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公开(公告)号：US10407300B2
公开(公告)日：2019-09-10
申请号：US15554652
申请日：2015-12-14
Applicant: Goertek.Inc
Inventor： Guoguang Zheng
Abstract: An integrated structure of an MEMS pressure sensor and an MEMS inertia sensor are provided, comprising: an insulating layer formed on a substrate, a first lower electrode and a second lower electrode both formed on the insulating layer, further comprising a first upper electrode forming an air pressure-sensitive capacitor together with the first lower electrode, and a second upper electrode forming a reference capacitor together with the second lower electrode; further comprising an inertia-sensitive structure supported above the substrate by a third support part, and a fixed electrode plate forming an inertia detecting capacitor of an inertia sensor together with the inertia-sensitive structure; and a cover body which packages the inertia detecting capacitor composed of the inertia-sensitive structure and the fixed electrode plate on the substrate.
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公开(公告)号：US10277985B2
公开(公告)日：2019-04-30
申请号：US15542858
申请日：2015-11-18
Applicant: Goertek.Inc
Inventor： Zhibing Zhang , Gang Chen
Abstract: The present invention discloses a speaker module. The speaker module comprises an inner cavity defined by a shell, and a first induction coil. A single speaker piece is provided in the inner cavity of the shell, the first induction coil is configured to be electrically connected with a terminal device, and a second induction coil, which corresponds to the first induction coil and is configured to be electrically connected with a voice coil in the single speaker piece, is also provided on the shell. According to the speaker module, an output end of a complete machine and the voice coil are conducted through the first induction coil and the second induction coil; and by the adoption of such a structure, the space of the module can be greatly saved, and a lighter and thinner complete machine can be developed. In addition, the problems, such as poor performance due to the change of the resistance value in a traditional electro-acoustic connection way, can be solved. By the adoption of the structure, the first induction coil is allowed to be provided outside the inner cavity, the shell can be sealed at a time, wiring from the outside to the inside is not needed any more. In this way, secondary sealing of a lead position is avoided, production and transportation of the speaker module are greatly simplified, and assembly between the speaker module and the terminal device is also greatly simplified.
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公开(公告)号：US10250969B2
公开(公告)日：2019-04-02
申请号：US15540421
申请日：2015-12-17
Applicant: Goertek.Inc
Inventor： Zhibing Zhang , Gang Chen , Shuangshuang Fan
Abstract: An air valve and a speaker are provided. The air valve comprises a valve body, an elastic valve plate, an air inlet penetrating through an inner surface and an outer surface of the valve body, and an air outlet penetrating through an inner surface and an outer surface of the valve plate. The valve plate is connected with the valve body in a sealing manner to form an annular sealing area encircling the air outlet and the air inlet, and the inner surface of the valve body covers the air outlet, and/or the inner surface of the valve plate covers the air inlet. The speaker is provided with or incorporates the air valve. The air valve can be opened or closed via elastic deformation of the valve plate of the air valve.
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公开(公告)号：US20180275002A1
公开(公告)日：2018-09-27
申请号：US15553093
申请日：2016-11-04
Applicant: GOERTEK.INC
Inventor： Li-Te WU , Ching-Tzung LIN , Ssu-Ying CHEN
Abstract: The present invention discloses a signal processing device, an air pressure sensor assembly and an electronics apparatus. The signal processing device for a sensing signal comprises: an input unit, which is configured to receive the sensing signal; and a processing unit, which is configured to attenuate a higher frequency component of the sensing signal so that the value of the higher frequency component when the sensing signal is stable is lower than that when the sensing signal is changing. According to an embodiment of this invention, the present invention can reduce the noise in a sensing signal from an air pressure sensor during a stable state.
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公开(公告)号：US20180054669A1
公开(公告)日：2018-02-22
申请号：US15554623
申请日：2015-12-10
Applicant: GOERTEK.INC
Inventor： Guoguang ZHENG
Abstract: The present invention discloses a package structure of a MEMS microphone. The package structure comprises a package substrate and a package shell, wherein the package shell is provided on the package substrate and forms a closed cavity with the package substrate. In the package structure provided by the present invention, the sound-absorbing layer is arranged on the inner wall of the Helmholtz resonant cavity. The sound-absorbing layer has a certain absorption capacity to high-frequency sound waves, but has a very low absorption to low-frequency sound waves, so it may be equivalent to a “low-pass filter”. Through the absorption of the high-frequency sound waves, a high-frequency amplitude value of sound waves can be suppressed, reducing high-frequency response of the Helmholtz resonant cavity. That is, a high-frequency cut-off frequency of the sound waves is improved, widening operation bandwidth of the MEMS microphone.
