公开(公告)号：WO2021201902A1

公开(公告)日：2021-10-07

申请号：PCT/US2020/038840

申请日：2020-06-20

Applicant: WESTERN DIGITAL TECHNOLOGIES, INC.

Inventor： CHEW, David W.

IPC: G11B33/12 ,  H05K1/18 ,  G11B21/02 ,  G11B23/087 ,  G11B25/06 ,  G06F13/40 ,  G06F1/18 ,  G11B15/1808 ,  G11B15/1883 ,  G11B15/32 ,  G11B5/00813 ,  G11B5/00817 ,  G11B5/4893 ,  H01R12/716 ,  H05K2201/10159 ,  H05K2201/10189 ,  H05K2201/10545

Abstract: A storage system can include a first tape storage drive (TSD), a second TSD, and a printed circuit board assembly (PCBA) where the first and second TSD are coupled back-to-back, with the PCBA between the two. The first TSD can include a first enclosure, a first head assembly, a first actuator, and a first connector. The second TSD can include a second enclosure, a second head assembly, a second actuator, and a second connector. The PCBA can include a first side having a first mating connector configured to connect to the first connector for the first TSD, a second side opposite the first side, the second side having a second mating connector configured to connect to the second connector for the second TSD, and a controller configured to control activation of the first actuator of the first TSD and the second actuator of the second TSD.

公开(公告)号：WO2021146284A8

公开(公告)日：2021-07-22

申请号：PCT/US2021/013238

申请日：2021-01-13

Applicant: KEMET ELECTRONICS CORPORATION

Inventor： BULTITUDE, John ,  BLAIS, Peter Alexandre ,  BURK, James A. ,  MILLER, Galen W. ,  HAYES, Hunter ,  TEMPLETON, Allen ,  JONES, Lonnie G. ,  LAPS, Mark, R.

IPC: H01G4/38 ,  H01L23/488 ,  H01L23/498 ,  H05K1/18 ,  H05K7/14 ,  H01G4/224 ,  H01G4/228 ,  H01G4/30 ,  H01L25/072 ,  H01L29/1608 ,  H01L29/2003 ,  H05K1/0204 ,  H05K1/0259 ,  H05K1/0272 ,  H05K1/145 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/10166 ,  H05K2201/10545 ,  H05K3/328

Abstract: Provided is an improved electronic component package. The electronic component package comprises a multiplicity of electronic components wherein each electronic component comprises a first external termination and a second external termination. The electronic component package also includes a structural lead frame comprising multiple leads wherein each lead is mounted to at least one first external termination and the structural lead frame comprises at least one break away feature between adjacent leads.

公开(公告)号：WO2021146284A1

公开(公告)日：2021-07-22

申请号：PCT/US2021/013238

申请日：2021-01-13

Applicant: KEMET ELECTRONICS CORPORATION

Inventor： BULTITUDE, John ,  BLAIS, Peter Alexandre ,  BURK, James A. ,  MILLER, Galen W. ,  HAYES, Hunter ,  TEMPLETON, Allen ,  JONES, Lonnie G. ,  LAPS, Mark, R.

IPC: H01G4/38 ,  H01L23/488 ,  H01L23/498 ,  H05K1/18 ,  H05K7/14 ,  H01G4/30 ,  H01L25/072 ,  H01L29/1608 ,  H01L29/2003 ,  H05K1/0272 ,  H05K1/145 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/10166 ,  H05K2201/10545 ,  H05K3/328

Abstract: Provided is an improved electronic component package. The electronic component package comprises a multiplicity of electronic components wherein each electronic component comprises a first external termination and a second external termination. The electronic component package also includes a structural lead frame comprising multiple leads wherein each lead is mounted to at least one first external termination and the structural lead frame comprises at least one break away feature between adjacent leads.

公开(公告)号：WO2021262920A2

公开(公告)日：2021-12-30

申请号：PCT/US2021/038799

申请日：2021-06-24

Applicant: CREE, INC.

