公开(公告)号：US20170094772A1

公开(公告)日：2017-03-30

申请号：US14865291

申请日：2015-09-25

Applicant: Intel Corporation

Inventor： Paul J. Gwin ,  Brian J. Long

IPC: H05K1/02 ,  H05K5/02 ,  H05K5/00

CPC classification number: H05K1/0204 ,  G06F1/181 ,  G06F1/203

Abstract: Electronic devices and housings for such devices are described and claimed.

公开(公告)号：US20190215964A1

公开(公告)日：2019-07-11

申请号：US16327435

申请日：2016-09-27

Applicant: Intel Corporation

Inventor： Brian J. Long

IPC: H05K1/18 ,  H05K1/14 ,  H05K1/11 ,  H05K3/34 ,  H05K3/40 ,  H05K3/36 ,  H05K3/28

CPC classification number: H05K1/186 ,  H01R12/721 ,  H05K1/111 ,  H05K1/117 ,  H05K1/141 ,  H05K1/181 ,  H05K1/185 ,  H05K3/284 ,  H05K3/34 ,  H05K3/368 ,  H05K3/4015 ,  H05K2201/042 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10159 ,  H05K2201/10378 ,  H05K2201/10545 ,  H05K2201/10734 ,  H05K2203/0228 ,  H05K2203/107 ,  H05K2203/1316 ,  H05K2203/1327

Abstract: Aspects of the disclosure are directed to an edge card that includes a printed circuit board having a top side and a bottom side. The top side of the printed circuit board can include one or more top-side circuit components, and a plurality of top-side metal contact fingers, at least some of the top-side metal contact fingers electrically connected to at least one of the one or more circuit components. The bottom side of the printed circuit board can include one or more bottom-side circuit components. The bottom side of the printed circuit board can also include a substrate interposer having a top side and a bottom side. The top side of the substrate interposer can include one or more passive circuit components at least partially embedded in the substrate interposer, and one or more solder balls arranged around the one or more passive circuit components.

公开(公告)号：US09867276B2

公开(公告)日：2018-01-09

申请号：US14865291

申请日：2015-09-25

Applicant: Intel Corporation

Inventor： Paul J. Gwin ,  Brian J. Long

IPC: H05K5/00 ,  H05K1/02 ,  G06F1/18 ,  G06F1/20

CPC classification number: H05K1/0204 ,  G06F1/181 ,  G06F1/203

Abstract: Electronic device and housing for such devices are described and claimed. In one example a housing comprises a first end cap dimensioned to fit within a first open end of the housing and comprising a first bracket having a first cam surface positioned to engage the second surface of the printed circuit board when the first end cap is inserted into the first open end of the housing. Inserting the first end cap into the first open end of the housing causes the first cam surface to urge the printed circuit board in a direction which compresses the first heat generating component against an interior surface of the housing.

公开(公告)号：US10729000B2

公开(公告)日：2020-07-28

申请号：US16329200

申请日：2016-09-28

Applicant: Intel Corporation

Inventor： Brian J. Long

IPC: H05K1/11 ,  H05K1/18 ,  H05K3/30 ,  H05K7/02 ,  H05K7/10 ,  H01L23/48 ,  H01L23/49 ,  G06F1/20 ,  H05K1/02 ,  H01L23/367 ,  H01L23/40 ,  G06F1/18 ,  H05K1/14 ,  H05K3/36 ,  H05K7/20 ,  H01L23/498 ,  H01L23/427 ,  H01L23/00 ,  H01L23/538

Abstract: Aspects of the embodiments include an edge card and methods of making the same. The edge card can include a printed circuit board (PCB) comprising a first end and a second end, the first end comprising a plurality of metal contact fingers configured to interface with an edge connector, and the second end comprising a through-hole configured to mate with a post of a screw, the PCB further comprising an aperture proximate the second end of the PCB. The PCB can also include a thermal conduction element secured to the PCB, the thermal conduction element supporting an integrated circuit package, the integrated circuit package received by the aperture, wherein the thermal conduction element contacts the PCB proximate the through-hole and the thermal conduction element is configured to conduct heat from the integrated circuit towards the second portion of the printed circuit board.

公开(公告)号：US09871007B2

公开(公告)日：2018-01-16

申请号：US14866576

申请日：2015-09-25

Applicant: Intel Corporation

Inventor： John G. Meyers ,  Bilal Khalaf ,  Sireesha Gogineni ,  Brian J. Long

IPC: H01L23/02 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/58 ,  H01L21/52 ,  H01L21/66 ,  H01L25/065 ,  H01L25/00 ,  H01L23/13 ,  H01L25/16 ,  H01L23/31 ,  H01L23/498 ,  H01L23/00

CPC classification number: H01L23/585 ,  H01L21/52 ,  H01L22/32 ,  H01L22/34 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/16 ,  H01L25/50 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06572 ,  H01L2225/06593 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/1433 ,  H01L2924/1436 ,  H01L2924/15162 ,  H01L2924/15192 ,  H01L2924/1531 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/15333 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099

Abstract: Techniques and mechanisms to facilitate connection with one or more integrated circuit (IC) dies of a packaged device. In an embodiment, the packaged device includes a first substrate coupled to a first side of a package, and a second substrate coupled to a second side of the package opposite the first side. Circuitry, coupled via the first substrate to one or more IC dies disposed in the package, includes a circuit structure disposed at a cantilever portion of the first substrate. The cantilever portion extends past one or both of an edge of the first side and an edge of the second side. In another embodiment, a hardware interface disposed on the second substrate enables coupling of the packaged device to another device.

