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公开(公告)号：US20250151201A1
公开(公告)日：2025-05-08
申请号：US18883882
申请日：2024-09-12
Applicant: Liquid Wire Inc.
Inventor： Mark William Ronay , Trevor Antonio Rivera , Michael Adventure Hopkins , Katherine M. Nelson , Charles J. Kinzel
Abstract: A flexible hybrid electronic system includes a first structure electrically coupled to a second structure through a via. The first structure includes a first flexible substrate, a first electronic component secured to the first flexible substrate, and a first flexible conductive trace formed in part from a fluid phase conductor and enclosed within the first flexible substrate. The second structure includes a second flexible substrate, a second electronic component secured to the second flexible substrate, and a second flexible conductive trace formed in part from the fluid phase conductor and enclosed within the second flexible substrate. The via is filled with a conductive medium and extends between and electrically couples the first flexible conductive trace to the second flexible conductive trace. The first structure is bonded to the second structure at an interconnect region and the via is located within the interconnect region.
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公开(公告)号：US20250016931A1
公开(公告)日：2025-01-09
申请号：US18292757
申请日：2022-07-29
Applicant: Liquid Wire Inc.
Inventor： Trevor Antonio Rivera , Michael Adventure Hopkins , Mark William Ronay
Abstract: Devices, systems, and methods include a substrate layer, a metal layer coupled to the substrate layer, an encapsulant coupled to the substrate layer and the metal layer, and a stencil-in-place structure. The encapsulant is configured to electrically isolate the metal layer from environmental conditions. The stencil-in-place structure includes a stencil substrate and conductive gel secured within a channel and a via formed by the stencil substrate, the conductive gel electrically coupled to the metal layer.
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公开(公告)号：US20240418495A1
公开(公告)日：2024-12-19
申请号：US18701705
申请日：2022-10-21
Applicant: Liquid Wire Inc.
Inventor： Casey Culbertson , Mark William Ronay , Michael Adventure Hopkins
IPC: G01B7/16
Abstract: A strain sensor system and method include a strain sensor, an electronic parameter sensor, and a processor. The strain sensor includes a medium, a plurality of reference points positioned at different locations on the medium, and a plurality of conductive traces formed from conductive gel. At least two of the plurality of conductive traces are operatively coupled to each of the plurality of reference points. Each of the plurality of conductive traces has an electronic property equivalent to a length thereof. The medium and the conductive traces are configured to deform in response to a force placed on the strain sensor, wherein the deformation causes at least one of the plurality of traces to change length. The processor is configured to determine a relative location of each of the plurality of reference points based, at least in part, on the electronic property of each of the plurality of conductive traces.
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公开(公告)号：US11880498B2
公开(公告)日：2024-01-23
申请号：US17645621
申请日：2021-12-22
Applicant: Liquid Wire Inc.
Inventor： Sydney Steinmeyer Bright , Andrew Elliott
CPC classification number: G06F3/011 , G06F3/0202
Abstract: A human interface device may include a deformable body having a handle portion, and a deformable conductor coupled to the deformable body and arranged to deform in response to a physical manipulation of the deformable body. The physical manipulation may include compressing, flexing, twisting, and/or stretching at least a portion of the deformable body. The deformable conductor may be arranged to change an electric characteristic such as a resistance, capacitance and/or inductance in response to the physical manipulation. The deformable conductor may include a sensor portion, and a transmission portion. The sensor portion may sense a first type of physical manipulation, and the transmission portion may sense a second type of physical manipulation.
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公开(公告)号：US20240021337A1
公开(公告)日：2024-01-18
申请号：US18256257
申请日：2021-12-10
Applicant: Liquid Wire Inc.
Inventor： Jesse Michael Martinez , Micheal Adventure Hopkins , Charles J. Kinzel , Trevor Antonio Rivera , Mark William Ronay , Edward Martin Godshalk
CPC classification number: H01B1/22 , H01B7/0027 , H01B3/48 , H01B3/40 , H01B13/0036 , H01B19/04
Abstract: Systems, structures, and methods include a structure formed from a plurality of layers of matrix material. A bus is secured between adjacent layers of the plurality of layers of the matrix material. The bus includes a conductive gel configured to propagate an electrical signal through the structure.
