公开(公告)号：US20180343739A1

公开(公告)日：2018-11-29

申请号：US15957246

申请日：2018-04-19

Applicant: REALTEK SEMICONDUCTOR CORP.

Inventor： CHAO-MIN LAI ,  SHOU-TE YEN

IPC: H05K1/11 ,  H05K1/14

CPC classification number: H05K1/115 ,  H05K1/0243 ,  H05K1/0248 ,  H05K1/113 ,  H05K1/114 ,  H05K1/144 ,  H05K1/181 ,  H05K3/3436 ,  H05K2201/09481 ,  H05K2201/10159 ,  H05K2201/10166 ,  H05K2201/10545 ,  H05K2201/10712 ,  H05K2201/10734

Abstract: An electronic apparatus and a circuit board thereof are provided. The electronic apparatus operates in cooperation with a packaged electronic component. The electronic apparatus includes a circuit board and a control device disposed on the circuit board. The circuit board includes a plurality of conductive vias passing therethrough, and the conductive vias includes a plurality of first conductive vias arranged respectively corresponding to the first contact pads of the packaged electronic component. The control device includes a signal contact array including a plurality of first signal contacts. When the packaged electronic component and the control device are respectively disposed on two opposite sides of the circuit board, the packaged electronic component and the control device at least partially overlap in a thickness direction of the circuit board, and the first signal contacts are respectively electrically connected to the first contact pads via the corresponding conductive vias.