公开(公告)号：US11246217B2

公开(公告)日：2022-02-08

申请号：US16330043

申请日：2016-10-01

Applicant: Intel Corporation

Inventor： Brian J. Long

IPC: H05K1/14 ,  H01R12/73 ,  H01R12/71 ,  H01R12/72 ,  H01R13/66

Abstract: Electronic device package technology is disclosed. In one example, a connector for coupling an electronics sub-assembly to an electronics assembly includes a connector body. The connector body has a sub-assembly interface and a circuit board interface. The connector body has at least one passive electronic component that is necessary for operating the sub-assembly, thereby maximizing available space for computational components on the sub-assembly. The connector body can comprise two separate bodies wherein the passives are contained between the bodies. At least one extension cable can electrically couple the connector to the sub-assembly. A method of making an electronics assembly, capable of receiving a sub-assembly via a connector, comprises providing an assembly circuit board having an electrically coupled connector with at least one passive electronic component.

公开(公告)号：US10681817B2

公开(公告)日：2020-06-09

申请号：US16327435

申请日：2016-09-27

Applicant: Intel Corporation

Inventor： Brian J. Long

IPC: H05K1/11 ,  H05K1/18 ,  H05K1/14 ,  H05K3/40 ,  H05K3/28 ,  H05K3/34 ,  H05K3/36 ,  H01R12/72

Abstract: Aspects of the disclosure are directed to an edge card that includes a printed circuit board having a top side and a bottom side. The top side of the printed circuit board can include one or more top-side circuit components, and a plurality of top-side metal contact fingers, at least some of the top-side metal contact fingers electrically connected to at least one of the one or more circuit components. The bottom side of the printed circuit board can include one or more bottom-side circuit components. The bottom side of the printed circuit board can also include a substrate interposer having a top side and a bottom side. The top side of the substrate interposer can include one or more passive circuit components at least partially embedded in the substrate interposer, and one or more solder balls arranged around the one or more passive circuit components.

公开(公告)号：US11147153B2

公开(公告)日：2021-10-12

申请号：US16905587

申请日：2020-06-18

Applicant: Intel Corporation

Inventor： Brian J. Long

IPC: H05K1/02 ,  H05K1/09 ,  H05K1/11 ,  H05K1/18 ,  H05K3/30 ,  H05K3/36 ,  H05K7/10 ,  H05K7/20 ,  H01L23/00 ,  H01L23/12 ,  H01L23/13 ,  H01L23/22 ,  H01L23/24 ,  H01L23/28 ,  H01L23/31 ,  H01L23/34 ,  H01L23/36 ,  H01L23/40 ,  H01L23/48 ,  H01L23/498 ,  H01L23/552 ,  H01L23/367 ,  G06F1/18 ,  G06F1/20 ,  H05K1/14 ,  H01L23/427 ,  H01L23/538

Abstract: Aspects of the embodiments include an edge card and methods of making the same. The edge card can include a printed circuit board (PCB) comprising a first end and a second end, the first end comprising a plurality of metal contact fingers configured to interface with an edge connector, and the second end comprising a through-hole configured to mate with a post of a screw, the PCB further comprising an aperture proximate the second end of the PCB. The PCB can also include a thermal conduction element secured to the PCB, the thermal conduction element supporting an integrated circuit package, the integrated circuit package received by the aperture, wherein the thermal conduction element contacts the PCB proximate the through-hole and the thermal conduction element is configured to conduct heat from the integrated circuit towards the second portion of the printed circuit board.

公开(公告)号：US10937464B2

公开(公告)日：2021-03-02

申请号：US16480665

申请日：2017-03-17

Applicant: Intel Corporation

Inventor： Brian J. Long

IPC: G11B33/14 ,  H05K7/20 ,  G06F1/20 ,  G06F1/18

Abstract: A case suitable for solid state memory is described that offers enhanced cooling. In one example, a memory case includes a base, a cover having a plurality of fins on a top of the cover, channels between the fins, defined by the fins, and a ramp extending from a front on the top of the cover to the channels, and an inner cavity defined by the base and the cover to house a solid state memory.

公开(公告)号：US20200323076A1

公开(公告)日：2020-10-08

申请号：US16905587

申请日：2020-06-18

Applicant: Intel Corporation

Inventor： Brian J. Long

IPC: H05K1/02 ,  H01L23/367 ,  H01L23/40 ,  G06F1/18 ,  G06F1/20 ,  H05K1/14 ,  H05K1/18 ,  H05K3/36 ,  H05K7/20

Abstract: Aspects of the embodiments include an edge card and methods of making the same. The edge card can include a printed circuit board (PCB) comprising a first end and a second end, the first end comprising a plurality of metal contact fingers configured to interface with an edge connector, and the second end comprising a through-hole configured to mate with a post of a screw, the PCB further comprising an aperture proximate the second end of the PCB. The PCB can also include a thermal conduction element secured to the PCB, the thermal conduction element supporting an integrated circuit package, the integrated circuit package received by the aperture, wherein the thermal conduction element contacts the PCB proximate the through-hole and the thermal conduction element is configured to conduct heat from the integrated circuit towards the second portion of the printed circuit board.