fitted to a counter connector and a mounting portion to be mounted on a mounting object, a flexible conductor disposed at least on a top surface of the sheet member, and a contact member and a positioning member disposed in the fitting portion of the sheet member, and the flexible conductor includes a first connection portion disposed in the fitting portion of the sheet member and electrically connected to the contact member, a second connection portion disposed in the mounting portion of the sheet member and to be electrically connected to the wiring portion of the mounting object, and a joint portion joining the first connection portion and the second connection portion to each other.
-
公开(公告)号:EP4174369B1
公开(公告)日:2024-08-28
申请号:EP21833384.7
申请日:2021-06-25
IPC: H01Q1/44 , H01Q13/10 , H05K1/02 , F21V23/04 , F21K9/00 , F21Y103/33 , F21Y115/10
CPC classification number: Y02B20/40 , H01Q1/44 , H01Q13/10 , F21K9/00 , F21Y2115/1020160801 , F21Y2103/3320160801 , F21V23/045 , H05K1/0237 , H05K2201/1009820130101 , H05K2201/0902720130101 , H05K2201/0906320130101 , H05K2201/1010620130101 , H05K2201/1028720130101 , H05K1/0207
-
公开(公告)号:EP4391736A1
公开(公告)日:2024-06-26
申请号:EP23212260.6
申请日:2023-11-27
Applicant: Northrop Grumman Systems Corporation
Inventor: ENGBRECHT, Edward , HARTMAN, Jeffrey , HACKLEY, Justin
CPC classification number: H05K2201/016220130101 , H05K1/0393 , H05K2201/1028720130101 , H05K2201/031420130101 , H05K2201/0975420130101 , H05K2201/1035620130101 , H05K3/0023 , H01B7/0823 , H05K1/115 , H05K3/4691 , H05K2203/30820130101 , H05K3/0041
Abstract: An electrical connection device is provided that includes a first electrical connector having first electrical contacts formed therein and a second electrical connector having second electrical contacts formed therein. A flexible silicon connector section connects the first electrical connector and the second electrical connector. The connector section includes flexible strands separated by slots, where the flexible strands are flexible in directions orthogonal to a longitudinal direction of the connector section. The flexible strands include metal traces deposited therein to provide an electrical connection between the first electrical connector and the second electrical connector.
-
公开(公告)号:EP4388624A1
公开(公告)日:2024-06-26
申请号:EP22859163.2
申请日:2022-08-18
Applicant: Vertiv IT Systems, Inc.
Inventor: BREWER, Jeffrey Alan , CONGER, Amanda , DE JESUS, Christopher , ERSKINE, Johnny Lee , O'BERRY, Joseph Michael , REEVES JR., Haralson Kerr , TUMLIN, Tony , WOOD, Christopher
CPC classification number: H01R12/53 , H01R13/56 , H05K1/111 , H05K2201/1035620130101 , H05K2201/1042420130101 , H05K2201/1028720130101 , H05K3/301 , H05K3/3405
-
公开(公告)号:EP3349550B1
公开(公告)日:2024-04-24
申请号:EP18151590.9
申请日:2018-01-15
CPC classification number: H01R43/0256 , H01R43/0263 , H05K1/117 , H05K3/301 , H05K3/303 , H05K3/3405 , H05K3/3421 , H05K2201/1028720130101 , H05K2203/016520130101 , H05K2203/027820130101 , H05K2203/16720130101
-
公开(公告)号:EP4174369B8
公开(公告)日:2024-10-09
申请号:EP21833384.7
申请日:2021-06-25
IPC: H01Q1/44 , H01Q13/10 , H05K1/02 , F21V23/04 , F21K9/00 , F21Y103/33 , F21Y115/10
CPC classification number: Y02B20/40 , H01Q1/44 , H01Q13/10 , F21K9/00 , F21Y2115/1020160801 , F21Y2103/3320160801 , F21V23/045 , H05K1/0237 , H05K2201/1009820130101 , H05K2201/0902720130101 , H05K2201/0906320130101 , H05K2201/1010620130101 , H05K2201/1028720130101 , H05K1/0207
-
公开(公告)号:EP4336975A3
公开(公告)日:2024-07-31
申请号:EP23191925.9
申请日:2023-08-17
Applicant: Huawei Digital Power Technologies Co., Ltd.
Inventor: TAO, Wei , WANG, Yuchuan , TANG, Qingguo , LIU, Wutao , XU, Shuguang
CPC classification number: H05K2201/1027220130101 , H05K2201/1028720130101 , H05K1/0263 , H05K3/3421 , H05K2201/09520130101 , H05K2203/04920130101 , H05K1/18 , H05K2201/021520130101 , H05K2201/030520130101
Abstract: This application relates to the field of electronic device technologies, and provides a circuit board assembly and an electronic device, to resolve a problem that a circuit board assembly has poor current-carrying performance and is not easy to manufacture. The circuit board assembly provided in this application may include a circuit board and a conductive plate. The circuit board includes a substrate and a conductive trace. The conductive trace is disposed on the substrate. The conductive plate is fastened in a first region of the circuit board, and a current-carrying capacity of the conductive plate is greater than that of the conductive trace. In the circuit board assembly provided in this application, the conductive plate capable of carrying a relatively large operating current is provided to significantly improve a current-carrying capability of the circuit board assembly, so that the circuit board assembly can be applied to a scenario requiring a relatively large current; and the conductive plate and the circuit board are manufactured separately, and then, the conductive plate is disposed in the first region of the circuit board, to implement a fastened connection between the conductive plate and the circuit board. Therefore, manufacturing costs and process difficulty are reduced, and low-cost and batch manufacturing is implemented.
-
公开(公告)号:EP3697182B1
公开(公告)日:2024-06-26
申请号:EP19855897.5
申请日:2019-08-08
CPC classification number: H01R12/58 , H05K3/366 , H05K2201/1029520130101 , H05K2201/0903620130101 , H05K2203/019520130101 , H05K2201/1036320130101 , H05K1/148 , H05K2201/1028720130101 , H05K2203/144620130101 , H05K2201/1075720130101 , H05K2201/094920130101 , H01R12/52 , Y02E60/10
-
-
-
-
-
-
-
-