CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE

    公开(公告)号:EP4336975A3

    公开(公告)日:2024-07-31

    申请号:EP23191925.9

    申请日:2023-08-17

    Abstract: This application relates to the field of electronic device technologies, and provides a circuit board assembly and an electronic device, to resolve a problem that a circuit board assembly has poor current-carrying performance and is not easy to manufacture. The circuit board assembly provided in this application may include a circuit board and a conductive plate. The circuit board includes a substrate and a conductive trace. The conductive trace is disposed on the substrate. The conductive plate is fastened in a first region of the circuit board, and a current-carrying capacity of the conductive plate is greater than that of the conductive trace. In the circuit board assembly provided in this application, the conductive plate capable of carrying a relatively large operating current is provided to significantly improve a current-carrying capability of the circuit board assembly, so that the circuit board assembly can be applied to a scenario requiring a relatively large current; and the conductive plate and the circuit board are manufactured separately, and then, the conductive plate is disposed in the first region of the circuit board, to implement a fastened connection between the conductive plate and the circuit board. Therefore, manufacturing costs and process difficulty are reduced, and low-cost and batch manufacturing is implemented.

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