Inventor： LIM, Kwangmo Chris ,  NOORI, Basim ,  MU, Qianli ,  MARBELL, Marvin ,  SHEPPARD, Scott ,  KOMPOSCH, Alexander

IPC: H01L23/66 ,  H01L23/482 ,  H03F3/19 ,  H05K1/02 ,  H01L23/498 ,  H01L23/538 ,  H01L29/20 ,  H01L29/423 ,  H01L29/778 ,  H03F3/72 ,  H01L2223/6644 ,  H01L2223/6655 ,  H01L2223/6683 ,  H01L2223/6688 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05568 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/17107 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32227 ,  H01L2224/32235 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83102 ,  H01L2224/83104 ,  H01L2224/83191 ,  H01L2224/83805 ,  H01L2224/92125 ,  H01L23/047 ,  H01L23/4334 ,  H01L23/4824 ,  H01L23/492 ,  H01L23/49531 ,  H01L23/49827 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/83 ,  H01L29/2003 ,  H01L29/4175 ,  H01L29/41758 ,  H01L29/42316 ,  H01L29/7786 ,  H01L2924/1421 ,  H01L2924/161 ,  H01L2924/171 ,  H01L2924/181 ,  H01L2924/19107 ,  H03F1/0288 ,  H03F1/526 ,  H03F2200/451 ,  H03F3/195 ,  H03F3/211 ,  H05K1/0243 ,  H05K1/113 ,  H05K2201/09627 ,  H05K2201/09636 ,  H05K2201/10545 ,  H05K3/3415 ,  H05K3/3442

Abstract: RF transistor amplifiers include an RF transistor amplifier die having a Group III nitride-based semiconductor layer structure and a plurality of gate terminals, a plurality of drain terminals, and at least one source terminal that are each on an upper surface of the semiconductor layer structure, an interconnect structure on an upper surface of the RF transistor amplifier die, and a coupling element between the RF transistor amplifier die and the interconnect structure that electrically connects the gate terminals, the drain terminals and the source terminal to the interconnect structure.

公开(公告)号：WO2021146270A2

公开(公告)日：2021-07-22

申请号：PCT/US2021/013217

申请日：2021-01-13

Applicant: KEMET ELECTRONICS CORPORATION

Inventor： BULTITUDE, John ,  BLAIS, Peter, Alexandre ,  BURK, James, A. ,  MILLER, Galen, W. ,  HAYES, Hunter ,  TEMPLETON, Allen ,  JONES, Lonnie, G. ,  LAPS, Mark, R.

IPC: H01L23/495 ,  H05K1/11 ,  H05K3/46 ,  H01G4/30 ,  H01G4/224 ,  H01G4/228 ,  H01G4/38 ,  H01L25/072 ,  H01L29/1608 ,  H01L29/2003 ,  H05K1/0272 ,  H05K1/145 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/10166 ,  H05K2201/10545 ,  H05K3/328

Abstract: Provided is a high-density multi-component package comprising a first module interconnect pad and a second module interconnect pad. At least two electronic components are mounted to and between the first module interconnect pad and the second module interconnect pad wherein a first electronic component is vertically oriented relative to the first module interconnect pad. A second electronic component is vertically oriented relative to the second module interconnect pad.

公开(公告)号：WO2021126917A1

公开(公告)日：2021-06-24

申请号：PCT/US2020/065231

申请日：2020-12-16

Applicant: PULSE BIOSCIENCES, INC.

Inventor： HUANG, Chaofeng ,  SCHAADT, Gregory ,  KRIEG, Kenneth

IPC: H03K3/57 ,  A61N1/0472 ,  A61N1/36034 ,  H01F2027/2833 ,  H01F27/24 ,  H01F27/2823 ,  H03K3/353 ,  H05K1/181 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/10545

Abstract: Described herein are apparatuses and methods for applying high voltage, sub-microsecond (e.g., nanosecond range) pulsed output to a biological material, e.g., tissues, cells, etc., using a high voltage (e.g., MOSFET) gate driver circuit having a high voltage isolation and a low inductance. In particular, described herein are multi-core pulse transformers comprising independent transformer cores arranged in parallel, in some variations they may be on opposite sides of a substrate. The transformer cores may have coaxial primary and secondary windings. Also describe are pulse generators including multi-core pulse transformers arranged in parallel (e.g., on opposite sides of a PCB) to reduce MOSFET driver gate inductance.