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Patent Agency Ranking
公开(公告)号：US20230361445A1
公开(公告)日：2023-11-09
申请号：US18299215
申请日：2023-04-12
Applicant: Liquid Wire Inc.
Inventor： Mark Ronay , Edward Godshalk
CPC classification number: H01P3/06 , H01P11/005
Abstract: A conductive assembly may include a deformable substrate disposed around an axis, and a deformable conductor arranged on the deformable substrate. The substrate may be arranged to form a channel along the axis, and the deformable conductor may be arranged on the deformable substrate to form a waveguide. The deformable substrate, the first deformable conductor, and a second deformable conductor may be arranged to form a microstrip or a coaxial transmission line. A deformable transmission line may include a deformable substrate arranged in a substantially enclosed channel around an axis, a first deformable conductor arranged in a trace along the axis of the deformable substrate, and a second deformable conductor arranged on the deformable substrate to form a reference conductor for the first deformable conductor. A method of fabricating a deformable conductive assembly may include forming a deformable conductor on a deformable substrate, and disposing the deformable substrate around an axis.
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公开(公告)号：US11664565B1
公开(公告)日：2023-05-30
申请号：US16868522
申请日：2020-05-06
Applicant: Liquid Wire Inc.
Inventor： Mark Ronay , Edward Godshalk
CPC classification number: H01P3/06 , H01P11/005
Abstract: A conductive assembly may include a deformable substrate disposed around an axis, and a deformable conductor arranged on the deformable substrate. The substrate may be arranged to form a channel along the axis, and the deformable conductor may be arranged on the deformable substrate to form a waveguide. The deformable substrate, the first deformable conductor, and a second deformable conductor may be arranged to form a microstrip or a coaxial transmission line. A deformable transmission line may include a deformable substrate arranged in a substantially enclosed channel around an axis, a first deformable conductor arranged in a trace along the axis of the deformable substrate, and a second deformable conductor arranged on the deformable substrate to form a reference conductor for the first deformable conductor. A method of fabricating a deformable conductive assembly may include forming a deformable conductor on a deformable substrate, and disposing the deformable substrate around an axis.
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公开(公告)号：US11594480B2
公开(公告)日：2023-02-28
申请号：US17395130
申请日：2021-08-05
Applicant: Liquid Wire Inc.
Inventor： Mark William Ronay , Trevor Antonio Rivera , Michael Adventure Hopkins , Edward Martin Godshalk , Charles J. Kinzel
IPC: H01L23/498 , H01L23/31 , H01L21/48
Abstract: A circuit assembly may include a substrate and a pattern of contact points formed from deformable conductive material supported by the substrate. The assembly may further include an electric component supported by the substrate and having terminals arranged in a pattern corresponding to the pattern of contacts points. The one or more of the terminals of the electric component may contact one or more of the corresponding contact points to form one or more electrical connections between the electric component and the contact points.
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公开(公告)号：US12238870B2
公开(公告)日：2025-02-25
申请号：US17151092
申请日：2021-01-15
Applicant: Liquid Wire Inc.
Inventor： Jorge E. Carbo, Jr. , Trevor Antonio Rivera
IPC: H05K3/12
Abstract: A method may include providing a fluid material, solidifying the fluid material, providing a substrate, and depositing the solidified fluid material on the substrate. Providing the fluid material may include providing a mold, and filling the mold with the fluid material. Solidifying the fluid material may include solidifying the fluid material in a mold, and removing the solidified fluid material from the mold. Providing the substrate may include preparing the substrate for deposition of the solidified fluid material, and adjusting the temperature of the substrate. Depositing the solidified fluid material on the substrate may include fixturing the substrate, and loading the solidified fluid material in a deposition tool. The fluid material may include a liquid phase component, and a solid phase component. The solid phase component may include particles suspended in the liquid phase component. The liquid phase component may include a gallium alloy.
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公开(公告)号：US20240431077A1
公开(公告)日：2024-12-26
申请号：US18823089
申请日：2024-09-03
Applicant: Liquid Wire Inc.
IPC: H05K7/20
Abstract: A thermal interface applique and system includes a containment structure and conductive gel. The containment structure has an adhesive property and a first thermal coefficient. The conductive gel is configured to thermally couple a heat source to a heatsink. The adhesive property of the containment structure is configured to adhere at least one of the heat source and the heatsink to the containment structure
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