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Patent Agency Ranking
公开(公告)号：US20180020273A1
公开(公告)日：2018-01-18
申请号：US15540180
申请日：2015-12-09
Applicant: Goertek.Inc
Inventor： Zhenjun Li , Gang Chen , Yun Yang
CPC classification number: H04R1/02 , H04M1/035 , H04R1/2853 , H04R1/2888
Abstract: A protective apparatus for sound-absorbing particles (4) in a sounding apparatus, comprising a housing (1) and a rear acoustic cavity formed inside the housing (1). The rear acoustic cavity is filled with sound-absorbing particles (4). A sound circulation channel (5) communicating the rear acoustic cavity with the outside is provided on the housing (1). A sound transmission layer (3) used for preventing the sound-absorbing particles (4) from being exposed covers an entrance of the sound circulation channel (5). The sound transmission layer (3) of the protective apparatus separates the sound circulation channel (5) from the rear acoustic cavity, such that airflow in the rear acoustic cavity passes through the sound transmission layer (3) and then flows out of the sound circulation channel (5). Configuration of the sound transmission layer (3) can hinder the sound-absorbing particles (4), prevent the sound-absorbing particles (4) from entering the sound circulation channel (5), and do not influence outflow of airflow. The problem in the prior art that sound-absorbing particles (4) are easily exposed or block a sound circulation channel (5) is solved, and the quality of a sounding apparatus is ensured.
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公开(公告)号：US20180014127A1
公开(公告)日：2018-01-11
申请号：US15542858
申请日：2015-11-18
Applicant: Goertek.Inc
Inventor： Zhibing ZHANG , Gang CHEN
CPC classification number: H04R9/06 , H04R1/025 , H04R7/127 , H04R9/025 , H04R9/045 , H04R9/046 , H04R31/006 , H04R2499/11
Abstract: The present invention discloses a speaker module. The speaker module comprises an inner cavity defined by a shell, and a first induction coil. A single speaker piece is provided in the inner cavity of the shell, the first induction coil is configured to be electrically connected with a terminal device, and a second induction coil, which corresponds to the first induction coil and is configured to be electrically connected with a voice coil in the single speaker piece, is also provided on the shell. According to the speaker module, an output end of a complete machine and the voice coil are conducted through the first induction coil and the second induction coil; and by the adoption of such a structure, the space of the module can be greatly saved, and a lighter and thinner complete machine can be developed. In addition, the problems, such as poor performance due to the change of the resistance value in a traditional electro-acoustic connection way, can be solved. By the adoption of the structure, the first induction coil is allowed to be provided outside the inner cavity, the shell can be sealed at a time, wiring from the outside to the inside is not needed any more. In this way, secondary sealing of a lead position is avoided, production and transportation of the speaker module are greatly simplified, and assembly between the speaker module and the terminal device is also greatly simplified.
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公开(公告)号：US20170332161A1
公开(公告)日：2017-11-16
申请号：US15521151
申请日：2015-01-05
Applicant: Goertek.Inc
Inventor： Guanxun QIU , Qinglin SONG
CPC classification number: H04R1/083 , H04R1/02 , H04R19/005 , H04R19/04 , H04R2201/003
Abstract: The present invention discloses a microphone, comprises: a silicon substrate; a diaphragm disposed over the silicon substrate; a backplate disposed over the diaphragm, the backplate having a plurality of through holes formed therein and a barrier structure, and the plurality of through holes being arranged in a through hole pattern on the backplate; the barrier structure having one or more protruding portions extending from at least one part of the through hole wall of the barrier structure, thereby the section shape of at least one through hole being an irregular shape with one or more inwardly concave portion. The microphone provided by the present invention can achieve a better dustproof effect.
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公开(公告)号：US20170280218A1
公开(公告)日：2017-09-28
申请号：US15505001
申请日：2014-08-27
Applicant: Goertek.Inc
Inventor： Zhe Wang , Quanbo Zou , Jifang Tao
CPC classification number: H04R1/083 , H04R1/023 , H04R3/007 , H04R19/005 , H04R19/016 , H04R19/04 , H04R2201/003
Abstract: The disclosure provides a MEMS device. The MEMS device comprises a printed circuit board, a cover attached to the printed circuit board to form a housing, at least one sound hole formed in the housing, a transducer with a diaphragm inside the housing, and at least one shutter structure. Each shutter structure is mounted to the housing around a respective sound hole. Each shutter structure comprises a moveable component disposed near the inner surface of the housing, the moveable component remains at an open position under regular pressure such that an air flow path from the sound hole to the at least one ventilation hole of the substrate across the moveable component is opened, and moves to a first closed position under a high external pressure to block the at least one ventilation hole and close the air flow path.
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公开(公告)号：US10533911B2
公开(公告)日：2020-01-14
申请号：US15553093
申请日：2016-11-04
Applicant: GOERTEK.INC
Inventor： Li-Te Wu , Ching-Tzung Lin , Ssu-Ying Chen
Abstract: The present invention discloses a signal processing device, an air pressure sensor assembly and an electronics apparatus. The signal processing device for a sensing signal comprises: an input unit, which is configured to receive the sensing signal; and a processing unit, which is configured to attenuate a higher frequency component of the sensing signal so that the value of the higher frequency component when the sensing signal is stable is lower than that when the sensing signal is changing. According to an embodiment of this invention, the present invention can reduce the noise in a sensing signal from an air pressure sensor during a stable state.
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